1. A rotor for a straw chopper in an agricultural harvester, said rotor comprising:
a rotor body;
a mount disposed on said rotor body;
a fastening element;
at least one chopper blade suspended detachably and in a swinging fashion on said mount by said fastening element; and
a fan blade element connected detachably to said mount by way of said fastening element, said fan blade element being rigidly attached to said rotor body.
2. The rotor of claim 1, wherein said fan blade element is rigidly connected to said rotor body by way of a positive fit.
3. The rotor of claim 1, further comprising an other fan blade element, said fan blade element and said other fan blade element each being substantially identical and axially symmetrical so that said fan blade element and said other fan blade element are arranged on either side of said mount and may be replaced with each other.
4. The rotor of claim 1, wherein said fan blade element has a U-shaped cross-section.
5. The rotor of claim 4, wherein said fan blade element includes a center leg that interacts with said fastening element.
6. The rotor of claim 1, further comprising:
a plurality of mounts similar to said mount, said plurality of mounts disposed on said rotor body; and
a plurality of fan blade elements substantially similar to said fan blade element, a portion of said plurality of mounts not having any of said fan blade elements associated therewith and an other portion of said plurality of mounts having at least one of said plurality of fan blade elements respectively associated therewith.
7. A combine harvester, comprising:
a straw chopper including a rotor having:
a rotor body;
a mount disposed on said rotor body;
a fastening element;
at least one chopper blade suspended detachably and in a swinging fashion on said mount by said fastening element; and
a fan blade element connected detachably to said mount by way of said fastening element, said fan blade element being rigidly attached to said rotor body.
8. The combine harvester of claim 7, wherein said fan blade element is rigidly connected to said rotor body by way of a positive fit.
9. The combine harvester of claim 7, further comprising an other fan blade element, said fan blade element and said other fan blade element each being substantially identical and axially symmetrical so that said fan blade element and said other fan blade element are arranged on either side of said mount and may be replaced with each other.
10. The combine harvester of claim 7, wherein said fan blade element has a U-shaped cross-section.
11. The combine harvester of claim 10, wherein said fan blade element includes a center leg that interacts with said fastening element.
12. The combine harvester of claim 7, further comprising:
a plurality of mounts similar to said mount, said plurality of mounts disposed on said rotor body; and
a plurality of fan blade elements substantially similar to said fan blade element, a portion of said plurality of mounts not having any of said fan blade elements associated therewith and an other portion of said plurality of mounts having at least one of said plurality of fan blade elements respectively associated therewith.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An apparatus for fabricating a semiconductor device, comprising:
a first processing chamber for forming a resist film on a substrate;
a second processing chamber, being kept in a vacuum state, for pre-baking the resist film; and
a third processing chamber, being kept in a vacuum state, for exposing the pre-baked resist film to the extreme ultraviolet radiation.
2. The apparatus of claim 1, wherein the second processing chamber comprises means for irradiating the resist film with a type of radiation having too long a wavelength to sensitize the resist film.
3. The apparatus of claim 1, wherein the second processing chamber comprises means for exhausting a gas, emanated from the resist film, out of the second processing chamber.
4. An apparatus of claim 1, wherein the first processing chamber is also used for defining a resist pattern on the substrate by developing the resist film that has been exposed to extreme ultraviolet radiation.
5. An apparatus for fabricating a semiconductor device, comprising:
a first processing chamber for forming a resist film on a substrate;
a second processing chamber, being kept in a vacuum state, for pre- and post-baking the resist film before and after the resist film is exposed to the extreme ultraviolet radiation, respectively; and
a third processing chamber, being kept in a vacuum state, for exposing the pre-baked resist film to the extreme ultraviolet radiation.
6. The apparatus of claim 5, wherein the second processing chamber comprises means for irradiating the resist film with a type of radiation having too long a wavelength to sensitize the resist film.
7. The apparatus of claim 5, wherein the second processing chamber comprises means for exhausting a gas, emanated from the resist film, out of the second processing chamber.
8. An apparatus of claim 5, wherein the first processing chamber is also used for defining a resist pattern on the substrate by developing the resist film that has been exposed to extreme ultraviolet radiation.
9. An apparatus for fabricating a semiconductor device, comprising:
a first processing chamber for forming a resist film on a substrate;
a second processing chamber, being kept in a vacuum state, for pre- and post-baking the resist film before and after the resist film is exposed to extreme ultraviolet radiation, respectively;
a third processing chamber, being kept in a vacuum state, for exposing the pre-baked resist film to the extreme ultraviolet radiation;
a fourth processing chamber for forming a silylated layer selectively on the surface of the post-baked resist film; and
a fifth processing chamber for defining a resist pattern on the substrate by dry-developing the resist film, on which the silylated layer has been formed, using the silylated layer as a hard mask.
10. The apparatus of claim 9, wherein the second processing chamber comprises means for irradiating the resist film with a type of radiation having too long a wavelength to sensitize the resist film.
11. The apparatus of claim 9, wherein the second processing chamber comprises means for exhausting a gas, emanated from the resist film, out of the second processing chamber.