1. A wireless power transfer device comprising:
a power transmitter including a power transmission resonator composed of a power transmission coil and a resonant capacitance;
a power receiver including a power receiving resonator composed of a power receiving coil and a resonant capacitance; and
a power-transmission auxiliary device including an auxiliary resonator composed of an auxiliary coil and a resonant capacitance,
thereby transferring power from the power transmitter to the power receiver through magnetic field resonance between the power transmission coil and the power receiving coil,
wherein the power-transmission auxiliary device and the power transmitter are configured to be disposed so as to face each other, forming a power receiving space for disposing the power receiving coil between the power transmission coil and the auxiliary coil,
a resonant frequency ft of a power transmission-side resonant system composed of the power transmission resonator and the auxiliary resonator appears as two resonant frequencies of a lower resonant frequency ftL and a higher resonant frequency ftH by a close coupling between the power transmission resonator and the auxiliary resonator, and
a resonant frequency f3 of the auxiliary resonator is set such that the resonant frequency f2 of the power receiving resonator coincides with either the lower resonant frequency ftL or the higher resonant frequency ftH.
2. The wireless power transfer device according to claim 1, wherein an adjusting variable capacitor is provided as the resonant capacitance of the power-transmission auxiliary device, and a resonant frequency f3 of the auxiliary resonator is set by adjusting the adjusting variable capacitor.
3. The wireless power transfer device according to claim 1, wherein a diameter d1 of the power transmission coil, a diameter d2 of the power receiving coil, and a diameter d3 of the auxiliary coil satisfy the relationship: d1>d2, and d2<d3.
4. The wireless power transfer device according to claim 3, wherein the relationship: d1=d3, and d1>d2 is satisfied.
5. The wireless power transfer device according to claim 3, wherein a central axis of the power transmission coil, a central axis of the auxiliary coil, and a central axis of the power receiving coil are arranged to be coaxial.
6. The wireless power transfer device according to claim 1, wherein a resonant frequency f1 of the power transmission resonator, a resonant frequency f2 of the power receiving resonator, and a resonant frequency f3 of the auxiliary resonator are set so as to satisfy the relationship: f1=f2<f3, or f3<f1=f2.
7. The wireless power transfer device according to claim 1, wherein a resonant frequency f1 of the power transmission resonator, a resonant frequency f2 of the power receiving resonator, and a resonant frequency f3 of the auxiliary resonator are set so as to satisfy the relationship: f2<f1=f3, or f1=f3<C.
8. The wireless power transfer device according to claim 1,
further comprising: a casing that holds the power transmitter and the power-transmission auxiliary device and is configured to be capable of setting a positional relationship between the power transmitter and the power-transmission auxiliary device so as to form the power receiving space,
wherein the power receiver can be removably placed in the power receiving space,
the casing is provided with a lid that can be opened and closed, and power transfer from the power transmission coil to the power receiving coil is performed with the lid being closed, and
an area surrounding the power transmission coil, the auxiliary coil, and the power receiving coil is electromagnetically shielded during power transfer from the power transmission coil to the power receiving coil.
9. The wireless power transfer device according to claim 8,
wherein the casing is provided with an interlock function for maintaining a state of power transfer from the power transmitter to the power receiver, and
the interlock function maintains a condition of electromagnetically shielding an area surrounding the power transmission coil, the auxiliary coil, and the power receiving coil during power transfer.
10. The wireless power transfer device according to claim 1, wherein the power transmitter includes a high-frequency power driver that converts power of an AC power supply into high-frequency power capable of being transmitted, and a relationship: ftL=f2=f0 or ftH=f2=f0 is satisfied when the frequency of the power output from the high-frequency power driver is set to be f0.
11. The wireless power transfer device according to claim 1, wherein the resonant frequency f2 of the power receiving resonator and the resonant frequency f3 of the auxiliary resonator satisfy the relationship: f2\u2260f3.
12. The wireless power transfer device according to claim 1, wherein the wireless power transfer device includes a vanity case-shaped casing with a lid that can be opened and closed, wherein the power transmitter is held in a lower interior portion of the casing and the power-transmission auxiliary device is held by the lid;
provided that above the power transmitter is a support for placing the power receiver, and the power receiver can be installed onto the support, and by closing the lid, the power receiver is disposed between the power transmitter and the power-transmission auxiliary device; and
wherein wireless power transfer can be performed in this state.
13. A wireless power transfer method using: a power transmitter including a power transmission resonator composed of a power transmission coil and a resonant capacitance, a power receiver including a power receiving resonator composed of a power receiving coil and a resonant capacitance, and a power-transmission auxiliary device including an auxiliary resonator composed of an auxiliary coil and a resonant capacitance, thereby transferring an electric power from the power transmitter to the power receiver through magnetic field resonance between the power transmission coil and the power receiving coil,
the method comprising:
disposing the power-transmission auxiliary device and the power transmitter so as to face each other, forming a power receiving space between the power transmission coil and the auxiliary coil, and
performing a power transfer with the power receiving coil being disposed in the power receiving space, by setting a resonant frequency f3 of the auxiliary resonator such that the resonant frequency f2 of the power receiving resonator coincides with either the lower resonant frequency ftL or the higher resonant frequency ftH of a resonant frequency ft of a power transmission-side resonant system composed of the power transmission resonator and the auxiliary resonator, which appears by a close coupling between the power transmission resonator and the auxiliary resonator.
14. The wireless power transfer method according to claim 13,
wherein a variable capacitance is used as the resonant capacitance composing the auxiliary resonator, and
power transfer efficiency is adjusted by adjusting the variable capacitance while disposing the power receiving coil in the power receiving space.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1-15. (canceled)
16. A probe assemblage for providing electrical connection between an integrated circuit chip on a semiconductor wafer and a circuit test equipment, said assemblage including:
an interposer comprising a dielectric material having two major surfaces and contoured sides of the interposer,
a plurality of protruding contact elements positioned atop a compliant material on one major surface of said interposer, each element corresponding to a test pads on the chip,
a plurality of conductive vias connecting each of said contact elements to a metallized pad and a standardized array of connectors on the second surface of said interposer,
a probe card having an array of connectors corresponding to said standardized contact array, and
means attaching said probe card to said interposer.
17. An assemblage as in claim 16 wherein said means to attach the probe card and interposer is by press fit.
18. A probe assemblage for providing electrical connection between an integrated circuit chip on a semiconductor wafer and a circuit test equipment, said assemblage including:
an interposer comprising a dielectric material having two major surfaces and contoured sides of said interposer and,
a plurality of protruding contact elements positioned atop a compliant material on one major surface of said interposer corresponding to test pads on the chip,
a plurality of conductive leads connecting each of said contact elements to a metallized pad and a standardized array of connectors on the second surface of said interposer,
a probe card having an array of connectors corresponding to said standardized connector array, and
said interposer is press fit into said probe card.
19. A test probe assemblage for simultaneously providing electrical connection between scribe line test structures on one or more integrated circuits on a semiconductor wafer and an electrical test equipment, said assemblage including:
an interposer comprising a dielectric material having two major surfaces,
a plurality of protruding contact elements positioned atop a compliant material on one major surface of said interposer corresponding to test pads on one or more integrated circuits,
a plurality of conductive vias connecting each of said contact elements to a metallized pad on the second surface of said interposer,
a plurality of leads fanning outward from said pads to a standardized array of connectors,
a probe card having an array of connectors corresponding to said standardized contact array, and
a means to attach said probe card to said interposer.
20-23. (canceled)