1-30. (canceled)
31. An integrated circuit (IC) package, wherein said IC package was formed by:
sealing a fill port with a light or energy active resist;
patterning said resist; and
hermetically sealing said fill port with a solder;
wherein a portion of said resist remains in said IC package.
32. The package of claim 31, wherein:
said resist comprises a photo resist; and
said patterning said resist comprises a photolithographic process.
33. The package of claim 32, wherein said photo resist comprises one of a negative photo resist or a positive photo resist.
34. The package of claim 33, wherein said sealing a fill port with a light or energy active resist comprises disposing said resist in said fill port such that said resist is in intimate contact with said packaging fluid.
35. The package of claim 34, wherein said photolithographic process removes a portion of said photo resist sufficient to exposes a surface of a fill port channel or a fill port pad;
wherein said solder hermetically seals to said surface.
36. The package of claim 31, further comprising:
a ring disposed around said fill port;
wherein said ring is exposed resist configured to aid in an application of said solder.
37. A system for hermetically sealing an integrated circuit (IC) package comprising:
a resist dispenser;
an energy source;
a mask communicatively coupled to said energy source;
a developer;
a solder dispenser; and
a solder reflow device;
wherein said resist dispenser, said energy source, said mask, and said developer are configured to perform a photolithography process.
38. The system of claim 37, wherein said resist dispenser is configured to dispense a photo resist into a fill port channel such that said photo resist is in intimate contact with a packaging fluid.
39. The system of claim 38, wherein said mask is configured to selectively expose said photo resist with a quantity of energy emitted by said energy source.
40. The system of claim 39, wherein said developer is configured to leave a plug of said photo resist in said fill port channel.
41. The system of claim 37, further comprising a computing device communicatively coupled to said system, wherein said computing device is configured to control an operation of said system.
42. A system for hermetically sealing an integrated circuit (IC) package comprising:
a means for applying a light or energy active resist to a fill port;
a means for patterning said resist;
a means for applying a solder to said fill port; and
a means for reflowing said solder;
wherein said means for patterning said resist is configured to remove a sufficient quantity of said resist to facilitate the application of said solder to form a hermetic seal on said fill port.
43. The system of claim 42, wherein said means for patterning said resist comprises a photolithography technique.
44. The system of claim 43, wherein said means for patterning said resist further comprises means for leaving a portion of said resist in said fill port channel to act as a temporary hermetic seal prior to an application of said solder.
45. The system of claim 44, further comprising a computing device communicatively coupled to said system.
46. The system of claim 45, further comprising a conveyer belt or a number of robotic arms controllably coupled to said computing device;
wherein said conveyer belt or said number of robotic arms are configured to manipulate said IC package, a photo resist dispenser, a photolithography mask, a solder dispenser, a resist developer, or a solder reflow device.
47. A hermetically sealed package comprising:
an inner enclosure;
a fill port channel coupling said inner enclosure to an atmosphere;
a quantity of resist disposed in said fill port channel; and
a quantity of solder disposed in said fill port channel, wherein said quantity of solder hermetically seals said inner enclosure.
48. The hermetically sealed package of claim 47, further comprising a quantity of fluid disposed in said inner enclosure.
49. The hermetically sealed package of claim 48, wherein said quantity of resist is configured to insulate said fluid during an application of said quantity of solder.
50. The hermetically sealed package of claim 47, further comprising a micro-electro mechanical system (MEMS) or a micro-electro-optical mechanical system (MEOMS) disposed in said inner enclosure.
51. The hermetically sealed package of claim 47, further comprising a ring of resist disposed on said package around said fill port channel;
wherein said ring of resist is configured to guide said quantity of solder into said fill port channel.
52. The hermetically sealed package of claim 47, wherein said quantity of resist comprises one of a negative photo resist or a positive photo resist.
53. A hermetically sealed micro-electro mechanical system (MEMS) package comprising:
an inner enclosure;
a MEMS disposed in said inner enclosure;
a fill port channel coupling said inner enclosure to an atmosphere;
a quantity of resist disposed in said fill port channel; and
a quantity of solder disposed in said fill port channel, wherein said quantity of solder hermetically seals said inner enclosure.
54. The hermetically sealed MEMS package of claim 53, further comprising a filling fluid disposed in said inner enclosure.
55. A hermetically sealed package comprising:
a means for enclosing an integrated circuit or a MEMS;
a means for channeling a fluid into said means for enclosing;
a quantity of resist disposed in said means for channeling; and
a means for hermetically sealing a channel disposed in said means for channeling, wherein said means for hermetically sealing hermetically seals said means for enclosing.
