1. A semiconductor package comprising:
a substrate having a first surface, a second surface, and a through hole opening;
a heat spreader having a first surface and a second surface, a metal layer applied on the second surface of the heat spreader, a plurality of notches formed in the metal layer and exposing a metal substrate of the heat spreader;
a semiconductor die coupled to the first surface of the heat spreader, wherein the semiconductor die is electrically coupled to the substrate;
an encapsulant covering portions of the first surface of the substrate, portions of the first surface of the heat spreader, and the semiconductor die;
a first set of solder balls coupled to the second surface of the substrate; and
a second set of solder balls located in the notches and attached to the metal substrate.
2. The semiconductor package of claim 1, wherein the first surface of the heat spreader is coupled to the second surface of the substrate.
3. The semiconductor package of claim 1, wherein the heat spreader is placed in the through hole opening of the substrate.
4. The semiconductor package of claim 3, wherein the second surface of the substrate is substantially coplanar with the second surface of the heat spreader.
5. The semiconductor package of claim 1, further comprising a metal layer formed on the second surface of the heat spreader.
6. The semiconductor package of claim 5, wherein the metal layer is formed of a metal that resists wetting of the solder balls.
7. The semiconductor package of claim 6, wherein the metal layer is selected from the group consisting of nickel, silver, gold, and palladium.
8. A semiconductor package comprising:
a substrate having a first surface, a second surface, and a through hole opening;
a heat spreader having a first surface and a second surface, a metal layer a lied on the second surface of the heat spreader, a plurality of annular rings formed in the metal layer and exposing a metal substrate of the heat spreader;
a semiconductor die coupled to the first surface of the heat spreader, wherein the semiconductor die is electrically coupled to the substrate;
an encapsulant covering portions of the first surface of the substrate, portions of the first surface of the heat spreader, and the semiconductor die;
a first set of solder balls coupled to the second surface of the substrate; and
a second set of solder balls located in the annular rings and attached to the metal substrate.
9. The semiconductor package of claim 8, wherein the first surface of the heat spreader is coupled to the second surface of the substrate.
10. The semiconductor package of claim 8, wherein the heat spreader is placed in the through hole opening of the substrate.
11. The semiconductor package of claim 9, wherein the second surface of the substrate is substantially coplanar with the second surface of the heat spreader.
12. The semiconductor package of claim 8, further comprising a metal layer formed on the second surface of the heat spreader.
13. The semiconductor package of claim 12, wherein the metal layer is formed of a metal that resists wetting of the solder balls.
14. The semiconductor package of claim 13, wherein the metal layer is selected from the group consisting of nickel, silver, gold, and palladium.
15. A semiconductor package comprising:
a substrate having a first surface, a second surface, and a through hole opening;
a heat spreader having a first surface and a second surface, a metal layer applied on the second surface of the heat spreader, and means formed in the metal layer and exposing a metal substrate for retaining solder balls to the second surface of the heat spreader;
a semiconductor die coupled to the first surface of the heat spreader, wherein the semiconductor die is electrically coupled to the substrate;
an encapsulant covering portions of the first surface of the substrate, portions of the first surface of the heat spreader, and the semiconductor die;
a first set of solder balls coupled to the second surface of the substrate; and
a second set of solder balls located in the retaining means and attached to the exposed metal substrate.
16. The semiconductor package of claim 15, wherein the first surface of the heat spreader is coupled to the second surface of the substrate.
17. The semiconductor package of claim 15, wherein the heat spreader is placed in the through hole opening of the substrate.
18. The semiconductor package of claim 17, the second surface of the substrate is substantially coplanar with the second surface of the heat spreader.
19. The semiconductor package of claim 15, wherein the retaining means is a plurality of notches formed in the second surface of the heat spreader.
20. The semiconductor package of claim 15, wherein the retaining means is a plurality of annular rings formed in the second surface of the heat spreader.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An implant comprising:
a first bone anchor adapted to be attached to a first portion of a vertebra;
a second bond anchor adapted to be attached to a second portion of the same vertebra;
a flexible horizontal rod connected to the first bone anchor through a first head of the first bone anchor said flexible rod connected through a second head of the second bone anchor; and
said first bone anchor including a first upper cradle and a first lower cradle to capture the flexible horizontal rod between the first upper cradle and the first lower cradle and the second bone anchor includes a second upper cradle and a second lower cradle to capture the flexible horizontal rod between the second upper cradle and the second lower cradle.
