1. A process for preparing \u03b1-chloroisopropyl-substituted aromatics of the formula I
where n is an integer from 2 to 4
comprising treating at least one isopropenyl-substituted aromatic of the formula II
with hydrogen chloride in the absence of a solvent,
wherein the benzene ring of the isopropenyl-substituted aromatic of formula (II) may optionally bear one or more substituents which do not impair reaction of said aromatic of formula (II) and hydrogen chloride, whereby the benzene ring of the \u03b1-chloroisopropyl-substituted aromatics of the formula I will bear the same substituents.
2. A process as claimed in claim 1, wherein the treatment is effected at a temperature of from \u221210 to 50\xb0 C.
3. A process as claimed in claim 1, wherein the treatment is effected at a pressure of from 1 to 10 bar.
4. A process as claimed in claim 1, wherein said isopropyl isopropenyl-substituted aromatic of the formula II is 1,3-diisopropenylbenzene.
5. A process as claimed in claim 1, wherein the treatment is accelerated by the presence of a Lewis or Br\xf6nsted acid catalyst.
6. A process as claimed in claim 2, wherein the treatment is effected at a temperature of from 0 to 15\xb0C.
7. A process as claimed in claim 1, wherein n is 2 or 3.
8. A process as clained in claim 1, wherein the isopropenyl-substituted aromatic of formula (II) is at least one of 1,3,5-triisopropenylbenzene, 1,4-diisopropenylbenzene and 1,3-diisopropenylbenzene.
9. A process as claimed in claim 1, wherein the benzene ring of the isopropenyl-substitued aromatic of formula (II) bears said one or more substituents.
10. A process as claimed in claim 9, wherein the substituents are selected from the group consisting of C1\u2013C4-alkyl radicals.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A plating apparatus that performs electrolytic plating on an object, comprising:
a plating tank for containing a plating solution;
an anode provided in said plating tank;
a conductive member capable of coming in contact with said object;
a DC power supply;
a wire arranged to electrically connect said DC power supply to said anode and said conductive member;
a circuit for inspection configured to form a closed circuit for causing a current to flow through said wire and not through said plating solution and said object during inspection of said wire; and
a detector that detects the presenceabsence of connection failure of the wire in a state where said closed circuit causes the current to flow through said wire.
2. The plating apparatus according to claim 1, wherein said closed circuit is formed to include said DC power supply.
3. The plating apparatus according to claim 2, wherein said circuit for inspection includes a load and a switch, and said load and said switch are connected such that said closed circuit including said load and said switch is formed when said switch is turned on.
4. The plating apparatus according to claim 3, wherein said DC power supply has a function of performing constant current control such that a constant current flows through said closed circuit during the inspection of said wire.
5. The plating apparatus according to claim 4, wherein said detector detects a voltage of said DC power supply, and detects the presenceabsence of connection failure of the wire based on the detected voltage.
6. The plating apparatus according to claim 5, wherein said detector detects the presence of connection failure of the wire when a value of said detected voltage is larger than a value of a predetermined reference voltage.
7. The plating apparatus according to claim 3, wherein
said wire includes a first wire that connects said anode and one electrode of said DC power supply to each other and a second wire that connects said conductive member and the other electrode of said DC power supply to each other, and
said switch and said load are connected in series between said first wire and said second wire.
8. The plating apparatus according to claim 1, further comprising an output unit that outputs a detection signal when the presence of connection failure of the wire is detected by said detector.
9. The plating apparatus according to claim 1, wherein
said object is a long-sized substrate,
said plating apparatus further includes a transport mechanism arranged to transport said long-sized substrate and cause said long-sized substrate to pass through said plating tank, and
said conductive member is a conductive roller provided to come in contact with the long-sized substrate transported by said transport mechanism.
10. A wire inspection method of a plating apparatus for inspecting a wire, which electrically connects a DC power supply to an anode provided in a plating tank of the plating apparatus and to a conductive member capable of coming in contact with an object, for connection failure, comprising the steps of:
forming a closed circuit that causes a current to flow through said wire and not through a plating solution and said object during inspection of said wire; and
detecting the presenceabsence of connection failure of said wire in a state where said closed circuit causes the current to flow through said wire.