1. An ultrasonic bonding apparatus used to manufacture an electronic device that includes a substrate, an electronic component, and an underfill that is filled in a space between the electronic component and the substrate, said ultrasonic bonding apparatus comprising:
a head that includes a tool surface configured to mount the electronic component;
a wiping unit configured to wipe out pre-cured underfill that has adhered to the tool surface of the head, by using a wiping member on a wiping table;
an ultrasonic bonding unit configured to ultrasonically bond the electronic component with the substrate and to press the head against the wiping member on the wiping table;
a detector configured to detect a first pressure applied between the wiping member on the wiping table and the tool surface when the wiping unit provides wiping; and
a controller configured to control a second pressure applied by the ultrasonic bonding unit, based on a detection result by the detector.
2. An ultrasonic bonding apparatus used to manufacture an electronic device that includes a substrate, an electronic component, and an underfill that is filled in a space between the electronic component and the substrate, said ultrasonic bonding apparatus comprising:
a head that includes a tool surface configured to mount the electronic component;
a wiping unit configured to wipe out pre-cured underfill that has adhered to the tool surface of the head, by using a wiping member on a wiping table, the wiping unit including a solvent supply unit configured to supply a solvent configured to powder the underfill, to the wiping member on the wiping table;
an ultrasonic bonding unit configured to ultrasonically bond the electronic component with the substrate and to press the head against the wiping member on the wiping table;
a detector configured to detect a pressure applied between the wiping member on the wiping table and the tool surface when the wiping unit provides wiping; and
a controller configured to control a solvent supply amount by the solvent supply unit, based on a detection result by the detector.
3. An ultrasonic bonding apparatus used to manufacture an electronic device that includes a substrate, an electronic component, and an underfill that is filled in a space between the electronic component and the substrate, said ultrasonic bonding apparatus comprising:
a head that includes a tool surface configured to mount the electronic component;
a wiping unit configured to wipe out pre-cured underfill that has adhered to the tool surface of the head, by using a wiping member on a wiping table, the wiping unit including a feed mechanism that includes a motor and is configured to supply the wiping member to the wiping table and to roll up the wiping member from the wiping table;
an ultrasonic bonding unit configured to ultrasonically bond the electronic component with the substrate;
a detector configured to detect a variation of a torque of the motor; and
a controller configured to determine whether a residual amount of the wiping member is sufficient, based on a detection result by the detector.
4. An ultrasonic bonding apparatus used to manufacture an electronic device that includes a substrate, an electronic component, and an underfill that is filled in a space between the electronic component and the substrate, said ultrasonic bonding apparatus comprising:
a head that includes a tool surface configured to mount the electronic component;
a wiping unit configured to wipe out pre-cured underfill that has adhered to the tool surface of the head, by using a wiping member on a wiping table;
an ultrasonic bonding unit configured to ultrasonically bond the electronic component with the substrate;
a detector configured to detect a dirt state on the tool surface by taking an image of a surface of the electronic component that has been bonded with the substrate; and
a controller configured to control wiping timing by the wiping unit, based on a detection result by the detector.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method for manufacturing a semiconductor device, the method comprising:
(a) performing an inspection using an evaluation element formed on a scribe line of a semiconductor wafer;
(b) marking a character on the semiconductor wafer, the character representing information based on a result obtained in step (a); and
(c) performing a step subsequent to step (b) while using the information represented by the character marked in step (b).
2. The method for manufacturing a semiconductor device according to claim 1, wherein
step (b) is a step where the semiconductor wafer closer to a standard value is ranked more highly on the basis of a result obtained in step (a) and where a character representing information indicating the ranking is marked on the semiconductor wafer.
3. The method for manufacturing a semiconductor device according to claim 1, wherein
step (c) is one of a probe inspection step and an assembly step.
4. The method for manufacturing a semiconductor device according to claim 3, wherein
if the information represented by the character is information indicating the semiconductor wafer ranked more highly in the ranking due to being closer the standard value, the probe inspection step is a step of performing a probe inspection using a simple probe inspection program.
5. The method for manufacturing a semiconductor device according to claim 3, wherein
if the information represented by the character is information indicating the semiconductor wafer ranked more lowly in the ranking due to being more distant from the standard value, the probe inspection step is a step of performing a probe inspection using an auxiliary probe inspection program.
6. The method for manufacturing a semiconductor device according to claim 3, wherein
if the information represented by the character is information indicating the semiconductor wafer ranked more highly in the ranking due to being closer to the standard value, the semiconductor device is assembled in the assembly step as a first product that is required to have high quality, and
if the information represented by the character is information indicating the semiconductor wafer ranked more lowly in the ranking due to being more distant from the standard value, the semiconductor device is assembled in the assembly step as a second product that is required to have quality lower than quality of the first product.
7. A method for manufacturing a semiconductor device, the method comprising:
(a) performing an inspection using an evaluation element formed on a scribe line of a semiconductor wafer; and
(b) performing a step subsequent to step (a) while using information based on a result obtained in step (a).
8. The method for manufacturing a semiconductor device according to claim 7, wherein
the information is information indicating ranking where the semiconductor wafer closer to a standard value is ranked more highly on the basis of a result obtained in step (a).
9. The method for manufacturing a semiconductor device according to claim 7, wherein
step (b) is one of a probe inspection step and an assembly step.
10. The method for manufacturing a semiconductor device according to claim 9, wherein
if the information is information indicating the semiconductor wafer ranked more highly in the ranking due to being closer the standard value, the probe inspection step is a step of performing a probe inspection using a simple probe inspection program.
11. The method for manufacturing a semiconductor device according to claim 9, wherein
if the information is information indicating the semiconductor wafer ranked more lowly in the ranking due to being more distant from the standard value, the probe inspection step is a step of performing a probe inspection using an auxiliary probe inspection program.
12. The method for manufacturing a semiconductor device according to claim 9, wherein
if the information is information indicating the semiconductor wafer ranked more highly in the ranking due to being closer to the standard value, the semiconductor device is assembled in the assembly step as a first product that is required to have high quality, and
if the information is information indicating the semiconductor wafer ranked more lowly in the ranking due to being more distant from the standard value, the semiconductor device is assembled in the assembly step as a second product that is required to have quality lower than quality of the first product.
13. A semiconductor device comprising:
an evaluation element formed on a scribe line of a semiconductor wafer; and
a character marked on the semiconductor wafer, the character representing information based on an inspection result obtained by performing an inspection using the evaluation element, the information being used in one of a probe inspection process and an assembly step.