1. A method comprising the steps of:
placing about thirty-two fluid ounces of water into a receptacle;
placing the receptacle with water on a burner and bringing the water to a boil;
ceasing to heat the water;
adding about one tablespoonful of tea beverage flavorant to the water; and
brewing the combination of the water and the tea beverage flavorant for about three to five minutes.
2. The method of claim 1 further comprising
filtering out any solid tea in the combination of water and tea beverage flavorant.
3. The method of claim 1 further comprising
consuming the combination of the water and the tea beverage flavorant.
4. The method of claim 3 wherein
the temperature of the combination of the water and the tea beverage flavorant at the time that the water and the tea beverage flavorant are consumed is between one hundred forty and one hundred sixty degrees Fahrenheit.
5. The method of claim 1 further comprising
placing the combination of the water and the tea beverage flavorant into a disposable plastic bottle.
6. The method of claim 1 further comprising
performing the previous steps once before breakfast.
7. The method of claim 1 further comprising
performing the previous steps once before dinner.
8. The method of claim 1 further comprising
performing the previous steps once before breakfast and once before dinner.
9. A method comprising the steps of
mixing water and a tea beverage flavorant together in the proportions of about thirty-two fluid ounces for about every one tablespoonful of tea beverage flavorant to form a mixture;
and placing the mixture in a disposable plastic bottle.
10. A method comprising the steps of
mixing water and a tea beverage flavorant together in the proportions of about thirty-two fluid ounces for about every one tablespoonful of tea beverage flavorant to form a mixture;
and consuming the mixture.
11. An apparatus comprising
a disposable plastic bottle; and
a mixture of water and a tea beverage flavorant in the proportions of about thirty-two fluid ounces of water for about every one tablespoonful of tea beverage flavorant;
and wherein the mixture is located inside the disposable plastic bottle.
12. A method comprising the steps of:
placing about thirty-two fluid ounces of water into a receptacle;
placing the receptacle with water on a burner and bringing the water to a boil;
ceasing to heat the water;
adding about five grams of tea beverage flavorant to the water; and
brewing the combination of the water and the tea beverage flavorant for about three to five minutes.
13. The method of claim 12 further comprising
filtering out any solid tea in the combination of water and tea beverage flavorant.
14. The method of claim 12 further comprising
consuming the combination of the water and the tea beverage flavorant.
15. The method of claim 14 wherein
the temperature of the combination of the water and the tea beverage flavorant at the time that the water and the tea beverage flavorant are consumed is between one hundred forty and one hundred sixty degrees Fahrenheit.
16. The method of claim 12 further comprising
placing the combination of the water and the tea beverage flavorant into a disposable plastic bottle.
17. A method comprising the steps of
mixing water and a tea beverage flavorant together in the proportions of about thirty-two fluid ounces for about every five grams of tea beverage flavorant to form a mixture;
and placing the mixture in a disposable plastic bottle.
18. A method comprising the steps of
mixing water and a tea beverage flavorant together in the proportions of about thirty-two fluid ounces for about every five grams of tea beverage flavorant to form a mixture;
and consuming the mixture.
19. An apparatus comprising
a disposable plastic bottle; and
a mixture of water and a tea beverage flavorant in the proportions of about thirty-two fluid ounces of water for about every five grams of tea beverage flavorant;
and wherein the mixture is located inside the disposable plastic bottle.
20. A method comprising
during a first phase for a first day, ingesting into a human body about twelve fluid ounces of a first mixture at least twice for the first day, including once before breakfast for the first day and once before dinner for the first day, wherein the first mixture is in a ratio of about one tablespoonful of tea beverage flavorant to thirty-two fluid ounces of water;
after the first phase is complete, during a second phase for twenty-four months, ingesting into a human body about thirty-two fluid ounces of the first mixture at least twice a day for each day of the twenty-four month second phase, including once before breakfast for each day of the second phase and once before dinner for each day of the second phase;
wherein the first mixture has a temperature of approximately between one hundred forty and one hundred sixty degrees Fahrenheit; and
wherein the second phase is continued for a period of about twenty-four months and then stopped to prevent dehydration.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An optical data link comprising:
a housing;
a circuit board provided in the housing;
a semiconductor electrical device provided on the circuit board;
an electrically insulative member covering the semiconductor device;
an optical subassembly supported by the housing, the optical subassembly including a semiconductor optical device connected to the semiconductor electrical device through the circuit board;
a first heat spreader provided between the housing and the semiconductor electrical device, the first heat spreader being in contact with the housing; and
a second heat spreader provided between the housing and the optical subassembly, the second heat spreader being in contact with the housing and the optical subassembly,
wherein the second heat spreader is located apart from the first heat spreader.