56. The hermetically sealed package of claim 55, further comprising a quantity of fluid disposed in said means for enclosing an integrated circuit or a MEMS.
57. The hermetically sealed package of claim 56, wherein said quantity of resist is configured to insulate said fluid during an application of said means for hermetically sealing.
58. The hermetically sealed package of claim 55, further comprising a micro-electro mechanical system (MEMS) or a micro-electro-optical mechanical system (MEOMS) disposed in said means for enclosing.
59. The hermetically sealed package of claim 55, further comprising a ring of resist disposed on said package around said means for channeling;
wherein said ring of resist is configured to guide said means for hermetically sealing into said means for channeling.
60. The hermetically sealed package of claim 55, wherein said quantity of resist comprises one of a negative photo resist or a positive photo resist.
61. The hermetically sealed package of claim 55, wherein said means for hermetically sealing a channel comprises a quantity of solder.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A computer-implemented method for Joint Factor Analysis (JFA) scoring in speech processing systems performed by a computerized device, comprising:
carrying out an enrolment session offline to enrol a speaker model in a speech processing system using JFA, including:
extracting speaker factors from the enrolment session;
estimating first components of channel factors from the enrolment session;
carrying out a test session including:
calculating second components of channel factors strongly dependent on the test session; and
generating a score based on speaker factors, channel factors, and test session Gaussian mixture model sufficient statistics to provide a log-likelihood ratio for a test session.
2. The method as claimed in claim 1, wherein estimating first components of channel factors is carried out separately for gender.
3. The method as claimed in claim 1, wherein estimating first components of channel factors is carried out separately for different durations of session.
4. The method as claimed in claim 1, wherein the speech processing is speaker verification and generating a score calculates a log-likelihood ration between a target speaker model and the universal background model for a test session.
5. The method as claimed in claim 1, including:
dividing the computation process for channel factors into first components which are loosely dependent on a test session and are estimated from the enrolment session, and second components which are strongly dependent on a test session.
6. The method as claimed in claim 1, wherein the first components of the channel factors generalize the role of the relevance factor used in a universal background model, Gaussian mixture model maximum a posteriori (UBM-GMM MAP) adaptation.
7. The method as claimed in claim 1, wherein the first and second components are components needed to calculate the posterior expectation of factors.
8. The method as claimed in claim 1, wherein the enrolment session includes:
calculating the zero order statistics (matrix N) for every session in an enrolment dataset;
calculating the mean of matrix N; and
using the mean of matrix N for calculating first components, \u03b2 and \u03b6\u22121.
9. The method as claimed in claim 1, wherein the enrolment session includes:
estimating first components, \u03b2 and \u03b6\u22121 by computing the first components \u03b2T and \u03b6T\u22121 for every session in the enrolment session and calculating their means.
10. The method as claimed in claim 1, wherein the test session includes:
calculating the zero and first order statistics (F, N) for the given test session;
calculating the second component of the channel factors \u03b3\u22121 using N; and
estimating channel factors using the second component \u03b3\u22121, the zero and first order statistics F, N, and the pre-calculated first components \u03b2 and \u03b6\u22121.
11. A computer program product or Joint Factor Analysis (JFA) scoring in speech processing systems, the computer program product comprising:
a computer readable non-transitory storage medium having computer readable program code embodied therewith, the computer readable program code comprising:
computer readable program code configured to:
carry out an enrolment session offline to enrol a speaker model in a speech processing system using JFA, including:
extracting speaker factors from the enrolment session;
estimating first components of channel factors from the enrolment session;
carry out a test session including:
calculating second components of channel factors strongly dependent on the test session; and
generate a score based on speaker factors, channel factors, and test session Gaussian mixture model sufficient statistics to provide a log-likelihood ratio for a test session.
12. A system for Joint Factor Analysis (JFA) scoring in a speech processing system, comprising:
a processor;
an enrolment system for carrying out an enrolment session offline to enrol a speaker model in a speech processing system using JFA, including:
a speaker factor module for extracting speaker factors from the enrolment session;
an estimating module for estimating first components of channel factors from the enrolment session;
a test system for carrying out a test session including:
a calculating module for calculating second components of channel factors strongly dependent on the test session; and
a scoring system for generating a score based on speaker factors, channel factors, and test session Gaussian mixture model sufficient statistics to provide a log-likelihood ratio for a test session.