What is claimed is:
1. A function module with built-in heat dissipation device, comprising:
a first circuit board having a first surface, a first device, and a second device, wherein the first and second devices have different heights and are disposed on the first surface;
a second circuit board having a second surface facing the first surface, a third device and a fourth device, wherein the third and the fourth devices have different heights and are disposed on the second surface;
a first heat spreader having a first face and a third face, opposite to the first face, wherein the first face is a stepped face and contacts the first and second devices simultaneously, and the third face is a flat face;
a second heat spreader having a second face and a fourth face, opposite to the second face, wherein the second face is a stepped face and contacts the third and fourth devices simultaneously, and the fourth face is a flat face; and
a heat dissipation fin, disposed between the first circuit board and the second circuit board, abutting the third face of the first heat spreader and the fourth face of the second heat spreader layer respectively.
2. The function module as claimed in claim 2, wherein the first circuit board further includes a third surface, opposite to the first surface, and the third surface is a ground surface.
3. The function module as claimed in claim 2, wherein the ground surface comprises copper.
4. The function module as claimed in claim 1, wherein the second circuit board further includes a fourth surface, opposite to the second surface, and the fourth surface is a ground surface.
5. The function module as claimed in claim 4, wherein the ground surface comprises copper.
6. The function module as claimed in claim 1, wherein the first circuit board further includes a first power supply and a third surface, opposite to the first surface, and the power supply is disposed on the third surface.
7. The function module as claimed in claim 1, wherein the second circuit board further includes a second power supply and a fourth surface, opposite to the second surface, and the power supply is disposed on the fourth surface.
8. The function module as claimed in claim 1, further comprising a flat cable connecting the first circuit board and the second circuit board, providing communicability therebetween.
9. The function module as claimed in claim 1, further comprising a connector connecting the first circuit board and the second circuit board, providing communicability therebetween.
10. The function module as claimed in claim 9, wherein the connector is a slot connector.
11. The function module as claimed in claim 1, wherein the first and second heat spreaders are made of copper, aluminum, metal, metallic composites or non-metallic composites.
12. The function module as claimed in claim 1, wherein the first and second heat spreaders have a thermal conductivity greater than or equal to 100 WmK.
13. The function module as claimed in claim 1, wherein a brazing solder, tin solder, thermal interface material, or grease is disposed between the first heat spreaders and the heat dissipation fin.
14. The function module as claimed in claim 1, wherein a brazing solder, tin solder, thermal interface material, or grease is disposed between the second heat spreader and the heat dissipation fin.
15. The function module as claimed in claim 1, further comprising a fan, connected to the heat dissipation fin, for further dissipation of heat therefrom.
16. The function module as claimed in claim 1, wherein the first circuit board further includes a third surface and a fifth device, disposed thereon.
17. The function module as claimed in claim 1, wherein the second circuit board further includes a fourth surface and a sixth device, disposed thereon.
18. A function module comprising:
a first circuit board having a first surface, a first device, and a second device, wherein the first and second devices have different heights and are disposed on the first surface;
a second circuit board having a second surface facing the first surface, a third device and a fourth device, wherein the third and the fourth devices have different heights and are disposed on the second surface; and
a heat dissipation device having a first heat conduction face and a second heat conduction face, disposed between the first circuit board and the second circuit board, wherein the first heat conduction face is a stepped face, abutting the first and second devices simultaneously, and the second heat conduction face is a stepped face, abutting the third and fourth devices simultaneously;
wherein the heat dissipation device is abutted against the first and second devices on the first circuit board and the third and fourth devices on the second circuit board respectively.
19. The function module as claimed in claim 18, wherein the heat dissipation device is made of copper, aluminum, metal, metallic composites or non-metallic composites.
20. The function module as claimed in claim 18, wherein the heat dissipation device has a thermal conductivity greater than or equal to 100 WmK.
