1. A method for forming a silicon oxide film on a substrate via a vapor deposition process, the method comprising:
introducing an organoaminosilane represented by the formulas:
wherein R is selected from a C1-C10 linear, branched, or cyclic, saturated or unsaturated alkyl group with or without substituents; a C5-C10 aromatic group with or without substituents, a C3-C10 heterocyclic group with or without substituents, or a silyl group in formula C with or without substituents, R1 is selected from a C3-C10 linear, branched, cyclic, saturated or unsaturated alkyl group with or without substituents; a C5-C10 aromatic group with or without substituents, a C3-C10 heterocyclic group with or without substituents, a hydrogen atom, a silyl group with substituents and wherein R and R1 in formula A also being combinable into a cyclic group comprising from 2 to 6 carbon atoms and R2 representing a single bond, (CH2), chain, a ring, C3-C10 branched alkyl, SiR2, or SiH2 into a deposition chamber;
introducing at least one oxidizing agent into the deposition chamber wherein the at least one oxidizing agent reacts with the organoaminosilane to provide the silicon oxide film on the substrate
wherein the vapor deposition process is at least one selected from the group consisting of at least one selected from chemical vapor deposition, low pressure vapor deposition, plasma enhanced chemical vapor deposition, cyclic chemical vapor deposition, plasma enhanced cyclic chemical vapor deposition, atomic layer deposition, and plasma enhanced atomic layer deposition, and
wherein the vapor deposition process is conducted at one or more temperatures ranging from 25\xb0 C. to 375\xb0 C.
2. The method of claim 1 wherein the vapor deposition process comprises a plasma.
3. The method of claim 2 wherein the plasma is directly generated in the deposition chamber.
4. The method of claim 2 wherein the plasma is generated outside of the deposition chamber and supplied into the deposition chamber.
5. A composition for depositing a silicon-containing film by a vapor deposition process, the composition comprising:
an organoaminosilane precursor represented by the following formula A:
wherein R is selected from a C1-C10 linear, branched, or cyclic, saturated or unsaturated alkyl group with or without substituents; a C5-C10 aromatic group with or without substituents, a C3-C10 heterocyclic group with or without substituents and R1 is selected from a C3-C10 linear, branched, cyclic, saturated or unsaturated alkyl group with or without substituents; a C5-C10 aromatic group with or without substituents, a C3-C10 heterocyclic group with or without substituents, a hydrogen atom, a silyl group with substituents and wherein R and R1 in formula A also being combinable into a cyclic group;
a gas selected from the group consisting of an inert gas and nitrogen.
6. The composition of claim 5 wherein R and R1 in Formula A are each independently selected from the group consisting of isopropyl, t-butyl, sec-butyl, t-pentyl, and sec-pentyl groups.
7. The composition of claim 6 wherein R and R1 in Formula A are each isopropyl.
8. The composition of claim 6 wherein R and R1 in Formula A are each sec-butyl.
9. The composition of claim 5 wherein R and R1 in Formula A are combined into a cyclic group.
10. A composition for depositing a silicon-containing film in a vapor deposition process, the composition comprising:
an organoaminosilane precursor represented by the following formula; and
a gas selected from the group consisting of an inert gas and nitrogen.
11. The composition of claim 10 wherein the gas comprises the inert gas.
12. The composition of claim 11 wherein the inert gas comprises helium.
13. The composition of claim 10 wherein the composition is contained in a pressurizable vessel fitted with the proper valves and fittings to allow delivery of to the process reactor.
14. A precursor formulation comprising:
an organoaminosilane represented by the formulae:
wherein R is selected from a C1-C10 linear, branched, or cyclic, saturated or unsaturated alkyl group with or without substituents; a C5-C10 aromatic group with or without substituents, a C3-C10 heterocyclic group with or without substituents, or a silyl group in formula C with or without substituents, R1 is selected from a C3-C10 linear, branched, cyclic, saturated or unsaturated alkyl group with or without substituents; a C5-C10 aromatic group with or without substituents, a C3-C10 heterocyclic group with or without substituents, a hydrogen atom, a silyl group with substituents and wherein R and R1 in formula A also being combinable into a cyclic group comprising from 2 to 6 carbon atoms and R2 representing a single bond, (CH2), chain, a ring, C3-C10 branched alkyl, SiR2, or SiH2 into a deposition chamber; and a solvent.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A mounting device for mounting a heat sink to an electric unit comprising:
at least a pair of pivot members, each of the pivot members comprising a clipping portion for clasping the electric unit;
at least a jointing member pivotably connected with the pivot members, the jointing member comprising a pressing portion for resiliently abutting against the heat sink toward the electric unit; and
at least a pair of spring members each comprising two end catches secured with the jointing member and a corresponding pivot member and capable of providing resilient torsions to drive the clipping portions to engage with the electric unit when the clipping portions rotate to one position away from the electric unit.
