1. A method for creating and maintaining an Internet-based, relational legal database for tracking and providing information regarding selected large companies, Law Firms, Attorneys and other employees employed by the Law Firms, and Lawsuits in which the Law Firms represent at least one of the selected large companies as a party, wherein the relational legal database is hosted on a server and maintained and administered by an Internet-based, relational legal database Proprietor to perform maintenance and administration of the relational legal database via a local computer having a processor, the method comprising the steps of:
loading data about each tracked Law Firm into the relational legal database;
assigning a unique Law Firm ID to each Law Firm, using the relational legal database;
obtaining from remote Law Firm web sites over the Internet Attorney data for each Attorney listed on each Law Firm’s web site, using a computer program for extracting content from a Web site;
bulk adding or updating the Attorney data into the relational legal database, using a data loader;
assigning a unique Contact ID to each Attorney in the relational legal database, using the relational legal database;
obtaining Lawsuit data from remote court databases over the Internet data;
loading the Lawsuit data into the legal relational database, using a data loader;
assigning a unique Matter ID to each Lawsuit in the legal relational database, using the relational legal database;
obtaining from independent web sites over the Internet Company data for each selected large company;
loading the Company data into the relational legal database, using a data loader;
assigning a unique Party ID to each selected large company in the relational legal database, using the relational legal database;
associating all of the Party IDs for the selected large companies associated with Lawsuits where they are represented by Law Firms tracked by the relational legal database;
updating in bulk over the Internet to the relational legal database the selected large companies associated with Lawsuits where they are represented by Law Firms tracked by the relational legal database, using a data loader;
associating the Party IDs for the selected large companies associated with tracked Lawsuits where the selected large companies are represented by tracked Law Firms; and
updating the relational legal database with the selected large companies associated with tracked Lawsuits.
2. A system and method for gathering and analyzing litigation marketplace intelligence data that facilitates transfer of data from court docket databases to a customer relationship management program using an online, on-demand productivity application, as described.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
What is claimed is:
1. A sensor assembly, comprising:
a number of sensor elements exhibiting a first coefficient of thermal expansion; and
an encapsulant covering said number of sensor elements, said encapsulant exhibiting a second coefficient of thermal expansion approximately equal to said first coefficient of thermal expansion.
2. The sensor assembly of claim 1, wherein said encapsulant comprises a curable adhesive.
3. The sensor assembly of claim 2, wherein said curable adhesive is doped with an additive, such that said first coefficient of thermal expansion is substantially equal to said second coefficient of thermal expansion.
4. The sensor assembly of claim 2, wherein said additive exhibits a third coefficient of thermal expansion lower than said first coefficient of thermal expansion.
5. The sensor assembly of claim 2, wherein said additive comprises a ceramic material.
6. The sensor assembly of claim 2, wherein said additive comprises a material selected from the group consisting of Aluminum Oxide, Magnesium Oxide, and Silicon Oxide.
7. The sensor assembly of claim 1, wherein said number of sensor elements comprises metallic material.
8. The sensor assembly of claim 1, wherein said number of sensor elements comprises a respective number of copper coils.
9. The sensor assembly of claim 1, wherein said number of sensor elements comprises a plurality of sensor elements.
10. The sensor assembly of claim 1, wherein said number of sensor elements comprises a plurality of sensor elements, and said encapsulant covers said plurality of sensor elements to form an integral sensor assembly.
11. The sensor assembly of claim 1, wherein said number of sensor elements is configured to provide location data for medical procedures.
12. The sensor assembly of claim 1, wherein said sensor assembly is configured for installation on a catheter.
13. A sensor assembly, comprising:
a number of sensor elements exhibiting a first coefficient of thermal expansion; and
an encapsulant covering said number of sensor elements, said encapsulant comprising a curable adhesive and an additive, wherein said curable adhesive exhibits a second coefficient of thermal expansion greater than said first coefficient of thermal expansion, and said additive exhibits a third coefficient of thermal expansion less than said first coefficient of thermal expansion.
14. The sensor assembly of claim 13, wherein said additive comprises a ceramic material.
15. The sensor assembly of claim 13, wherein said additive comprises a material selected from the group consisting of Aluminum Oxide, Magnesium Oxide, and Silicon Oxide.
