What is claimed is:
1. A cap device comprising a cap configured to open and close a tank opening, the cap comprising:
a closer for closing the tank opening with air-tight sealing at a closing position;
a handle mechanism having a handle, the handle being switchable between a handling position and a retracted position, the handling position being a position allowing a user to operate the handle to open and close the closer, the retracted position being a position in which the tank opening is closed, the handle in the handling position being configured to project outwardly from an upper portion of the closer a greater distance than the handle is in the retracted position; and
an interconnecting mechanism, provided between the handle mechanism and the closer, for transmitting to the closer rotational torque in a closing direction and opening direction when the rotational torque is applied to the handle mechanism,
wherein the interconnecting mechanism comprises a clutch mechanism, the clutch mechanism setting the interconnecting mechanism in a transmission mode and a non-transmission mode, the transmission mode being a mode wherein the rotational torque in the closing direction and the opening direction is transmitted from the handle to the closer when the handle is placed in the handling position, the non-transmission mode being mode wherein the rotational torque in the opening direction is prevented from transmitting from the handle to the closer and the handle mechanism rotates freely in the opening direction when the handle is placed in the retracted position.
2. The cap device according to claim 1, wherein the clutch mechanism is configured to set the interconnecting mechanism in the transmission mode in the closing direction when the handle is placed in the retracted position.
3. The cap device according to claim 2, wherein the clutch mechanism comprises a first clutch unit for transmitting the rotational torque to the closer to close the tank opening in both the handling position and the retracted position; and a second clutch unit for transmitting the rotational torque to the closer to open the tank opening when the handle is placed in the handling position.
4. The cap device according to claim 3, wherein the handle mechanism comprises a cover covering the interconnecting mechanism; and an axial support mechanism for pivotably supporting the handle, the support mechanism being configured to allow pivotal operation of the handle between the handling position and the retracted position relative to the cover.
5. The cap device according to claim 4, wherein the axial support mechanism comprises an urging mechanism for urging the handle towards the retracted position.
6. The cap device according to claim 5, wherein the urging mechanism comprises a cam having a cam face; and a resilient cam support piece for producing urging force towards the retracted position by pressing the cam face as the handle is rotated.
7. The cap device according to claim 6, wherein the urging mechanism is configured such that the urging force is greater at proximity to the retracted position than at handling position.
8. The cap device according to claim 7, wherein
the clutch mechanism comprises a clutch member, a clutch urging mechanism including a cam face formed on the handle and a clutch spring that presses the clutch member,
the clutch urging mechanism being configured such that when the handle is moved from the retracted position to the handling position, the clutch member is pushed via the cam face and switched to the transmission mode; and when the handle is moved from the handling position to the retracted position, the clutch member is switched to be urged by the clutch spring to the non-transmission mode.
9. The cap device according to claim 8, wherein the interconnecting mechanism comprises a torque transmission mechanism having a torque member for transmitting the rotational torque to the closer, the torque member being configured such that the rotational torque in the closing direction transmitted from the clutch mechanism is maintained less than a predetermined level.
10. The cap device according to claim 9, wherein the clutch spring is a resin spring integrally formed with the torque member.
11. The cap device according to claim 9, wherein the clutch spring comprises a resin spring integrally formed with the clutch member.
12. The cap device according to claim 11, wherein the clutch springs is configured to generate a pressing force greater at proximity to the handling position than at proximity to the retracted position.
13. The cap device according to claim 12, wherein the clutch spring is configured to press the torque member while the torque member is kept at a predetermined position relative to the closer.
14. The cap device according to claim 13, wherein the clutch spring comprises an arm formed as a cantilever piece having a first and second ends arranged coplanar with the torque member, the first end of the arm being supported on the torque member; and a pushing protrusion that extends from the second end of the arm, the clutch spring being configured to produce pressing force when the pushing protrusion is pressed by the clutch member.
15. The cap device according to claim 1, wherein the handle mechanism comprises a spring for pressing the handle to move to the retracted position when the handle is released from the handling position.
16. The cap device according to claim 1, wherein the closer comprises
a casing body for sealing the tank opening, the casing body having a casing interlocking portion for interlocking with an opening interlocking portion formed on a filer neck via rotation of the casing body by a predetermined angle; and
the handle mechanism having a cover, the cover rotatably mounted on the casing body and pivotally supporting the handle.
17. The cap device according to claim 16, wherein the interconnecting mechanism comprises (i) a torque plate with a torque plate interlocking portion; and a casing interlocking portion formed on an upper portion of the casing body and engaging and disengaging with the torque plate interlocking portion, and
the handle comprises a cam,
wherein the interconnecting mechanism is configured such that movement of the cam shifts the torque plate to change the interconnecting mechanism between the transmission mode and the non-transmission mode.
