1. A semiconductor device, comprising:
an encapsulating resin for covering a semiconductor chip mounted on an island of a lead frame;
an outer lead extending from a side surface of the encapsulating resin;
an inner lead connected to the outer lead;
an inner lead suspension lead connected to the inner lead, and extending from the encapsulating resin; and
a plated film formed on all of surfaces of the outer lead, the inner lead suspension lead having a first narrowed portion, and the first narrowed portion overlapping with an outline of the encapsulating resin in plan view.
2. A semiconductor device according to claim 1, wherein the inner lead suspension lead further comprises a second narrowed portion in the encapsulating resin in plan view.
3. A semiconductor device according to claim 2, wherein the first narrowed portion comprises a V notch formed therein.
4. A semiconductor device according to claim 2, further comprising a through-hole formed between the first narrowed portion and the second narrowed portion.
5. A method of manufacturing a semiconductor device, comprising:
preparing a lead frame comprising:
an island;
an inner lead close to the island;
an inner lead suspension lead and an outer lead that are connected to the inner lead; and
an island suspension lead connected to the island, the inner lead suspension lead including a first narrowed portion;
die-bonding, wire-bonding, and resin encapsulating a semiconductor chip;
cutting a distal end of the outer lead;
forming, by electrolytic plating, a plated film on the cut surface of the outer lead;
cutting the inner lead suspension lead at the first narrowed portion; and
cutting the island suspension lead.
6. A method of manufacturing a semiconductor device according to claim 5, further comprising testing electrical characteristics between the cutting the inner lead suspension lead and the cutting the island suspension lead.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An overhead door operating system comprising:
an operator motor assembly selectively opening or closing the door;
an operator transmitter located with said operator motor assembly, wherein said operator transmitter is activated during an operating cycle of said operator motor assembly and which transmits a wireless signal; and
a remote assembly in electrical communication with a power supply, said remote assembly receiving and assuming an on condition when said wireless signal is received.
2. The operating system according to claim 1, wherein said remote assembly comprises a light source.
3. The operating system according to claim 1, wherein said signal is a radio frequency signal.
4. The operating system according to claim 1, wherein said signal is an infrared signal.
5. The overhead door operating system according to claim 1, wherein said remote assembly comprises:
a light source; and
a sensing element connected to said light source, said sensing element receiving said signal and controlling illumination of said light source.
6. The overhead door operating system according to claim 5, wherein said signal is one of a radio frequency signal and an infrared signal.
7. The overhead door operating system according to claim 6, wherein said light source is illuminated for a period of time after said operator motor has stopped.
8. The overhead door operating system according to claim 5, wherein said remote assembly further comprises a receiver assembly which carries said sensing element, and wherein said receiver assembly is pivotable and rotatable for reception of said signal.
9. The overhead door operating system according to claim 1, wherein one of said operator transmitter and said remote assembly is preset to actuate said remote assembly for a period of time after said operator motor assembly has stopped.