1. A wood-type golf club head comprising:
an aft body comprising a crown and a sole; and
a face portion attached to the aft body, the face portion comprising a striking area and a rear section extending laterally rearwardly from the striking face;
wherein the rear section comprises a sole side, a crown side, a heel side, and a toe side;
wherein the crown and the sole each have a periphery and are connected to one another at their peripheries; and
wherein the crown and sole are connected to one another at one or more locations spaced inward from their respective peripheries to form a pillar, and
wherein an interior surface of the crown is visible through the pillar.
2. The wood-type golf club head of claim 1, wherein the crown is composed of a composite material.
3. The wood-type golf club head of claim 1, wherein the sole is composed of a composite material.
4. The wood-type golf club head of claim 1, wherein the face portion is composed of a titanium material.
5. The wood-type golf club head of claim 1, further comprising a ribbon disposed between and connected to the crown and the sole at their respective peripheries.
6. The wood-type golf club head of claim 1, wherein the face portion is a face cup.
7. The wood-type golf club head of claim 6, wherein the face cup is composed of a titanium alloy material.
8. The wood-type golf club head of claim 1, wherein the crown and the sole are connected. to one another at their peripheries with an adhesive material.
9. The wood-type golf club head of claim 1, wherein the striking area comprises a variable thickness pattern.
10. A wood-type golf club head comprising:
a face component;
a compression-molded composite crown comprising interior and exterior surfaces and a periphery;
a sole comprising one or more apertures and a periphery; and
one or more composite pieces having approximately the same size in plan as the one or more apertures and having at least three sides;
wherein the interior surface of the crown is visible through the one or more apertures;
wherein at least one side of each of the one or more composite pieces is affixed to at least one side of each of the one or more apertures; and
wherein at least one side of each of the one or more composite pieces is affixed to the interior surface of the crown.
11. The wood-type golf club head of claim 10, wherein the wood-type golf club head is a driver-type head.
12. The wood-type golf club head of claim 10, wherein the face component is a face plate.
13. The wood-type golf club head of claim 10, wherein the ace component is composed of a titanium material.
14. The wood-type golf club head of claim 10, further comprising a ribbon disposed between and connected to the crown and the sole at their respective peripheries.
15. The wood-type golf club head of claim 10, wherein the crown and sole are connected to one another at their respective peripheries.
16. A wood-type golf club head comprising
a face component comprising a striking face;
a composite crown comprising interior and exterior surfaces; and
a sole comprising at least one deep pocket,
wherein the striking face comprises a variable thickness pattern,
wherein the at least one deep pocket comprises interior and exterior surfaces, and
wherein a portion of the interior surface of the at least one deep pocket contacts a portion of the interior surface of the composite crown.
17. The wood-type golf club head of claim 16, wherein the sole comprises two deep pockets.
18. The wood-type golf club head of claim 16, wherein the sole comprises four deep pockets.
19. The wood-type golf club head of claim 16, wherein a cumulative volume of the at least one deep pocket is less than 50 cubic centimeters.
20. The wood-type golf club head of claim 16, wherein the crown and the sole each have a periphery, and wherein the crown and sole are connected to each other at their respective peripheries.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An embedded passive device in a substrate comprising:
a first conductive layer overlying a polymer build-up layer;
a dielectric layer overlying the first conductive layer;
a second conductive layer overlying the dielectric layer; and
a via that extends from the second conductive layer through the polymer build-up layer and electrically couples to an underlying interconnect, wherein the via extends through an opening patterned in the dielectric layer.
2. The embedded passive device of claim 1, wherein:
the first conductive layer is further characterized as a first electrode layer;
the dielectric layer is further characterized as a capacitor dielectric layer;
the second conductive layer is further characterized a second electrode layer; and
a combination of the first electrode layer, the capacitor dielectric layer, and the second electrode layer forms an embedded capacitor structure in the substrate.
3. The embedded passive device of claim 2, wherein the capacitor dielectric layer includes a ceramic dielectric material.
4. The embedded passive device of claim 3, wherein the ceramic dielectric material is selected from the group consisting of strontium titinate, barium strontium titinate, andor barium titinate.