18. The cap device according to claim 17, further comprising a spring disposed between the torque plate and the casing body, the spring being configured to press the torque plate and the casing body towards the non-transmission mode.
19. The cap device according to claim 18, wherein the spring comprises a cantilever piece extending integrally from the torque plate, the cantilever piece having an end for pressing the casing body.
20. The cap device according to claim 19, wherein the spring comprises a cantilever piece extending integrally from an upper portion of the casing body, the cantilever piece having an end for pressing the torque plate.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A semiconductor light emitting device, comprising:
a light emitting unit including a first semiconductor layer, a light emitting layer, and a second semiconductor layer, the first semiconductor layer having a first conductivity type, and having a major surface including a first portion and a second portion, the light emitting layer provided on the first portion, the second semiconductor layer having a second conductivity type and provided on the light emitting layer, the light emitting unit having a side face intersecting with the major surface;
a first conductive pillar provided on the second portion and extending along a first direction perpendicular to the major surface, the first conductive pillar having a side face along the first direction and being electrically connected to the first semiconductor layer;
a second conductive pillar provided on the second semiconductor layer and extending along the first direction, the second conductive pillar having a side face along the first direction and being electrically connected to the second semiconductor layer;
a sealing unit covering the side face of the light emitting unit, the side face of the first conductive pillar, and the side face of the second conductive pillar;
a first terminal provided on the first conductive pillar and on the sealing unit, and being electrically connected to the first conductive pillar, the first terminal including a first overlapping portion and a second overlapping portion, the first overlapping portion overlapping with the light emitting unit, the second overlapping portion not overlapping with the light emitting unit and overlapping with the sealing unit when projected onto a plane parallel to the major surface; and
a second terminal provided on the second conductive pillar and on the sealing unit, the second terminal being apart from the first terminal and being electrically connected to the second conductive pillar, the second terminal including a third overlapping portion overlapping with the light emitting unit and a fourth overlapping portion not overlapping with the light emitting unit and overlapping with the sealing unit when projected onto the plane.
2. The device according to claim 1, further comprising
a first metal edge portion, and
a second metal edge portion being apart from the first metal edge portion,
the sealing unit has a side face along the first direction,
the side face of the sealing unit includes a first side face portion and a second side face portion being different from the first side face portion,
the first metal edge portion covers the first side face portion and is electrically connected to the first terminal, and
the second metal edge portion covers the second side face portion and is electrically connected to the second terminal.
3. The device according to claim 2, wherein
the first metal edge portion contacts the second overlapping portion, and
the second metal edge portion contacts the fourth overlapping portion.
4. The device according to claim 1, further comprising a rectification element including a rectification unit,
one end of the rectification unit is electrically connected to the first terminal, and
one other end of the rectification unit is electrically connected to the second terminal.
5. The device according to claim 4, wherein
the resistance in a first rectification direction between the one end and the one other end is less than the resistance in a second rectification direction opposing to the first rectification direction between the one end and the one other end,
the light emitting unit has a forward direction, and light is emitted from the light emitting layer in the forward direction,
the rectification unit is connected in parallel with the light emitting unit, and
the first rectification direction is the opposite to the forward direction.
6. The device according to claim 5, wherein a voltage drop of the rectification unit in the first rectification direction is less than an allowable voltage in the reverse direction of the light emitting unit.
7. The device according to claim 4, wherein the rectification element is covered by the sealing unit.
8. The device according to claim 4, further comprising
a first metal edge portion, and
a second metal edge portion being apart from the first metal edge portion,
the sealing unit has a side face along the first direction,
the side face of the sealing unit includes a first side face portion and a second side face portion being different from the first side face portion,
the first metal edge portion covers the first side face portion and is electrically connected to the first terminal,
the second metal edge portion covers the second side face portion and is electrically connected to the second terminal,
the second metal edge portion is opposed to the first metal edge portion in an opposing direction being parallel to the major surface,
the first metal edge portion includes
a first extending part extending along an extension direction, the extension direction is parallel to the major surface and is different from the opposing direction, and
a second extending part extending along the opposing direction from one end of the first extending part towards the second metal edge portion,
the second metal edge portion includes
a third extending part extending along the extension direction, and
a fourth extending part extending along the opposing direction from one end of the third extending part towards the second extending part, and
the rectification unit is disposed between the second extending part and the fourth extending part.