2. The mounting device as described in claim 1, further comprising a pressing plate for retaining the combination of the pivot members and the jointing member on the heat sink.
3. The mounting device as described in claim 2, wherein the pressing plate comprises a main body, a longitudinal groove defined in the centre of the main body, and two hook portions extending from opposite ends of the main body.
4. The mounting device as described in claim 1, wherein each jointing member comprises two slanting portions extending from opposite sides of the pressing portion, and two connecting portions extending from free ends of the slanting portions, and each pivot member defines a connecting hole receiving a corresponding connecting portion.
5. The mounting device as described in claim 4, wherein the mounting device comprises two jointing members located at opposite sides of the pivot members.
6. The mounting device as described in claim 5, wherein each jointing member is formed by bending a metal pole.
7. The mounting device as described in claim 5, wherein each jointing member is formed by bending a metal plate.
8. The mounting device as described in claim 4, wherein the spring members are coil springs, each pivot member defines at least a catch hole therein, one end catch of the coil spring is received in a corresponding catch hole, and the other end catch clasps a corresponding slanting portion of the jointing member.
9. A heat dissipating device comprising:
a heat sink for contacting with an electric unit;
at least one jointing member comprising a pressing portion abutting the heat sink;
a pair of pivot members pivotably connected with the jointing member, each of the pivot members comprising a clipping portion for clasping the electric unit; and
at least a pair of spring members connected with the pivot members and the jointing member to provide resilient torsions to drive the pivot members to rotate from a first position in which the clipping portions are located away from the heat sink to a second position in which the clipping portions engage with the electric unit to secure the heat sink on the electric unit.
10. The heat dissipating device as described in claim 9, wherein the heat sink comprises a base and a plurality of fins extending from the base, two channels are defined crossing through the fins for receiving the jointing member, and the channels divide each fin into two opposite end sections and one middle section.
11. The heat dissipating device as described in claim 10, further comprising a pressing plate for mounting the combination of the pivot member and the jointing member to the heat sink, wherein the pressing plate comprises a main body defining a groove for extension of the middle section of a middle one of the fins, and two hook portions extending from opposite ends of the main body, two cutouts being defined in the end sections of the middle one of the fins and the hook portions engaging in the cutouts.
12. The heat dissipating device as described in claim 9, wherein each jointing member comprises two slanting portions extending from opposite sides of the pressing portion, and two connecting portions extending from free ends of the slanting portions.
13. The heat dissipating device as described in claim 12, wherein each pivot member defines a connecting hole receiving the connecting portions and two catch holes perpendicular to the connecting hole.
14. The heat dissipating device as described in claim 13, wherein each spring member comprises a coil, and two end catches extending from opposite sides of the coil, one of the end catches is received in a corresponding catch hole, and the other end catch clasps one of the slanting portions.
15. A heat dissipating assembly comprising:
a heat sink for contacting with an electric unit;
a resilient body extending across the heat sink with two opposite ends of the resilient body located at two opposite sides of the heat sink, at least a portion of the resilient body being capable of urging the heat sink toward the electric unit;
a pair of pivot members respectively pivotably attached to the resilient body; and
a pair of biasing members each comprising two end catches secured with the resilient body and a corresponding pivot member to bias the pivot member to pivot from a released position to an engaged position.
16. The assembly of claim 15, wherein each of the pivot members defines a connecting hole pivotably receiving a corresponding end of the resilient body.
17. The assembly of claim 15, wherein the biasing member is a torsional spring.
18. The assembly of claim 15, wherein each of the pivot members defines a catch hole receiving one end catch of the biasing member therein, and the other end catch of the biasing member clasps the resilient body.
19. The assembly of claim 15, wherein each of the pivot members comprises a clipping portion, and the clipping portions engage with undersides of the electric unit in said engaged position.
20. A mounting device for mounting a heat sink to an electric unit comprising:
at least one jointing member attached to said heat sink, and having a pressing portion resiliently engagable with said heat sink and at least one connecting portion extending from said jointing member and out of said heat sink; and
a pivot member disposed next to said heat sink and torsionally attached to said at least one connecting portion of said jointing member, said pivot member being movable between a first position where said pivot member engages with said electric unit to generate an urging force on said joint member via said at least one connecting portion thereof so as to move said heat sink toward said electric unit by means of said pressing portion thereof, and a second position where said pivot member disengages from said electric unit so as to make said heat sink removable from said electric unit, said pivot member being torsionally moved to initiate movement of said pivot member from said first position to said second position.
21. The mounting device as described in claim 20, wherein said jointing member is fixedly attached to said heat sink via a pressing plate engagable with fins of said heat sink.