What is claimed is:
1. A slurry distributor, comprising:
a base section;
a main body section on top of the base section;
a distributing structure on top of the main body section for accommodating one or more types of slurry, mixing the slurry and pouring out the well-mixed slurry uniformly, wherein the distributing structure has a plurality of holes close to the main body section; and
a connecting structure inside the base section for joining with a chemical-mechanical polishing device.
2. The slurry distributor of claim 1, wherein the holes are positioned evenly around the distributing structure.
3. The slurry distributor of claim 1, wherein the main body section further includes:
a lower main body section; and
an upper main body section above the lower main body section.
4. The slurry distributor of claim 3, wherein the lower main body section is a cylindrical body.
5. The slurry distributor of claim 3, wherein the upper main body section is a conical body.
6. The slurry distributor of claim 3, wherein the upper main body section is a truncated conical body.
7. The slurry distributor of claim 1, wherein the distributing structure is a cylindrical ring.
8. A slurry distributor, comprising:
a base section having a cylindrical body;
a main body section above the base section, including:
a lower main body section; and
an upper main body section above the lower main body section; and
a sidewall section above the main body section to prevent out-splashing of slurry and channel out well-mixed slurry, wherein the sidewall section is a cylindrical ring and has a plurality of holes close to the main body section.
9. The slurry distributor of claim 8, wherein the holes are positioned evenly around the sidewall section.
10. The slurry distributor of claim 8, wherein the lower main body section is a cylindrical body.
11. The slurry distributor of claim 8, wherein the upper main body section is a conical body.
12. The slurry distributor of claim 8, wherein the upper main body section is a truncated conical body.
13. The slurry distributor of claim 8, wherein the distributor further includes a connecting structure inside the base section for joining with a chemical-mechanical polishing device.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A dicing tape-integrated wafer back surface protective film comprising:
a dicing tape comprising a base material and a pressure-sensitive adhesive layer formed on the base material; and
a wafer back surface protective film formed on the pressure-sensitive adhesive layer of the dicing tape,
wherein the wafer back surface protective film is colored.
2. The dicing tape-integrated wafer back surface protective film according to claim 1, wherein said colored wafer back surface protective film has a laser marking ability.
3. The dicing tape-integrated wafer back surface protective film according to claim 1, which is used for a flip chip-mounted semiconductor device.
4. A process for producing a semiconductor device using a dicing tape-integrated wafer back surface protective film, said process comprising steps of:
attaching a workpiece onto said colored wafer back surface protective film of the dicing tape-integrated wafer back surface protective film according to claim 1,
dicing the workpiece to form a chip-shaped workpiece,
peeling the chip-shaped workpiece from the pressure-sensitive adhesive layer of the dicing tape together with said colored wafer back surface protective film, and
fixing the chip-shaped workpiece to an adherend by flip chip bonding.
5. A flip chip-mounted semiconductor device, which is manufactured using the dicing tape-integrated wafer back surface protective film according to claim 1, said semiconductor device comprising a chip-shaped workpiece and the wafer back surface protective film of the dicing tape-integrated wafer back surface protective film attached to a back surface of the chip-shaped workpiece.