1. An illuminator comprising:
a fixed panel having at least one light source mounted thereon; and
a pivoting panel hingedly connected to the fixed panel and having at least one light source mounted thereon.
2. The illuminator of claim 1, wherein the fixed panel and the pivoting panel are enclosed within a housing.
3. The illuminator of claim 1, wherein the light sources are infrared light sources.
4. The illuminator of claim 3, wherein the infrared light sources are LEDs.
5. The illuminator of claim 1, comprising a first pivoting panel hingedly connected to one side of the fixed panel and having at least one light source mounted thereon, and a second pivoting panel hingedly connected to the other side of the fixed panel and having at least one light source mounted thereon.
6. The illuminator of claim 1, further comprising means for adjusting the angular orientation of the pivoting panel relative to the fixed panel.
7. The illuminator of claim 1, further comprising a camera.
8. The illuminator of claim 7, wherein the camera is mounted within an opening in one of the fixed panel and the pivoting panel.
9. The illuminator of claim 1, further comprising at least one fan for circulating air.
10. The illuminator of claim 9, comprising a first fan attached to the fixed panel and a second fan attached to the pivoting panel.
11. The illuminator of claim 1, further comprising a controller for varying power delivery to the light sources.
12. An infrared illuminator comprising:
a first member having a first infrared light source mounted thereto;
a second member having a second infrared light source mounted thereto, the second member being positionally adjustable relative to the first member; and
a housing containing the first and second members.
13. The infrared illuminator of claim 12, further comprising at least one fan for delivering cooling air within the housing.
14. The infrared illuminator of claim 12, further comprising a positional adjustment mechanism for varying the position of the second member in relation to the first member such that a field of infrared light projected by the first and second infrared light sources can be modified.
15. The infrared illuminator of claim 12, wherein the positional adjustment mechanism varies the position of the second member in relation to the first member to generate illumination beam angles of between 30\xb0 and 60\xb0.
16. The infrared illuminator of claim 12, wherein the positional adjustment mechanism comprises a pin-and-slot coupling.
17. The infrared illuminator of claim 12, wherein a slot portion of the pin-and-slot coupling is oriented generally perpendicular to the first member.
18. The infrared illuminator of claim 12, wherein the first member is a fixed panel, the second member is a first pivotal panel hingedly coupled to a first side of the fixed panel, and further comprising a second pivotal panel hingedly coupled to a second side of the fixed panel, the second pivotal panel comprising a third infrared light source.
19. The infrared illuminator of claim 18, wherein the fixed panel and the first and second pivotal panels combine to form a generally circular profile.
20. The infrared illuminator of claim 12, further comprising a switch for varying power delivery to the first and second infrared light sources.
21. The infrared illuminator of claim 12, further comprising a camera.
22. An infrared illuminator comprising:
a housing;
a first panel mounted within said housing and having a first plurality of infrared LEDs mounted thereon; and
a second panel hingedly connected to one side of the first panel and having a second plurality of infrared LEDs mounted thereon.
23. The infrared illuminator of claim 22, further comprising a third panel hingedly connected to the other side of the first panel and having a third plurality of infrared LEDs mounted thereon.
24. The infrared illuminator of claim 22, further comprising a switch for varying power delivery to the first and second pluralities of infrared LEDs.
25. The infrared illuminator of claim 22, further comprising a camera.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An image sensor, comprising:
a substrate including a pixel region and a peripheral region;
an interlayered dielectric structure disposed on the substrate and having a first recess region formed on the pixel region and a second recess region formed below a bottom of the first recess region;
a color filter disposed in the second recess region; and
an organic photoelectric layer disposed in the first recess region.
2. The image sensor of claim 1, further comprising:
a photoelectric conversion portion formed in the substrate and overlapped with the color filter; and
a micro lens disposed on the organic photoelectric layer and overlapped with the color filter.
3. The image sensor of claim 1, further comprising:
a first transparent electrode disposed in the first recess region and below the organic photoelectric layer; and
a second transparent electrode disposed in the first recess region and on the organic photoelectric layer.
4. The image sensor of claim 3, further comprising a conductive pad on the interlayered dielectric structure at the peripheral region,
wherein the second transparent electrode covers an entire top surface of the organic photoelectric layer and extends so as to be in contact with the conductive pad.
5. The image sensor of claim 4, further comprising a spacer covering a sidewall of the first recess region and being in contact with the second transparent electrode.
6. The image sensor of claim 4, further comprising:
a storage node region formed in the substrate and electrically isolated from the photoelectric conversion portion; and
a first interconnection structure formed through the interlayered dielectric structure to electrically connect the first transparent electrode to the storage node region.
7. The image sensor of claim 6, wherein the first interconnection structure comprises a top portion protruding from the bottom of the first recess region.
8. The image sensor of claim 6, further comprising a second interconnection structure disposed on the peripheral region and electrically connected to the conductive pad,
wherein the first interconnection structure comprises a plurality of first vias,
the second interconnection structure comprises a plurality of second vias, and
at least one of the first vias is disposed at the same level as that of at least one of the second vias.
9. The image sensor of claim 3, wherein the first transparent electrode is overlapped with the color filter.
10. The image sensor of claim 3, further comprising an etch stop layer interposed in at least one of a plurality of gaps between the first transparent electrode and the interlayered dielectric structure and between the color filter and the interlayered dielectric structure.
11. The image sensor of claim 1, further comprising a protection layer interposed in at least one of a plurality of gaps between the color filter and the interlayered dielectric structure and between the color filter and the organic photoelectric layer.
12. The image sensor of claim 11, wherein the protection layer is formed of at least one of oxide and nitride materials.
13. An image sensor, comprising:
a substrate including a pixel region and a peripheral region;
a plurality of photoelectric conversion portions in the pixel region;
an interlayered dielectric structure disposed on the substrate and having a first recess region formed on the pixel region;
a plurality of second recess regions disposed within the first recess region;
an organic photoelectric layer disposed in the first recess region on the pixel region so as to cover the plurality of photoelectric conversion portions in their entireties; and
a plurality of color filters disposed between the plurality of photoelectric conversion portions and the organic photoelectric layer, the plurality of color filters being disposed on the plurality of the second recess regions and aligned with the plurality of photoelectric conversion portions, respectively.
14. The image sensor of claim 13, further comprising:
a plurality of micro-lenses disposed on the organic photoelectric layer and aligned with the plurality of photoelectric conversion portions, respectively.
15. The image sensor of claim 13, further comprising:
a first transparent electrode disposed in the first recess region between the organic photoelectric layer and the substrate; and
a second transparent electrode disposed in the first recess region, the organic photoelectric layer being between the second transparent electrode and the substrate.