1. An apparatus for planarizing a microelectronic substrate, comprising:
a planarizing medium support;
a planarizing medium supported by the planarizing medium support;
a first substrate carrier positioned proximate to the planarizing medium, the first substrate carrier including a flexible, compressible first membrane having a first portion with a first thickness and a second portion with a second thickness different than the first thickness, a ratio of the first thickness to the second thickness having a first value, the first portion being aligned with a first part of the microelectronic substrate when the first membrane engages the microelectronic substrate, the second portion being aligned with a second part of the microelectronic substrate when the first membrane engages the microelectronic substrate; and
a second substrate carrier positioned proximate to the planarizing medium, the second substrate carrier including a flexible, compressible second membrane having a first portion with a first thickness and a second portion with a second thickness different than the first thickness, a ratio of the first thickness to the second thickness having a second value different than the first value, the first portion being aligned with a first part of the microelectronic substrate when the second membrane engages the microelectronic substrate, the second portion being aligned with a second part of the microelectronic substrate when the second membrane engages the microelectronic substrate.
2. The apparatus of claim 1 wherein the planarizing medium includes a polishing pad having a generally circular planform shape and the planarizing medium support has a corresponding circuit planform shape.
3. The apparatus of claim 1 wherein the planarizing medium includes an elongated polishing pad at least partially wound on a supply roller and extending from the supply roller across the planarizing medium support to a take-up roller.
4. The apparatus of claim 1, further comprising an actuator coupled to the first and second substrate carriers to bias the substrate carriers toward the planarizing medium.
5. The apparatus of claim 1, further comprising an actuator coupled to the first and second substrate carriers to move the substrate carrier relative to the planarizing medium in a plane generally parallel to a plane of the planarizing medium.
6. The apparatus of claim 1 wherein the first and second membranes have a first surface facing a generally flat surface of the respective first and second substrate carriers and a second surface facing opposite the first surface toward the microelectronic substrate when thee first and second membranes engages the microelectronic substrate, the first surface being generally in direct contact with the flat surface of the respective substrate carrier.
7. The apparatus of claim 1 wherein the first and second membranes have a generally circular planform shape and the first portion is generally circular and second portions is annular with the first portion disposed radially inwardly from the second portion.
8. The apparatus of claim 1 wherein the first and second membranes have a generally circular planform shape and second portions is generally circular and the first portion is annular with the second portion disposed radially inwardly from the first portion.
9. The apparatus of claim 1 wherein the first and second portion of the first and second membranes are radially disposed relative to each other and an intermediate thickness of the membrane varies in a generally continuous manner between the first thickness and the second thickness.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. (canceled)
2. (canceled)
3. (canceled)
4. (canceled)
5. (canceled)
6. A computer readable medium that stores a computer program for high frequency signal interpolation for allowing a computer to realize:
a function of obtaining a real part and an imaginary part of a raw signal;
a function of forming an envelope component of amplitude of the raw signal using the real part and the imaginary part; and
a function of taking out a high-harmonic portion of the envelope component and adding the high-harmonic portion to the raw signal.
7. A high frequency signal interpolation device, comprising:
a means for forming an envelope component of amplitude of a raw signal supplied to an input terminal using a real part and an imaginary part of the raw signal;
a means for taking out a high-harmonic portion of the formed envelope component; and
a means for adding the taken-out high-harmonic portion to the raw signal supplied to the input terminal.
8. The high frequency signal interpolation device according to claim 7, wherein
the means for forming the envelope component includes a means for obtaining the squares of the real part and the imaginary part of the raw signal respectively, adding the squares to each other, and obtaining a square root of a value resulting from the addition.
9. The high frequency signal interpolation device according to claim 7, wherein
the raw signal supplied to the input terminal is supplied to the adding means via a means for carrying out band limitation to exclude the high-harmonic portion.
10. The high frequency signal interpolation device according to claim 7, wherein
the band limitation is carried out in advance on the raw signal supplied to the input terminal so that the high-harmonic portion is excluded.