21. The function module as claimed in claim 18, further comprising a flat cable connecting the first circuit board and the second circuit board, providing communicability therebetween.
22. The function module as claimed in claim 18, further comprising a connector connecting the first circuit board and the second circuit board, providing communicability therebetween.
23. The function module as claimed in claim 22, wherein the connector is a slot connector.
24. The function module as claimed in claim 18, further comprising a fan, connected to the heat dissipation device, for dissipating heat therefrom.
25. The function module as claimed in claim 18, wherein the first circuit board further has a third surface, opposite to the first surface, and the third surface is a ground surface.
26. The function module as claimed in claim 25, wherein the ground surface comprises copper.
27. The function module as claimed in claim 18, wherein the second circuit board further includes a fourth surface, opposite to the second surface, and the fourth surface is a ground surface.
28. The function module as claimed in claim 27, wherein the ground surface comprises copper.
29. The function module as claimed in claim 18, wherein the first circuit board further includes a first power supply and a third surface, opposite to the first surface, and the power supply is disposed on the third surface.
30. The function module as claimed in claim 18, wherein the second circuit board further includes a second power supply and a fourth surface, opposite to the second surface, and the power supply is disposed on the fourth surface.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An air duct coupling comprising:
a coupling body having two or more coupling arms configured for attachment to air ducts wherein each coupling arm comprises at least two coupling necks having differing diameters but concentric about the longitudinal axis of the coupling arm.
2. The air duct coupling of claim 1, wherein each coupling arm has a first neck having a first diameter, a second neck having a second diameter, and a third neck having a third diameter with the first diameter, second diameter and third diameter all being different.
3. The air duct coupling of claim 2, wherein the second neck is located between the first neck and third neck with the first neck being located closest to the coupling body and the third neck being located farthest from the coupling body, and wherein the first diameter is greater than the second and third diameter, and the second diameter is greater than the third diameter.
4. The air duct coupling of claim 3, further comprising a first chamfer between the first neck and the second neck and a second chamfer between the second neck and the third neck.
5. The air duct coupling of claim 4, wherein the coupling arms, necks and chamfers are integrally formed with the coupling body.
6. The air duct coupling of claim 5, wherein each coupling arm has no more than three necks.
7. The air duct coupling of claim 6, wherein the first diameter is about 10 inches, the second diameter is about 8 inches and the third diameter is about 6 inches.
8. The air duct coupling of claim 7, wherein the coupling is formed from polyethylene.
9. An air duct coupling comprising:
a coupling body having three coupling arms configured for attachment to air ducts wherein each coupling arm comprises at least two coupling necks having differing diameters but concentric about the longitudinal axis of the coupling arm.
10. The air duct coupling of claim 9, wherein the coupling body has no more than three coupling arms.
11. The air duct coupling of claim 10, wherein the coupling body is a T-shaped joint.
12. The air duct coupling of claim 10, wherein each coupling arm has a first neck having a first diameter, a second neck having a second diameter, and a third neck having a third diameter with the first diameter, second diameter and third diameter all being different.
13. The air duct coupling of claim 12, wherein the second neck is located between the first neck and third neck with the first neck being located closest to the coupling body and the third neck being located farthest from the coupling body, and wherein the first diameter is greater than the second and third diameter, and the second diameter is greater than the third diameter.
14. The air duct coupling of claim 13, further comprising a first chamfer between the first neck and the second neck and a second chamfer between the second neck and the third neck.
15. The air duct coupling of claim 14, wherein the coupling arms, necks and chamfers are integrally formed with the coupling body.
16. The air duct coupling of claim 15, wherein each coupling arm has no more than three necks.
17. The air duct coupling of claim 16, wherein the first diameter is about 10 inches, the second diameter is about 8 inches and the third diameter is about 6 inches.
18. The air duct coupling of claim 17, wherein the coupling body is a T-shaped joint.
19. The air duct coupling of claim 18, wherein the coupling is formed from polyethylene.