5. The embedded passive device of claim 4, wherein the substrate is further characterized as an organic substrate.
6. The embedded passive device of claim 5, wherein a core of the substrate includes bismaleimide triazine resin.
7. The embedded passive device of claim 5, wherein the second conductive layer comprises a material selected from the group consisting of copper and nickel.
8. The embedded passive device of claim 5, wherein the first conductive layer comprises a material selected from a group consisting of copper, platinum, and nickel.
9. The embedded passive device of claim 3, wherein the via extends through an opening patterned in the first conductive layer.
10. An embedded passive laminate for applying to a substrate comprising:
a patterned electrode layer;
a patterned capacitor dielectric layer; and
an unpatterned electrode layer.
11. The embedded passive laminate of claim 10, wherein the patterned electrode layer comprises a material selected from the group consisting of copper, platinum, and nickel.
12. The embedded passive laminate of claim 11, wherein the unpatterned electrode layer comprises a material selected from the group consisting of copper and nickel.
13. The embedded passive laminate of claim 11, wherein the patterned capacitor dielectric layer comprises a ceramic dielectric material.
14. The embedded passive laminate of claim 11, wherein the patterned capacitor dielectric layer comprises a material selected from the group consisting of strontium titinate, barium strontium titinate, andor barium titinate.
15. The embedded passive laminate of claim 14, wherein the substrate is further characterized as an organic substrate.
16. A method for forming embedded passive structures in an organic packaging substrate comprising affixing an embedded passive laminate on the organic packaging substrate, wherein the embedded passive laminate includes a pre-patterned capacitor dielectric layer.
17. The method of claim 16, wherein the pre-patterned capacitor dielectric layer is further characterized as a ceramic dielectric material.
18. The method of claim 17, wherein the ceramic dielectric material is further characterized as being selected from a group consisting of strontium titinate, barium strontium titinate, andor barium titinate.
19. The method of claim 18, wherein the substrate is further characterized as an organic substrate.
20. A method for forming an embedded thin film capacitor comprising:
depositing a ceramic dielectric layer over a base layer of conductive material;
patterning the ceramic dielectric layer to form first openings that expose portions of the base layer;
depositing a lower electrode layer over the ceramic dielectric layer; and
patterning the lower electrode layer to form second openings that expose portions of the base layer.
21. The method of claim 20 further comprising heating the ceramic dielectric at a temperature in a range of 500-900 degrees Celsius. prior to depositing the lower electrode layer.
22. The method of claim 21, wherein the combination base layer, patterned capacitor dielectric, and patterned lower electrode layer forms a thin film capacitor laminate, the method further comprising:
mounting the thin film capacitor laminate over a dielectric layer on a substrate, wherein the patterned lower electrode layer is positioned between the base layer and the dielectric layer;
removing portions of the base layer;
forming via openings that pass through the first opening and the second opening and that extend through the dielectric layer to an underlying conductive structure;
filling the via openings with a conductive material; and
patterning the conductive material to form a conductive structure.
23. The method of claim 22, wherein the ceramic capacitor dielectric is further characterized as a material selected from a group consisting of strontium titinate, barium strontium titinate, andor barium titinate.
24. The method of claim 23, wherein the base layer includes at least one of copper and nickel.
25. The method of claim 24, wherein the lower electrode layer includes at least one of copper, platinum, and nickel
26. The method of claim 23 wherein the first opening is wider than the second opening.
27. The method of claim 23, wherein the second opening is wider than the first opening and wherein the conductive structure electrically couples to portions of the lower electrode layer.
28. The method of claim 23, wherein the conductive structure is further characterized as an upper capacitor electrode.
29. A method for packaging a semiconductor die comprising mounting the semiconductor die to an organic packaging substrate, wherein the organic packaging substrate includes embedded thin film capacitors that have been formed by applying a laminate that includes a pre-patterned capacitor dielectric layer over build-up layers of the packaging substrate.
30. The method of claim 29, wherein the package substrate is further chartacterized as a ball grid array package substrate.