1. A fuel-injection system for an internal combustion engine comprising:
at least one fuel distributor having a fuel-supply channel;
at least one fuel injector;
at least one valve seat having an inner longitudinal opening into which the fuel injector is insertable, the at least one valve seat having an end facing away from the fuel-supply channel, the at least one valve seat, by the end, ending freely exposed, the at least one valve seat configured for insertion of the fuel injector through the freely exposed end; and
at least one retaining element for the loss-proof mounting of the fuel injector inside the valve seat, the at least one retaining element being one of premolded with and formed on the end of the valve seat.
2. The fuel-injection system according to claim 1, wherein the at least one retaining element includes at least one detent directed radially inward.
3. The fuel-injection system according to claim 2, wherein the at least one detent includes three detents spaced at a distance from each other and formed at the valve seat.
4. The fuel-injection system according to claim 1, wherein the valve seat has a contour that deviates from a cylindrical form.
5. The fuel-injection system according to claim 1, wherein, to receive the fuel injector, the valve seat has an inner longitudinal opening which has a contour that deviates from a cylindrical form.
6. The fuel-injection system according to claim 5, wherein at least one of the valve seat and the inner longitudinal opening has a circular contour with at least one flattened region.
7. The fuel-injection system according to claim 1, further comprising a contact bar affixed to the fuel distributor and ending in a central connector, each of the at least one fuel injector being connected to electrical lines of the contact bar via which electrical contacting of the fuel injector is implemented.
8. The fuel-injection system according to claim 7, wherein the valve seat has a lateral recess through which electrical connections for the electrical contacting of the fuel injector are guided.
9. The fuel-injection system according to claim 1, further comprising at least one of an axial seal and a radial seal for sealing the valve seat from one of an intake manifold and another cylinder-head module.
10. The fuel-injection system according to claim 1, further comprising an axially-sealing sealing element for sealing the fuel injector from the fuel distributor, the sealing element being situated between a shoulder of the fuel distributor and an upstream end of the fuel injector.
11. The fuel-injection system according to claim 1, wherein, after an insertion and securing of the fuel injector in the valve seat, more than 50% of an overall length of the fuel injector extends inside the longitudinal opening of the valve seat.
12. The fuel-injection system according to claim 1, wherein the at least one valve seat extends from and is integral with the fuel distributor.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
What is claimed is:
1. A method of forming microelectronic packages of the type including a microelectronic device, a receptacle formed of an insulative material and defining a cavity for receipt of the microelectronic device, and a leadframe formed of a conductive material and facilitating electrical connection of the microelectronic device to an external circuit, characterized in that the packages are formed in a continuous process comprising:
moving a continuous strip of an electrically conductive substrate material along a feed path;
at a removal station along the feed path, the step of removing material from the continuous strip to define a series of successive connected leadframes from the remaining material with each leadframe including a series of leads; and
at a forming station along the feed path, spaced downstream from the removal station, the step of forming a receptacle of electrically insulative material on the substrate strip at a respective leadframe, with each receptacle defining a cavity for receipt of a microelectronic device and with each receptacle formed integral with the respective leadframe, such that the leads of the leadframe extend from the cavity to the exterior of the receptacle to facilitate electrical connection of the microelectronic device to an external circuit; and
at an attachment station, the step of placing a microelectronic device in the receptacle.
2. The method of claim 1 comprising the further step of plating the continuous strip of substrate.
3. The method of claim 2 wherein the step of plating the continuous strip of substrate is performed before the forming step.
4. The method of claim 3 wherein the step of plating comprises a plurality of plating steps.
5. The method of claim 1 comprising the further step of bonding wires from the microelectronic device to the leads positioned within the cavity.
6. The method of claim 5 comprising the further step of filling the cavity with a liquid to encapsulate the device within the cavity.
7. The method of claim 6 comprising the further step of covering the receptacle with a lid.
8. The method of claim 7 comprising the further step of marking the package.
9. The method of claim 8 comprising the further step of plating the leads.
10. The method of claim 9 wherein the step of plating comprises a plurality of plating steps.
11. The method of claim 8 comprising the step of separating the continuous strip into discrete sections containing one or more packages.
12. The method of claim 1 wherein the removal step comprises the application of a resist, and the subsequent immersion into an etchant bath.
13. The method of claim 1 comprising the further step of separating the continuous strip into discrete sections containing one or more packages.
14. A method of forming microelectronic packages comprising:
moving a continuous strip of an electrically conductive substrate material along a feed path;
removing material from the continuous strip to define a series of successive connected leadframes from the remaining material with each leadframe including a series of leads;
forming a receptacle of electrically insulative material on the substrate strip proximate each successive leadframe, with each receptacle defining a cavity for receipt of a microelectronic device. and with each receptacle encapsulating the respective leadframe such that the leads of the leadframe extend from the cavity to the exterior of the receptacle to facilitate electrical connection of the microelectronic device to an external circuit; and
attaching a microelectronic in the receptacle.
15. The method of claim 14 comprising the further step of plating the continuous strip of substrate.
16. The method of claim 15 wherein the further step of plating comprises a plurality of plating steps.
17. The method of claim 14 comprising the further step of separating the continuous strip into discrete sections containing one or more receptacles.
18. A method of forming microelectronic packages of the type including a microelectronic device, a receptacle formed of an insulative material and defining a cavity for receipt of the microelectronic device, and a leadframe formed of a conductive material and facilitating electrical connection of the microelectronic device to an external circuit, characterized in that the packages are formed in a continuous process comprising:
moving a continuous strip of an electrically conductive substrate material along a feed path;
at a removal station along the feed path, removing material from the continuous strip to define a series of successive connected leadframes from the remaining material with each leadframe including a series of leads;
at a forming station along the feed path downstream from the removal station, forming a receptacle of electrically insulative material on the substrate strip proximate each successive leadframe with each receptacle defining a cavity for receipt of a microelectronic device, and with each receptacle encapsulating the respective leadframe such that the leads of the leadframe extend from the cavity to the exterior of the receptacle to facilitate electrical connection of the microelectronic device to an external circuit;
at a plating station along the feed path, plating the continuous strip of substrate in one or more plating baths;
at a device attachment station along the feed path, securing a microelectronic device within each cavity;
at a connection station along the feed path, electrically connecting the microelectronic device to the leads positioned within the cavity of each package;
at a liquid fill station along the feed path, filling each cavity with a liquid encapsulant;
at a curing station along the feed path, curing the liquid encapsulant;
at a sealing station along the feed path, covering each package with a lid to seal each package;
at a marking station along the feed path, marking each package; and
at a separation station along the feed path, separating the continuous strip into discrete sections containing one or more packages.