1. A structure representative of a conductive interconnect in a microelectronic element for purposes of modeling stress-induced degradation, comprising:
a conductive metallic plate having an upper surface, a lower surface, and a plurality of peripheral edges extending between said upper surface and said lower surface, said upper surface defining a horizontally extending plane, said metallic plate having a width in a widthwise direction, a length in a lengthwise direction, and a thickness in a direction of a height of said upper surface from said lower surface;
a lower via consisting essentially of at least one of conductive or semiconductive material having a top end in conductive communication with said metallic plate and a bottom end vertically displaced from said top end;
a lower element consisting essentially of at least one of conductive or semiconductive material in contact with said bottom end of said lower via;
an upper metallic via in at least substantial vertical alignment with said lower conductive via, said upper metallic via having a bottom end in conductive communication with said metallic plate and a top end vertically displaced from said bottom end, said upper metallic via having a width at least about ten times than said length and at least about ten times smaller than said width; and
an upper metallic line element in contact with said top end of said upper metallic via.
2. The structure as claimed in claim 1, wherein said bottom end of said upper metallic via contacts said metallic plate.
3. The structure as claimed in claim 1, further comprising a metallic connecting line, said metallic connecting line having an upper surface at least substantially level with said upper surface of said metallic plate, an inner end connected to said metallic plate, and an outer end horizontally displaced from at least one of said plurality of peripheral edges, said metallic connecting line having a width much smaller than said width of said at least one of said peripheral edges and a length greater than said width of said microelectronic element, wherein said bottom end of said upper metallic via contacts said metallic connecting line.
4. The structure as claimed in claim 3, wherein said bottom end of said upper metallic via is horizontally displaced a distance greater than 0 microns (\u03bcm) from said at least one peripheral edge.
5. The structure as claimed in claim 3, wherein said width of said metallic connecting line is equal to a critical dimension of said microelectronic element.
6. The structure as claimed in claim 3, wherein a length of said metallic connecting line is greater than about ten times said width of said metallic connecting line.
7. The structure as claimed in claim 6, wherein said bottom end of said upper metallic via contacts said metallic connecting line at a location closer to said outer end than said inner end.
8. The structure as claimed in claim 3, wherein said lower via includes a semiconductor material.
9. The structure as claimed in claim 3, wherein said metallic plate has a plurality of dielectric filled openings extending vertically between said upper surface and said lower surface.
10. The structure as claimed in claim 9, wherein said plurality of dielectric filled openings are arranged as a plurality of parallel elongated openings in said lengthwise direction such that said metallic plate has a plurality of parallel elongated branches extending in said lengthwise direction.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An energy management process comprising:
means for generating electricity;
means to convert electricity into hydrogen;
means to store hydrogen; and,
means to convert hydrogen into electricity.
2. The method of claim 1 wherein said first generation of electricity is by hydroturbine.
3. The method of claim 1 wherein said first generation of electricity is by wind turbine.
4. The method of claim 1 wherein said first generation of electricity is by photo voltaic means.
5. The method of claim 1 wherein said conversion of electricity into hydrogen is by electrolysis.
6. The method of claim 1 wherein said storage of hydrogen is by containment as a compressed gas in an enclosed vessel.
7. The method of claim 1 wherein said storage of hydrogen is by containment as a refrigerated liquid in an enclosed vessel.
8. The method of claim 1 wherein said converting hydrogen back into electricity is by internal combustion engine.
9. The method of claim 1 wherein said converting hydrogen back into electricity is by fuel cell.
10. The method of claim 1 wherein said converting hydrogen back into electricity is by gas turbine.
11. The method of claim 1 wherein said converting hydrogen back into electricity is by sterling engine.
12. The method of claim 1 wherein said converting hydrogen back into electricity is by expansion engine.
13. The method of claim 8 further comprising the step of controlling electricity thus produced by means of power conditioners, load sensing devices, computers, software, computer-aided switches and other control devices known in the prior art in a manner and sequence so that electricity is produced for transmission onto the local grid only when electrical demand exceeds electricity supplied by other methods.
14. The method of claim 9 further comprising the step of controlling electricity thus produced by means of power conditioners, load sensing devices, computers, software, computer-aided switches and other control devices known in the prior art in a manner and sequence so that electricity is produced for transmission onto the local grid only when electrical demand exceeds electricity supplied by other methods.
15. The method of claim 10 further comprising the step of controlling electricity thus produced by means of power conditioners, load sensing devices, computers, software, computer-aided switches and other control devices known in the prior art in a manner and sequence so that electricity is produced for transmission onto the local grid only when electrical demand exceeds electricity supplied by other methods.
16. The method of claim 11 further comprising the step of controlling electricity thus produced by means of power conditioners, load sensing devices, computers, software, computer-aided switches and other control devices known in the prior art in a manner and sequence so that electricity is produced for transmission onto the local grid only when electrical demand exceeds electricity supplied by other methods.
17. The method of claim 12 further comprising the step of controlling electricity thus produced by means of power conditioners, load sensing devices, computers, software, computer-aided switches and other control devices known in the prior art in a manner and sequence so that electricity is produced for transmission onto the local grid only when electrical demand exceeds electricity supplied by other methods.