1. An equalization method, comprising:
low-pass filtering an input data signal to produce a low-pass filtered signal;
subtracting the low-pass filtered signal from the input data signal to produce an output data signal;
determining correlation measurements, from the output data signal, that are representative of a pulse response; and
determining an adjustment, to the low-pass filtering, from the correlation measurements, wherein determining the adjustment further comprises:
analyzing the correlation measurements to determine a slope trend, and
adjusting a pole frequency, of the low-pass filtering, on the basis of the slope trend.
2. The method of claim 1, wherein the low-pass filtering is performed by a first order filter.
3. The method of claim 1, wherein the subtracting is performed by a sampling capacitor.
4. The method of claim 1, wherein the step of subtracting comprises determination of a correlation.
5. The method of claim 4, wherein the step of determination of a correlation further comprises the following steps:
thresholding, according to a first threshold, the output data signal at a first time of a first sample clock to produce a first value; and
thresholding, according to a second threshold, the output data signal at a second time of a second sample clock to produce a second value.
6. The method of claim 5, wherein the first threshold is chosen to identify data symbols in the output data signal.
7. The method of claim 5, wherein the second threshold is chosen to identify a type of inter-symbol interference affecting a symbol represented in the output data signal at the second time.
8. The method of claim 5, further comprising the following steps:
multiplying first value by the second value to produce a product;
adding the product to a correlation sum.
9. The method of claim 1, wherein the step of analyzing the correlation measurements to determine a slope trend further comprises:
determining a first sum of temporally later tail values;
determining a second sum of temporally earlier tail values; and
subtracting the second sum from the first sum.
10. The method of claim 1, wherein the step of determining an adjustment further comprises the following step:
analyzing the correlation measurements to determine an area.
11. The method of claim 10, wherein the step of determining an adjustment further comprises the following step:
adjusting a gain, of the low-pass filtering, on the basis of the area.
12. An equalization system, comprising:
a sub-system configured to low-pass filter an input data signal to produce a low-pass filtered signal;
a sub-system configured to subtract the low-pass filtered signal from the input data signal to produce an output data signal;
a sub-system configured to determine correlation measurements, from the output data signal, that are representative of a pulse response; and
a sub-system configured to determine an adjustment, to the low-pass filtering, from the correlation measurements, wherein determining the adjustment further comprises:
analyzing the correlation measurements to determine a slope trend, and
adjusting a pole frequency, of the low-pass filtering, on the basis of the slope trend.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1-7. (canceled)
8. A process for a molded article which is shaped by molding, said process comprising:
preparing a material comprising a thermoplastic resin composition containing 100 parts by weight of a thermoplastic resin and 0.1 to 100 parts by weight of an inorganic compound dispersed in said thermoplastic resin in a die by transferring a shape of the die the inorganic compound being at least one of silica and laminar silicate, and the dispersion particle diameter of the silica being 2 \u03bcm or less and the laminar silicate having an average length of 0.01 to 3 \u03bcm;
heating said thermoplastic resin composition;
pressing said thermoplastic resin composition in a softened state to the die;
cooling said thermoplastic resin composition to a temperature between the glass transition temperature minus 20\xb0 C. or higher;
and peeling said thermoplastic resin composition from the die at a temperature between the glass transition temperature minus 20\xb0 C. or higher so that the molded article wherein not less than 75% of the shape of the article molded before cooling is maintained at temperatures above the glass transition point of said thermoplastic resin.
9. The process for a molded article which is shaped by molding according to claim 1, wherein the thermoplastic resin is a crystalline thermoplastic resin.
10. The process for a molded article which is shaped by molding according to claim 1, wherein said inorganic compound is an inorganic compound containing silicon and oxygen as constituent elements.
11. The process for a molded article which is shaped by molding according to claim 2, wherein said inorganic compound is an inorganic compound containing silicon and oxygen as constituent elements.