1. A method for generating a recommendation of at least one television program for a viewer, the method comprising:
using the viewer’s television program recommender to access a plurality of user’s recommenders at locations remote from that at which the viewer is located;
using the viewer’s recommender to communicate with a selection of the user’s recommenders to generate data representing, at least one of a negative and positive example feedback from one or more selected other users recommenders to be received; and
generating a recommendation for at least one television program to be watched in the future by the viewer based on at least one of the received negative and positive examples feedback;
said generation of the recommendation being performed at the viewer location utilizing a processor provided as part of the viewer’s television program recommender.
2. The method of claim 1, further comprising generating a user profile for the user based on previous behavior of the user, wherein the determining comprises determining the recommendation based on the negative example and the user profile.
3. The method of claim 2, wherein the generating of the user profile comprises generating an implicit user profile.
4. The method of claim 1, wherein the determining comprises determining the recommendation based on the negative and positive examples.
5. The method of claim 1, further comprising: mapping the negative example to an electronic program guide database of the user; and determining an equivalent negative example for the user from the electronic program database.
6. The method of claim 1, further comprising: mapping the positive example to an electronic program guide database of the user; and determining an equivalent positive example for the user from the electronic program database.
7. The method of claim 1, further comprising determining the one or more other users.
8. The method of claim 7, wherein the determining comprises selecting the one or more other users based on geographical location of the one or more other users.
9. The method of claim 7, wherein the determining comprises selecting the one or more other users based on a similarity of likes andor dislikes with the one or more other users.
10. The method of claim 7, wherein the determining comprises selecting the one or more other users by the user.
11. The method of claim 10, wherein the selecting comprises: presenting a plurality of other users to the user; and the user selecting from among the plurality of other users to determine the one or more other users.
12. The method of claim 11, wherein the presenting comprises presenting the plurality of users based on geographical location of the one or more other users.
13. The method of claim 11, wherein the presenting comprises presenting the plurality of users based on a similarity of likes andor dislikes of the one or more other users.
14. The method of claim 7, wherein the selecting comprises the user indicating the one or more other users.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An apparatus for dissipating heat and shielding electromagnetic radiation from at least one integrated circuit on a printed circuit board, the apparatus comprising:
a printed circuit board comprising a plurality of layers including an inner conducting layer and an exterior layer having a surface with at least one integrated circuit disposed thereon and an electrically conductive region surrounding the at least one integrated circuit, the printed circuit board having a row of electrically conductive through-holes located adjacent to and along one side of the electrically conductive region, the electrically conductive through-holes being in electrical communication with the electrically conductive region and with the conducting layer; and
an electrically conductive cover portion having a top surface and a bottom edge, the top surface having at least one heat-dissipating structure extending therefrom and the bottom edge being in electrically conductive contact with the electrically conductive region of the printed circuit board, the electrically conductive cover portion defining a cavity that encloses the at least one integrated circuit on the surface of the printed circuit board to shield electromagnetic radiation, the at least one integrated circuit being in thermally conductive communication with the electrically conductive cover portion for transferring heat thereto to be dissipated by the at least one heat-dissipating structure.
2. The apparatus of claim 1 wherein the electrically conductive cover portion is rectangular in shape.
3. The apparatus of claim 1 wherein the electrically conductive cover portion is circular in shape.
4. The apparatus of claim 1 wherein the top of the at least one heat-dissipating structure is flat.
5. The apparatus of claim 1 wherein the top of the at least one heat-dissipating is curved.
6. The apparatus of claim 1 wherein the cavity of the electrically conductive cover portion is sized to cover the at least one integrated circuit to within a specified separation distance between a top surface of the at least one integrated circuit and a lower surface of the electrically conductive cover portion.
7. The apparatus of claim 1, further comprising a thermally conductive compound disposed in the cavity of the electrically conductive cover portion to produce thermally conductive communication between the at least one integrated circuit and the electrically conductive cover portion.
8. The apparatus of claim 1, wherein the electrically conductive cover portion includes a hole to insert a malleable thermally conductive compound into the cavity of the electrically conductive cover portion.
9. The apparatus of claim 1, wherein the at least one heat-dissipating structure is an integral part of the electrically conductive cover portion.
10. The apparatus of claim 1, wherein the cavity of the electrically conductive cover portion encloses two or more integrated circuits.
11. The apparatus of claim 1, wherein the electrically conductive region forms a plurality of corners, the side along which the row of through-holes is located extends inwardly from the corners toward the at least one integrated circuit, and the row of electrically conductive through-holes is located in an indented region formed between adjacent corners by the side.
12. A printed circuit board, comprising:
a plurality of layers including an inner conducting layer and an exterior layer having a board surface having an electrically conductive region formed thereon that surrounds an area of the board surface;
a row of electrically conductive through-holes located adjacent to and alone one side of the electrically conductive region, the electrically conductive through-holes being in electrical communication with the electrically conductive region and with the inner conducting layer;
at least one integrated circuit on the board surface within the surrounded area; and
an electrically conductive cover portion having a top surface and a bottom edge, the top surface having at least one heat-dissipating structure extending therefrom, the bottom edge being in electrically conductive contact with the electrically conductive region that surrounds the area with the at least one integrated circuit, the electrically conductive cover portion defining a cavity that encloses the at least one 18 integrated circuit on the board surface to shield electromagnetic radiation, the at least one integrated circuit being in thermally conductive communication with the electrically conductive cover portion for transferring heat thereto to be dissipated by the at least one heat-dissipating structure.
13. The printed circuit board of claim 12, wherein the electrically conductive cover portion is rectangular in shape.
14. The printed circuit board of claim 12, wherein the cavity of the electrically conductive cover portion is sized to cover the at least one integrated circuit to within a specified separation distance between a top surface of the at least one integrated circuit and a lower surface of the electrically conductive cover portion.
15. The printed circuit board of claim 12, further comprising a thermally conductive compound disposed in the cavity of the electrically conductive cover portion to produce thermally conductive communication between the at least one integrated circuit and the electrically conductive cover portion.
16. The printed circuit board of claim 12, wherein the electrically conductive cover portion includes a hole to insert a malleable thermally conductive compound into the cavity of the electrically conductive cover portion.
17. The printed circuit board of claim 12, wherein the at least one heat-dissipating structure is an integral part of the electrically conductive cover portion.
18. The printed circuit board of claim 12, wherein the cavity of the electrically conductive cover portion encloses two or more integrated circuits.
19. The printed circuit board of claim 12, wherein the electrically conductive region forms a plurality of corners, the side along which the row of through-holes is located extends inwardly from the corners toward the at least one integrated circuit, and the row of electrically conductive through-holes is located in an indented region formed between adjacent corners by the side.