16. The sensor assembly of claim 13, wherein said number of sensor elements comprises metallic material.
17. The sensor assembly of claim 13, wherein said number of sensor elements comprises a respective number of copper coils.
18. The sensor assembly of claim 13, wherein said number of sensor elements comprises a plurality of sensor elements.
19. The sensor assembly of claim 13, wherein said number of sensor elements comprises a plurality of sensor elements, and said encapsulant covers said plurality of sensor elements to form an integral sensor assembly.
20. The sensor assembly of claim 13, wherein said number of sensor elements is configured to provide location data for medical procedures.
21. The sensor assembly of claim 13, wherein said sensor assembly is configured for installation on a catheter.
22. A medical sensor assembly, comprising:
a number of sensor elements configured to provide location data for medical procedures; and
an encapsulant covering said number of sensor elements, said encapsulant comprising a curable adhesive and an additive.
23. The medical sensor assembly of claim 22, wherein said number of sensor elements exhibits a first coefficient of thermal expansion, said curable adhesive exhibits a second coefficient of thermal expansion greater than said first coefficient of thermal expansion, and said additive exhibits a third coefficient of thermal expansion less than said first coefficient of thermal expansion.
24. The medical sensor assembly of claim 22, wherein said additive comprises a ceramic material.
25. The medical sensor assembly of claim 22, wherein said additive comprises a material selected from the group consisting of Aluminum Oxide, Magnesium Oxide, and Silicon Oxide.
26. The medical sensor assembly of claim 22, wherein said number of sensor elements exhibits a first coefficient of thermal expansion, said curable adhesive exhibits a second coefficient of thermal expansion greater than said first coefficient of thermal expansion, and said additive exhibits a third coefficient of thermal expansion between said first and second coefficients of thermal expansion.
27. The medical sensor assembly of claim 22, wherein said additive comprises microspheres.
28. The medical sensor assembly of claim 22, wherein said number of sensor elements comprises metallic material.
29. The medical sensor assembly of claim 22, wherein said number of sensor elements comprises a respective number of copper coils.
30. The medical sensor assembly of claim 22, wherein said number of sensor elements comprises a plurality of sensor elements.
31. The medical sensor assembly of claim 22, wherein said number of sensor elements comprises a plurality of sensor elements, and said encapsulant covers said plurality of sensor elements to form an integral sensor assembly.
32. The medical sensor assembly of claim 22, wherein said sensor assembly is configured for installation on a catheter.
33. A method of making a sensor assembly, comprising:
selecting a number of sensor elements that exhibit a first coefficient of thermal expansion;
selecting an encapsulant having a second coefficient of thermal expansion based on said first coefficient of thermal expansion; and
covering said number of sensor elements with said encapsulant.
34. The method of claim 33, wherein said first coefficient of thermal expansion is approximately equal to said second coefficient of thermal expansion.
35. The method of claim 33, further comprising forming said encapsulant by:
selecting an adhesive that exhibits a third coefficient of thermal expansion different from said first coefficient of thermal expansion;
selecting a quantity of additive that exhibits a fourth coefficient of thermal expansion, such that a combination of said adhesive and said additive exhibits said second coefficient of thermal expansion; and
doping said adhesive with said additive.
36. The method of claim 35, wherein said third coefficient of thermal expansion is greater than said first coefficient of thermal expansion, and said fourth coefficient of thermal expansion is less than said first coefficient of thermal expansion.
37. The method of claim 35, wherein said additive comprises a ceramic material.
38. The method of claim 35, wherein said additive comprises a material selected from the group consisting of Aluminum Oxide, Magnesium Oxide, and Silicon Oxide.
39. The method of claim 35, wherein said third coefficient of thermal expansion is greater than said first coefficient of thermal expansion, and said fourth coefficient of thermal expansion is between said first and coefficients of thermal expansion.
39. The method of claim 35, wherein said additive comprises microspheres.
40. The method of claim 33, wherein said number of sensor elements comprises metallic material.
41. The method of claim 33, further comprising arranging said number of sensor elements to provide location data for medical procedures.
42. The method of claim 33, wherein said number of sensor elements comprises a plurality of sensor elements.
43. The method of claim 33, wherein said number of sensor elements comprises a plurality of sensor elements, said method further comprising covering the plurality of sensor elements to form an integral assembly.