1. 1-(3-{2-4-(2-Methyl-5-quinolinyl)-1-piperazinylethyl}phenyl)-2-imidazolidinone of formula (I) or a pharmaceutically acceptable salt thereof
2. A method of treatment of depression or anxiety in a mammal in need thereof, which comprises administering to said mammal a therapeutically effective amount of the compound as claimed in claim 1.
3. A pharmaceutical composition comprising the compound as claimed in claim 1, and a pharmaceutically acceptable carrier or excipient.
4. A process for preparing the pharmaceutical composition as defined in claim 3, the process comprising mixing the compound and the pharmaceutically acceptable carrier or excipient.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An electronic device socket comprising:
an insulating circuit board having a plurality of electrical terminals mounted therein, said electrical terminals having a female upper end and a male lower end;
a decoupling capacitor mounted on said circuit board, said capacitor being electrically connected between a predetermined pair of said electrical terminals representing voltage and ground terminals; and
a heat sink body having an upper surface configured to receive an electronic device in thermally conductive relation, and a lower surface having a recessed cavity configured to receive said circuit board in interfitting mated relation, said heat sink body having at least one via extending from said upper surface to said recessed cavity,
said circuit board being received within said recessed cavity wherein said female upper ends of said electrical terminals are aligned with said at least one via for receiving the leads of an electronic device which extend through said at least one via,
said male ends of said electrical terminals extending below the lower surface of said heat sink body.
2. The electronic device socket of claim 1 wherein said plurality of electrical terminals are aligned in an array.
3. The electronic device socket of claim 1 wherein said plurality of electrical terminals are aligned in a dual-inline package (DIP) array.
4. The electronic device socket of claim 3 wherein at least one via comprises two elongated vias aligned with said electrical terminals in said DIP array.
5. The electronic socket of claim 1 wherein said male lower ends of said terminals are extended for receipt into vias of a printed circuit board.
6. The electronic socket of claim 1 wherein said male lower ends of said terminals are shortened for soldering to surface mount pads on a printed circuit board.