2. The implant of claim 1 including a first lock to lock the first bone anchor to the horizontal rod and a second lock to lock the second bone anchor to the horizontal rod and wherein the locking of the first and second bone anchors to the horizontal rod with the first and second bone anchors positioned relative to one vertebra locks the implant to the one vertebra.
3. The implant of claim 1 wherein said first bone anchor includes said first head which is an upper portion that can accept the flexible horizontal rod and said first bone anchor includes a lower portion extending from said upper portion which lower portion is adapted to engage bone.
4. The implant of claim 3 wherein the one of the upper portion and the lower portion of the first bone anchor can move relative to the other of the upper portion and the lower portion of the first bone anchor.
5. The implant of claim 1 wherein said horizontal rod is adapted to be about parallel to the vertebra with the first anchor secured to a first portion of the vertebra and the second anchor secured to a second portion of the vertebra located distally from the first portion of the vertebra.
6. The implant of claim 1 wherein said horizontal rod is made of PEEK.
7. An implant comprising:
a first bone anchor adapted to be attached to a first portion of a vertebra;
a second bond anchor adapted to be attached to a second portion of the same vertebra;
a flexible horizontal rod connected to the first bone anchor and the second bone anchor;
a third bone anchor adapted to be attached to a first portion of another vertebra;
a fourth bone anchor adapted to be attached to a second portion of the same another vertebra;
another flexible horizontal rod connected to the third bone anchor and the fourth bone anchor;
a rigid vertical rod connected between the first horizontal rod and the second horizontal rod.
8. The implant of claim 7 wherein said rigid vertical rod is not meant to flex, while at least of the first and second horizontal rods is meant to absorb and be deflected with respect to at least in part the motion of the spine.
9. The implant of claim 7 wherein said rigid vertical rod is curved so as to be adapted to avoid a spinous process of a spine which is located between the flexible horizontal rod and the another flexible horizontal rod.
10. The implant of claim 9 including another rigid vertical rod that is curved so as to be adapted to avoid a spinous process of a spine which is located between the flexible horizontal rod and the another flexible horizontal rod, with the curved rigid rod and said another curved rigid vertical rod together defining at least part of a circle.
11. An implant comprising:
a first bone anchor adapted to be attached to a first portion of a vertebra;
a second bond anchor adapted to be attached to a second portion of the same vertebra; and
a flexible horizontal rod connected to the first bone anchor directly through a first head of the first bone anchor said flexible rod connected directly through a second head of the second bone anchor, which flexible horizontal rod flexes to carry and accommodate a load placed on the implant by the spine.
12. The implant of claim 11 including:
said first bone anchor including a first upper cradle and a first lower cradle to capture the flexible horizontal rod between the first upper cradle and the first lower cradle and the second bone anchor includes a second upper cradle and a second lower cradle to capture the flexible horizontal rod between the second upper cradle and the second lower cradle.
13. The implant of claim 11 including a first lock to lock the first bone anchor to the horizontal rod and a second lock to lock the second bone anchor to the horizontal rod and wherein the locking of the first and second bone anchors to the horizontal rod with the first and second bone anchors positioned relative to one vertebra locks the implant to the one vertebra.
14. The implant of claim 11 wherein said first bone anchor includes said first head which is an upper portion that can accept the flexible horizontal rod and said first bone anchor includes a lower portion extending from said upper portion which lower portion is adapted to engage bone.
15. The implant of claim 14 wherein one of the upper portion and the lower portion of the first bone anchor can move relative to the other of the upper portion and the lower portion of the first bone anchor.
16. The implant of claim 14 wherein one of the upper portion and the lower portion of the first bone anchor can rotate relative to the other of the upper portion and the lower portion of the first bone anchor.
17. The implant of claim 11 including a first lock to lock the first bone anchor to the horizontal rod and a second lock to lock the second bone anchor to the horizontal rod and wherein the locking of the first and second bone anchors to the horizontal rod with the first and second bone anchors positioned relative to one vertebra locks the implant to the one vertebra.