What is claimed is:
1. A system for reinforcement of an automotive vehicle frame, comprising:
(a) a skeleton member having a plurality of reinforcing ribs incorporated therein adapted for placement in a cavity defined in an automotive vehicle frame; and
(b) an expandable material over at least a portion of said skeleton member.
2. The system as claimed in claim 1, wherein said skeleton member is adapted for reinforcing a vehicle roof.
3. The system as claimed in claim 1, wherein said skeleton member is adapted for reinforcing a vehicle pillar.
4. The system as claimed in claim 1, wherein said skeleton member is adapted for reinforcing a vehicle frame rail.
5. The system as claimed in claim 1, wherein said skeleton member is adapted for reinforcing a vehicle frame cross member.
6. The system as claimed in claim 1, wherein said skeleton member is adapted for reinforcing a vehicle window frame.
7. The system as claimed in claim 1, wherein said skeleton member is adapted for reinforcing a vehicle deck lid.
8. The system as claimed in claim 1, wherein said skeleton member is adapted for reinforcing a vehicle hatch.
9. A member for use in a system for reinforcement of an automotive vehicle frame in response to an external load, comprising:
(a) a first portion having a plurality of beam elements with a longitudinal axis generally non-parallel to the load; and
(b) a second portion contiguous with said first portion, the second portion having a surface adapted for carrying an expandable material, which upon expansion helps distribute load over said surface in response to said load.
10. The member as claimed in claim 9, wherein said material is a polymeric material.
11. The member as claimed in claim 10, wherein said material is a polymeric foam.
12. The member as claimed in claim 9, wherein said expandable material is an epoxy-based polymer foam.
13. The member as claimed in claim 9, wherein said expandable material is a heat activated expandable polymer foam.
14. The member as claimed in claim 9, wherein said expandable material is an expandable plastic foam that is generally free of tack to the touch.
15. The member as claimed in claim 9, wherein said expandable material is an expandable plastic foam that can be activated at a temperature encountered in an automotive vehicle paint operation.
16. A reinforced roof and pillar system for an automotive vehicle, comprising:
(a) an automotive vehicle frame for a roof and pillar of an automotive vehicle, said frame having a plurality of wall portions defining a cavity therein; and
(b) a skeleton member disposed within said cavity and having a structural foam material in sealing contact with said skeleton member and at least one of said plurality of wall portions.
17. The member as claimed in claim 16, wherein said expandable material is a polymer foam.
18. The member as claimed in claim 16, wherein said expandable material is an epoxy-based polymer foam.
19. The member as claimed in claim 16, wherein said expandable material is a heat activated expandable polymer foam.
20. The member as claimed in claim 16, wherein said expandable material is an expandable polymer foam that is generally free of tack to the touch.
21. The member as claimed in claim 16, wherein said expandable material is an expandable plastic foam that can be activated at a temperature encountered in an automotive vehicle paint operation.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An interconnect for testing a semiconductor component having a bumped contact comprising:
a substrate; and
a contact on the substrate configured to electrically engage the bumped contact, the contact comprising a recess in the substrate having a size approximately equal to that of the bumped contact, and a plurality of flexible metal leads cantilevered over the recess configured to support the bumped contact within the recess and to move within the recess by a distance sufficient to accommodate variations in a size, a shape or a planarity of the bumped contact, each metal lead comprising an outer layer selected to provide a non-bonding surface for the bumped contact.
2-5. (canceled)
6. An interconnect for testing a semiconductor component having a bumped contact comprising:
a substrate;
a recess in the substrate; and
a plurality of flexible metal leads on the substrate cantilevered over the recess configured to electrically engage the bumped contact and to move within the recess by a distance sufficient to accommodate variations in a size, a shape or a planarity of the bumped contact, each metal lead having a cantilever length, a width, a thickness and a modulus of elasticity selected to provide a desired spring constant, a shape that substantially matches a topography of the bumped contact, and an outer layer selected to provide a non-bonding surface for the bumped contact.
7. The interconnect of claim 6 wherein each lead includes a projection configured to penetrate the bumped contact.
8-18. (canceled)
19. An interconnect for testing a semiconductor component comprising:
a substrate;
a recess in the substrate; and
a contact on the substrate for electrically engaging a bumped contact on the component, the contact comprising a recess and a plurality of conductive beams within the recess, each conductive beam comprising an etched portion of the substrate and an etched projection at least partially covered with a conductive layer configured to penetrate the bumped contact, the conductive beams having a cantilever length, a width, a thickness, and a modulus of elasticity selected to provide a desired spring constant.
20. The interconnect of claim 19 wherein the substrate comprises silicon and the beam comprises an electrically insulating layer formed thereon.
21. The interconnect of claim 19 wherein the conductive layer comprises a metal that is non-bonding with the bumped contacts.
22. The interconnect of claim 19 wherein the bumped contact comprises solder and the conductive layer comprises a non-solder wettable metal.
23. An interconnect for testing a semiconductor component comprising:
a substrate;
a recess in the substrate;
a tape attached to the substrate comprising a polymer substrate and a plurality of leads on the polymer substrate, the leads cantilevered over an opening in the polymer substrate, and over the recess to form a contact for electrically engaging a bumped contact on the component, the leads in electrical communication with a conductive trace on the polymer substrate.
24. The interconnect of claim 23 wherein the tape further comprises an electrical connector in electrical communication with the conductive trace configured for electrical connection to test circuitry.
25. A system for testing a semiconductor component having a bumped contact comprising:
a carrier for retaining the semiconductor component;
an interconnect on the carrier comprising a substrate, a recess in the substrate having a size approximately equal to that of the bumped contact, a plurality of leads cantilevered over the recess configured to electrically engage the bumped contact and to move within the recess by a distance sufficient to accommodate variations in a size, a shape or a planarity of the bumped contact, each lead comprising an outer layer selected to provide a non-bonding surface for the bumped contact; and
a test circuitry in electrical communication with the leads configured to apply test signals to the component.
26. The system of claim 25 wherein each lead has a radius of curvature substantially equal to a radius of the bumped contact.
27. The system of claim 25 further comprising a conductive via in the substrate in electrical communication with the segment.
28. The system of claim 25 wherein the leads comprise a polymer tape attached to the substrate, and an electrical connector configured for connection to the test circuitry.
29. A system for testing a semiconductor component comprising:
a carrier configured to retain the component;
an interconnect on the carrier comprising:
a substrate;
a recess in the substrate; and
a contact on the substrate for electrically engaging a bumped contact on the component, the contact comprising a recess in the substrate and a plurality of conductive beams within the recess, each conductive beam comprising an etched portion of the substrate and an etched projection at least partially covered with conductive layer configured to penetrate the bumped contact, the conductive beams having a cantilever length, a width, a thickness, and a modulus of elasticity selected to provide a desired spring constant.
30. The system of claim 29 wherein the interconnect further comprises a conductive via in electrical communication with the conductive beams and a terminal contact electrically connectable to test circuitry.
31-48. (canceled)