2. The optical data link according to claim 1,
wherein the housing includes a base and a cover, the base supports the circuit board, and the circuit board is provided between the base and the cover,
wherein the semiconductor electrical device is provided between the circuit board and the cover,
wherein the first heat spreader is provided between the circuit board and the cover so as to be in contact with the cover and the insulative member, and
wherein the second heat spreader is provided between the optical subassembly and the cover so as to be in contact with the cover.
3. The optical data link according to claim 1,
wherein the housing includes a base and a cover, the base supports the circuit board, and the circuit board is provided between the base and the cover,
wherein the semiconductor device is provided between the circuit board and the base,
wherein the circuit board has a thermal via provided is in a predetermined region thereof and the semiconductor device is mounted on the predetermined region, and
wherein the first heat spreader is provided between the circuit board and the cover so as to be in contact with the cover and the thermal via.
4. The optical data link according to claim 1,
wherein the housing includes a base and a cover, the base supports the circuit board, and the circuit board is provided between the cover and the base,
wherein the semiconductor electrical device is provided between the circuit board and the cover,
wherein the first heat spreader is provided between the circuit board and the cover so as to be in contact with the cover and the insulative member, and
wherein the second heat spreader is provided between the optical subassembly and the base so as to be in contact with the base.
5. The optical data link according to claim 1,
wherein the housing includes a base and a cover, the base supports the circuit board, and the circuit board is provided between the base and the cover,
wherein the semiconductor electrical device is provided between the circuit board and the base,
wherein the first heat spreader is provided between the circuit board and the base so as to be in contact with the base and the insulative member, and
wherein the second heat spreader is provided between the optical subassembly and the cover so as to contact with the cover.
6. The optical data link according to claim 1,
wherein the housing includes a base and a cover, the base supports the circuit board, and the circuit board is provided between the base and the cover,
wherein the semiconductor electrical device is provided between the circuit board and the base,
wherein the first heat spreader is provided between the circuit board and the base so as to be in contact with the base and the insulative member, and
wherein the second heat spreader is provided between the optical subassembly and the base so as to be in contact with the base.
7. The optical data link according to claim 1,
wherein the first heat spreader is in contact with a first region of the cover,
wherein the second heat spreader is in contact with a second region of the cover, and
wherein the cover has an opening provided between the first and second regions.
8. The optical data link according to claim 2,
wherein the base and the cover form a cavity and the circuit board is provided in the cavity, and
wherein the cover has first and second fingers, the first finger is bent into the cavity so as to be in contact with the first heat spreader, and the second finger is bent into the cavity so as to be in contact with the second heat spreader.
9. The optical data link according to claim 8,
wherein the cover has a side wall and a lid, and
wherein the first and second fingers are provided in at least one of the side wall and the lid.
10. The optical data link according to claim 8,
wherein the cover has an opening provided between the first and second fingers.
11. The optical data link according to claim 2,
wherein the base supports a plurality of lead terminals, and
wherein the circuit board makes an angle from 10 degrees to 80 degrees with respect to the base.
12. The optical data link according to claim 8, further comprising:
another optical subassembly provided in the housing;
another circuit board provided in the housing; and
an electronic component mounted on the other circuit board, the electronic component being electrically connected to the other optical subassembly, and
wherein the cover has a third finger bent into the cavity for transferring heat from the second circuit board, and
wherein the cover has an opening provided between the first and third fingers.
13. The optical data link according to claim 1,
wherein the circuit board includes a conductive pattern provided on a primary surface thereof,
wherein the conductive pattern is connected to the semiconductor device, and
wherein the first heat spreader is in contact with the conductive pattern.
14. The optical data link according to claim 1, further comprising:
a connection board connected with the optical subassembly; and
a flexible printed board connecting the circuit board with the connection board,
wherein the optical subassembly has a lead terminal connected to the connection board.
15. The optical data link according to claim 1,
wherein the first and second heat spreaders are electrically insulative.
16. The optical data link according to claim 1,
wherein at least one of the first and second heat spreaders have elasticity sufficient to deform in accordance with the shapes of the cover, the semiconductor electrical device and optical subassembly.
17. The optical data link according to claim 1,
wherein at least one of the first and second heat spreaders includes a silicone gel.
18. The optical data link according to claim 1,
wherein the semiconductor optical device contains a semiconductor light-emitting device driven by the semiconductor electrical device.
19. The optical data link according to claim 1,
wherein the first and second heat spreaders are made of material having a thermal conductivity of 0.5 to 50 WmK.
20. The optical data link according to claim 1,
wherein the first and second heat transfer are made of material having hardness of 10 to 100 under the ASKER-C defined in the Society of Rubber Institute Standard (SRIS) 0101.