1. An electronic package comprising at least one semiconductor chip mounted on an organic substrate, said at least one semiconductor chip having edge portions forming at least one corner point; said organic substrate having edge portions forming at least two corner points at distal edge portions thereof, whereby said at least one corner point of said at least one semiconductor chip is angularly rotated about a z-axis through a neutral point relative to said at least two corner points of said substrate substantially subtending a predetermined angular displacement between the corner points of said substrate and the at least one corner point of said at least one semiconductor chip so as to reduce warpage between said at least one semiconductor chip and said organic substrate caused by thermally-induced stresses generated therebetween at said corner points, wherein said at least one corner point on said at least one semiconductor chip is rotated in the z-axis through said neutral point from at least one corner point on said organic substrate by an angular displacement of about 45\xb0, and wherein said neutral point coincides with a center point of said at least one semiconductor chip, and a maximum bending shear deformation of said electronic package occurs at least at one corner point of said organic substrate distant from said neutral point (DNP).
2. An electronic package as claimed in claim 1, wherein at least one solder joint array corner point is provided between said at least corner point of said at least one semiconductor chip and said organic substrate, said at least one solder joint array corner point being in superimposed alignment with said at least one corner point of said at least one semiconductor chip.
3. An electronic package as claimed in claim 1, wherein a thermally curable adhesive underfill material is provided between said at least one semiconductor chip and said organic substrate, whereby cooling of said underfill material or thermal cycling of said electronic package generates stresses causing warpage between the components of said package.
4. An electronic package as claimed in claim 1, wherein said at least one semiconductor chip comprises silicon having a coefficient of thermal expansion of about 3 ppm.\xb0 C.
5. An electronic package as claimed in claim 1, wherein said organic substrate comprises an epoxy having a coefficient of thermal expansion of about 18 ppm\xb0 C.
6. An electronic package comprising at least one rectangular semiconductor chip mounted on an organic substrate, said at least one semiconductor chip having edge portions forming corner points; said organic substrate having edge portions forming at least two corner points at distal edge portions thereof, the corner points of said at least one semiconductor chip being angularly rotated about a z-axis extending through a neutral point located at the center of said at least one rectangular semiconductor chip relative to said at least two corner points of said substrate substantially subtending a predetermined angular displacement between the corner points of said substrate and the corner points of said at least one semiconductor chip so as to reduce warpage between said at least one semiconductor chip and said organic substrate caused by thermally-induced stresses generated therebetween at said corner points, wherein a thermally cured adhesive underfill material is provided between said at least one semiconductor chip and said organic substrate, whereby cooling of said underfill material or thermal cycling of said electronic package generates stresses causing warpage between the components of said package.
7. An electronic package as claimed in claim 6, wherein solder joint array corner points are provided between said corner points of said at least one semiconductor chip and said organic substrate, said solder joint array corner points being in superimposed alignment with said corner point of said at least one semiconductor chip.
8. An electronic package as claimed in claim 6, wherein said corner points on said at least one semiconductor chip are rotated about the z-axis about a neutral point from the corner points said organic substrate by an angular displacement of about 45\xb0.
9. An electronic package as claimed in claim 6, wherein said at least one semiconductor chip comprises silicon having a coefficient of thermal expansion of about 3 ppm.\xb0 C.
10. An electronic package as claimed in claim 6, wherein said organic substrate comprises an epoxy having a coefficient of thermal expansion of about 18 ppm\xb0 C.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method of performing a transaction comprising:
receiving a request from a user for information about merchants who are located within a local area;
identifying merchants responsive to the request from a database that includes information about the physical location of the merchants; and
providing information about the identified merchants to the user.
2. The method of claim 1, wherein the local area is a circular area having a predetermined radius from a predetermined physical location.
3. The method of claim 1, wherein the local area is a circular area having a user defined radius from a user defined physical location.
4. The method of claim 1, wherein the local area is a zip-code area defined by the user.
5. The method of claim 1, wherein the local area is defined by identifying boundaries on a map.
6. The method of claim 1, wherein the information provided to the user includes a map including the local area having the physical location of the merchants shown on the map with a marker.
7. A method of performing a transaction comprising:
receiving a request from a user for information about merchants who are located within a local area;
identifying merchants responsive to the request from a database that includes information about the physical location of the merchants; and
providing to the user a map including the local area and having the physical location of the merchants identified on the map.
8. The method of claim 7, wherein the local area is a circular area having a predetermined radius from a predetermined physical location.
9. The method of claim 7, wherein the local area is a circular area having a user defined radius from a user defined physical location.
10. The method of claim 7, wherein the local area is a zip-code area defined by the user.
11. The method of claim 7, wherein the physical location of the merchants is identified on the map with a marker.
12. The method of claim 11, wherein the marker is user selectable to display additional information about a selected merchant.
13. A method of advertising over a computer network comprising:
identifying potentials customers in a local area;
transmitting information about a merchant to the potential customers;
receiving requests for additional information about the merchant from the potential customers;
transmitting additional information about the merchant to the potential customers who requested additional information.
14. The method of claim 13, wherein the local area is a circular area having a predetermined radius from a predetermined physical location.
15. The method of claim 14, wherein the predetermined physical location is the location of the merchant.
16. The method of claim 14, wherein the predetermined local area is defined by the merchant.
17. The method of claim 16, wherein the predetermined local area is defined by identifying boundaries on a map.
18. The method of claim 13, further comprising the step of billing the merchant for each potential customer who requests additional information.
19. A method of providing information through a website comprising:
displaying first content on one or more public pages that are generally accessible by anyone accessing the website; and
displaying second content on one or more private pages that are accessible only to individuals who have special access rights.
20. The method of claim 19, wherein the first content includes information about merchants within a local area.
21. The method of claim 20, further comprising:
identifying potentials customers based upon merchants identified in the first content;
transmitting information about a merchant to the potential customers;
receiving requests for additional information about the merchant from the potential customers;
transmitting additional information about the merchant to the potential customers who requested additional information.