1. A composite electronic component comprising:
an insulation sheet;
a tantalum capacitor including a body part containing a sintered tantalum powder and a tantalum wire, a portion of which is embedded in the body part, and disposed on the insulation sheet;
a multilayer ceramic capacitor including a ceramic body including a plurality of dielectric layers, first and second internal electrodes disposed in the ceramic body to face each other with a respective dielectric layer interposed between the first and second internal electrodes, and first and second external electrodes disposed on external surfaces of the ceramic body to be connected to the first and second internal electrodes, respectively, and disposed on the insulation sheet; and
a molded portion enclosing the tantalum capacitor and the multilayer ceramic capacitor,
wherein the first internal electrode includes a first lead portion led out to upper and lower surfaces of the ceramic body and a first end surface of the ceramic body in a length direction of the ceramic body, and the second internal electrode includes a second lead portion led out to the upper and lower surfaces of the ceramic body and a second end surface of the ceramic body in the length direction.
2. The composite electronic component of claim 1, wherein the first and second internal electrodes are disposed perpendicularly with respect to the lower surface of the ceramic body.
3. The composite electronic component of claim 1, wherein the first internal electrode includes a first non-pattern portion formed in at least one or more of a first corner portion adjacent to the upper surface and the first end surface of the ceramic body and a second corner portion adjacent to the lower surface and the first end surface of the ceramic body.
4. The composite electronic component of claim 1, wherein the second internal electrode includes a second non-pattern portion formed in at least one or more of a third corner portion adjacent to the upper surface and the second end surface of the ceramic body and a fourth corner portion adjacent to the lower surface and the second end surface of the ceramic body.
5. The composite electronic component of claim 1, wherein the first and second internal electrodes are not formed in corner portions of the ceramic body.
6. The composite electronic component of claim 1, further comprising an anode terminal disposed on a first end surface of the molded portion in the length direction and a lower surface of the molding portion, and a cathode terminal disposed on a second end surface of the molded portion in the length direction and the lower surface of the molding portion.
7. The composite electronic component of claim 6, wherein the first external electrode of the multilayer ceramic capacitor and the tantalum wire of the tantalum capacitor are connected to the anode terminal.
8. The composite electronic component of claim 6, wherein the second external electrode of the multilayer ceramic capacitor and the body part of the tantalum capacitor are connected to the cathode terminal.
9. The composite electronic component of claim 6, wherein the anode terminal and the cathode terminal respectively include a lower base layer, a side base layer connected to the lower base layer, and a plating layer enclosing the lower base layer and the side base layer.
10. The composite electronic component of claim 9, wherein the lower base layer is formed by etching.
11. The composite electronic component of claim 9, wherein the side base layer is formed by deposition.
12. The composite electronic component of claim 1, wherein the tantalum wire is exposed to a first end surface of the molded portion in the length direction.
13. The composite electronic component of claim 1, wherein in an equivalent series resistance (ESR) vs. input signal frequency graph, an inflection point of equivalent series resistance (ESR) in the composite electronic component is generated in at least one region of frequency regions lower or higher than a self resonant frequency (SRF).
14. The composite electronic component of claim 1, wherein a coupling surface between the multilayer ceramic capacitor and the tantalum capacitor includes an insulation layer disposed on the coupling surface.
15. The composite electronic component of claim 1, further comprising a connective conductor part disposed on an upper surface of the insulation sheet.
16. The composite electronic component of claim 15, wherein the connective conductor part includes a metal pad.
17. The composite electronic component of claim 15, wherein the connective conductor part contains a conductive resin.
18. The composite electronic component of claim 1, wherein a volume ratio of the tantalum capacitor and the multilayer ceramic capacitor is 2:8 to 9:1 (tantalum capacitor:multilayer ceramic capacitor).
19. A board having a composite electronic component comprising:
a printed circuit board on which electrode pads are formed;
the composite electronic component mounted on the printed circuit board; and
a solder connecting the electrode pads and the composite electronic component to each other,
wherein the composite electronic component includes: an insulation sheet; a tantalum capacitor including a body part containing a sintered tantalum powder and a tantalum wire, a portion of which is embedded in the body part, and disposed on the insulation sheet; a multilayer ceramic capacitor including a ceramic body including a plurality of dielectric layers, first and second internal electrodes disposed in the ceramic body to face each other with a respective dielectric layer interposed between the first and second internal electrodes, and first and second external electrodes disposed on external surfaces of the ceramic body to be connected to the first and second internal electrodes, respectively, and disposed on the insulation sheet; and a molded portion enclosing the tantalum capacitor and the multilayer ceramic capacitor,
the first internal electrode including a first lead portion led out to upper and lower surfaces of the ceramic body and a first end surface of the ceramic body in a length direction of the ceramic body, and the second internal electrode including a second lead portion led out to the upper and lower surfaces of the ceramic body and a second end surface of the ceramic body in the length direction.
20. The board having a composite electronic component of claim 19, wherein the first and second internal electrodes are disposed perpendicularly with respect to the lower surface of the ceramic body.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A quick-fixing element for fixing guide rails on lattice-like lateral parts, the quick fixing element comprises:
an upper holding section which reaches at least partially around a first rod of a lateral part;
a lower holding section which reaches at least partially around a second rod of the lateral part which extends essentially parallel to the first rod; and
a nose between the upper and the lower holding sections, which nose rests on the second lower rod of the lateral part.
2. The quick-fixing element according to claim 1, wherein the quick-fixing element is formed of a bendable material, and the lower holding section forms a snap connection with the nose.
3. The quick-fixing element according to claim 1, including a second nose between the lower and the upper holding section and, when the first rod is bend toward the second rod, the nose rests against the first rod.
4. The quick-fixing element according to claim 1, wherein the quick-fixing element is constructed in one piece from a metal sheet.
5. The quick-fixing element according to claim 1, including recesses in the upper andor lower holding section for receiving a right-angle bend of the first or second rod or a rod extending perpendicularly to the first rod and fixing the quick-fixing element to the lateral part.
6. The quick-fixing element according to claim 1, wherein at least one center section is between the upper and lower holding section and partially reaches around a third rod of the lateral part.
7. The quick-fixing element according to claim 1, including a profilings on the quick-fixing element, which profilings permit a quick disconnectible connection between a pull-out guide and the quick-fixing element.
8. A pull-out guide, which can be fixed on a lateral part provided with longitudinally and transversely extending rods, and at least one quick-fixing element according to claim 1 on the pull-out guide.