1. A fuel efficiency degradation amount displaying device, comprising:
a tire air pressure detecting unit for outputting a detection signal depending on a tire air pressure of a wheel attached to a vehicle;
a fuel efficiency degradation amount specifying unit for specifying based on the outputted detection signal an amount of degradation of fuel efficiency of the vehicle compared to fuel efficiency of the vehicle in a case that the tire air pressure is appropriate; and
a displaying unit for displaying the specified amount of the degradation.
2. The fuel efficiency degradation amount displaying device according to claim 1, wherein the fuel efficiency degradation amount specifying unit specifies the amount of degradation of the fuel efficiency based on a stored relation describing a correspondence between the tire air pressure and the amount of degradation of the fuel efficiency.
3. The fuel efficiency degradation amount displaying device according to claim 1, further comprising:
a low tire air pressure determination unit for making, based on the outputted detection signal, a determination whether the tire air pressure is below a predetermined threshold,
wherein the displaying unit displays, based on that the determination is affirmative, information indicating decrease of the tire air pressure.
4. The fuel efficiency degradation amount displaying device according to claim 3, wherein the fuel efficiency degradation amount determining unit specifies, based on that the determination is negative, the amount of degradation of fuel efficiency.
5. The fuel efficiency degradation amount displaying device according to claim 1, further comprising:
a pressure shortage detecting unit for detecting, based on the outputted detection signal, a degree of shortage of the tire air pressure compared to an appropriate tire air pressure,
wherein the displaying unit displays the detected degree of the shortage of the tire air pressure.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A gang clip comprising:
a metallic clip including a flat area and a ridge bending away from the flat area at an angle; and
a plurality of tie bars extending from the flat area, the end portions of the tie bars aligned in a common orientation.
2. The clip of claim 1 wherein at least one surface of the clip has a metallurgical configuration suitable for solder attachment.
3. The clip of claim 1 wherein the metal is selected from a group including copper, aluminum, and silver and has high electrical and thermal conductivity suitable for semiconductor devices.
4. A matrix of gang clips comprising:
a gang clips having a flat area, a ridge, and tie bars extending from the flat area, the end portions of the ties bars aligned in a common direction;
a plurality of gang clips having respective end portions of tie bars merged unidirectionally to form an elongated chain of clips; and
a plurality of chains arrayed parallel to each other, free of tie bars between adjacent chains, the plurality having the chain ends tied at both ends to rails normal to the chains to form a matrix of clips having the rails as a stable frame.
5. The matrix of claim 4 wherein the matrix including the frame are stamped and formed of a single sheet of metal.
6. The matric of claim 5 wherein the sheet is selected from a group of metals including copper, aluminum, and silver.
7. A packaged power supply system comprising:
a metallic QFN leadframe having a plurality of leads and a pad;
a first FET chip vertically attached onto the pad;
a first gang clip having the flat area vertically attached onto the first FET chip and the ridge tied to a first lead from the plurality of leads;
a second FET chip vertically attached onto the first clip;
a second gang clip having the flat area vertically attached onto the second FET chip and the ridge tied to a second lead from the plurality of leads, completing the vertically attached power supply system; and
a package compound encapsulating the power supply system, the package having sidewalls free of exposed metal except sawed cuts of leads.
8. The packaged system of claim 7 wherein the package is shaped as a hexahedron.
9. The packaged system of claim 7 wherein the cut leads are created by the singulation process of trimming the leadframe after the encapsulation process.