9. The device according to claim 8, wherein the rectification element further includes
a first electrode electrically connected to either one end or the one other end of the rectification unit and contacts the second extending part, and
a second electrode electrically connected to the other of either one end or the one other end of the rectification unit and contacts the fourth extending part.
10. The device according to claim 1, further comprising a wavelength conversion layer having a side face intersecting with the major surface,
the first semiconductor layer is provided on the wavelength conversion layer, and
the sealing unit also covers the side face of the wavelength conversion layer.
11. The device according to claim 1, further comprising an insulating layer provided between the light emitting unit and the sealing unit.
12. The device according to claim 1, wherein
the first terminal contacts the first conductive pillar, and
the second terminal contacts the second conductive pillar.
13. A method for manufacturing a semiconductor light emitting device, comprising:
preparing a work piece including a support substrate and a plurality of semiconductor components arranged on a surface of the support substrate,
each of the semiconductor components including
a substrate unit,
a light emitting unit provided on the substrate unit, the light emitting unit including a first semiconductor layer, a light emitting layer, and a second semiconductor layer, the first semiconductor layer having a first conductivity type and provided on the substrate unit, the first semiconductor layer having a major surface including a first portion and a second portion, the light emitting layer provided on the first portion, the second semiconductor layer having a second conductivity type and provided on the light emitting layer, the light emitting unit having a side face intersecting with the major surface,
a first conductive pillar provided on the second portion and extending along a first direction perpendicular to the major surface, the first conductive pillar having a side face along the first direction and being electrically connected to the first semiconductor layer, and
a second conductive pillar provided on the second semiconductor layer and extending along the first direction, the second conductive pillar having a side face along the first direction and being electrically connected to the second semiconductor layer;
forming a resin film on the semiconductor components and on the surface of the support substrate, the resin film covering the side face of the light emitting unit, the side face of the first conductive pillar, and the side face of the second conductive pillar of each of the semiconductor components;
removing the support substrate from the semiconductor components and the resin film;
forming a plurality of concave portions in the resin film, the concave portions reflected the shape of the substrate units by removing each of the substrate units of the semiconductor components;
forming a wavelength conversion layer including a wavelength conversion material by filling the concave portions with a resin material including the wavelength conversion material, the wavelength conversion layer absorbing at least a part of a first light being emitted from the light emitting unit, and emitting a second light having a peak wavelength being different from the peak wavelength of the first light; and
cutting the resin film between pairs of the semiconductor components.
14. The method according to claim 13, wherein the process of preparing the work piece includes arranging the semiconductor components on the support substrate in accordance with the peak wavelength of the first light emitted from the light emitting unit.
15. The method according to claim 14, wherein in the process of preparing the work piece, the difference in the maximum value and the minimum value of the peak wavelength of the semiconductor components arranged on the support substrate is not more than 2 nm.
16. The method according to claim 14, wherein the process of arranging the semiconductor components on the support substrate includes forming a pressure sensitive adhesion layer on the support substrate, and fixing the semiconductor components on the support substrate using the pressure sensitive adhesion layer, and
the process of removing the support substrate includes reducing the pressure sensitive adhesive force of the pressure sensitive adhesion layer.
17. The method according to claim 13, wherein the process of preparing the work piece further includes
forming plurality of the light emitting units on a growth-use substrate,
forming the first conductive pillar on the second portion of each of the first semiconductor layers of the light emitting units, and forming the second conductive pillar on each of the second semiconductor layers of the light emitting units, and
forming the semiconductor components by cutting the growth-use substrate, and dividing the growth-use substrate into each of the light emitting units.
18. The method according to claim 17, wherein the process of preparing the work piece further includes measuring the peak wavelength of the luminescent light of each of the light emitting units.
19. The method according to claim 13, further comprising forming a conductive film on another surface of the resin film and
forming a first terminal and a second terminal from the conductive film, wherein
the first terminal is provided on the first conductive pillar and on the resin film, and the first terminal is electrically connected to the first conductive pillar, and
the second terminal is apart from the first terminal, the second terminal is provided on the second conductive pillar and the resin film, and the second terminal is electrically connected to the second conductive pillar.
20. The method according to claim 13, wherein the semiconductor components is arranged in one direction parallel to the major surface, and arranged in one other direction parallel to the major surface and perpendicular to the one direction,
the work piece further includes a plurality of metal frames extending along the one other direction, provided between each pair of semiconductor components being closest in the one direction, and
the process of cutting the resin film between pairs of the semiconductor components includes cutting each of the metal frames along a line set in the one direction on the metal frame.