1461106655-5561d2ab-028f-457a-abb4-884c21fc1d3f

What is claimed is:

1. A fluid vaporizing device, comprising:
a fluid source;
a fluid passage through which fluid from the fluid source is vaporized; and
a tubular heater comprising a thin electrically resistive film lining the interior surface of all or part of the length of the fluid passage.
2. The fluid vaporizing device of claim 1, wherein the heater comprises one or more of platinum, gold, nickel, silver, or tin in the form of a pure metal, alloy, mixture, or plural layers andor the fluid passage is of capillary size.
3. The fluid vaporizing device of claim 1, wherein the fluid passage is located in a monolithic or multilayer body of an electrically insulating material andor the fluid passage has a uniform cross section along the length thereof, and a maximum width of the fluid passage is 0.01 to 10 mm.
4. The fluid vaporizing device of claim 1, wherein the heater comprises a deposited layer of platinum.
5. The fluid vaporizing device of claim 1, wherein the heater is a bio-compatible material, and the heater is arranged to be in direct contact with fluid in the passage.
6. The fluid vaporizing device of claim 1, wherein the fluid passage is at least partially defined by first and second layers of material enclosing a channel therebetween, or wherein the fluid passage is defined by a stack of first, second and third layers of material with the third layer comprising a void enclosed between the first and second layers; and, wherein the layers are assembled to form the fluid passage prior to the formation of the heater.
7. The fluid vaporizing device of claim 1, wherein the thin electrically resistive film is deposited by a process selected from the group consisting of thermally decomposing a metal salt deposited in the passage in solution, heating a metal powder deposited in the passage in suspension or emulsion in a carrier, reducing a metal oxide deposited within the passage in a suspension or emulsion in a carrier, coating the passage with resistive ink, electroless deposition of one or more layers of metal, and vapor deposition of a metal by electrically heating a wire threaded through the passage.
8. The fluid vaporizing device of claim 1, wherein the thin electrically resistive film heater has been formed within the fluid passage by steps of coating the interior of the passage with a metal powder, metal oxide powder, or metal salt in solution, suspension, or dispersion, and heating the passage to a temperature sufficient to reduce the deposited material to a thin metal film.
9. The fluid vaporizing device of claim 1, wherein the thin electrically resistive film heater has been formed within the fluid passage by steps of:
(a) coating the interior of the passage with a metal salt solution; and,
(b) heating the passage to a temperature sufficient to reduce the deposited material to a thin metal film.
10. The fluid vaporizing device of claim 1, wherein the fluid passage is located in an aerosol generator of an inhaler having a mouthpiece, the outlet of the passage directing volatilized fluid into the mouthpiece of the inhaler wherein an aerosol can be formed in the mouthpiece.
11. The fluid vaporizing device of claim 1, further comprising a power supply arranged to supply electrical current to the heater sufficient to resistively heat the heater and volatilize the fluid in the passage.
12. The fluid vaporizing device of claim 3, further comprising at least two vias filled with an electrically conductive material connecting electrical contacts on an exterior surface of the body to the heater within the interior of the fluid passage or to conductive elements in communication with the heater within the interior of the fluid passage.
13. The fluid vaporizing device of claim 1, wherein the heater is arranged to directly contact the fluid in the fluid passage or wherein the heater is coated with a material comprising glass, polymer, andor resin.
14. The fluid vaporizing device of claim 11, further comprising a controller operably connected to the power source to allow intermittent activation of the heater.
15. A method for generating a vaporized fluid, comprising the steps of:
(a) supplying fluid to a fluid passage, wherein a heater is arranged to volatilize the fluid in the fluid passage such that the volatilized fluid is directed to an outlet from which the volatilized fluid is ejected out of the fluid passage;
(b) heating the heater so as to volatilize the fluid in the fluid passage; and
(c) directing the volatilized fluid out of the fluid passage via the outlet;
wherein the heater comprises a tubular thin resistive film lining the fluid passage.
16. The method of claim 15, wherein the fluid passage comprises a passage in a body of an inhaler and the volatilized fluid is ejected through an opening in a surface of the body so as to form an aerosol to be inhaled.
17. The method of claim 15, wherein the fluid passage has a maximum cross sectional dimension of 0.01 to 10 mm and the fluid comprises a solution containing a medicated fluid.
18. A method of manufacturing a fluid vaporizing device comprising the steps of:
(a) providing a fluid passage in a body, the fluid passage having an inlet opening and an outlet opening; and,
(b) forming a tubular heater by depositing a thin resistive film inside said fluid passage such that the film lines all or part of the length of the passage;
the heater being operable to volatilize fluid in the passage by passing an electrical current through the film.
19. The method of claim 18, wherein the depositing step comprises introducing a metal in solution, suspension, or dispersion in the flow passage and depositing metal on the interior of the passage.
20. The method of claim 18, wherein the depositing step comprises introducing a solution containing a platinum salt into the fluid passage, depositing platinum and heating the deposited platinum.
21. The method of claim 18, further comprising the step of forming conductive contacts electrically connecting the exterior of the body to the interior of the passage; the contacts being operable to supply an electrical current to the heater and wherein the contacts may be formed before, after, or concurrently with the formation of the heater.
22. The method of claim 18, wherein the depositing step comprises a process chosen from the group consisting of:
thermally decomposing a metal salt, deposited in the passage in solution, to a thin resistive metal film;
heating a metal powder deposited in the passage in suspension or emulsion;
reduction of a metal oxide deposited within the passage in a suspension or emulsion,
coating the passage with resistive ink;
electrolessly depositing of one or more layers of metal; and,
vapor depositing a metal by electrically heating a wire threaded through the passage.
23. The method of claim 18, wherein the depositing step comprises:
(a) coating the interior of the passage with a layer of metal powder, salt, or oxide in solution, suspension, or dispersion; and,
(b) heating the layer to a temperature sufficient to convert the layer to a thin metal film.
24. The method of claim 18, wherein the depositing step comprises:
(a) coating the interior of the passage with a metal salt solution; and,
(b) heating the passage to a temperature sufficient to reduce the deposited material to a thin metal film.
25. A fluid vaporizing device made by the method of claim 18.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A method by which a liquid material containing a thin film forming material is applied to a substrate to form a thin film in a prescribed region, the method comprising:
a step of subjecting the substrate to lyophobization;
a step of patterning an underlayer on a lyophobized surface of the substrate, the underlayer being more lyophilic to the liquid material than the lyophobized surface; and
a step of applying the liquid material to the underlayer and then drying it.
2. The thin film forming method according to claim 1, wherein in the step of patterning the underlayer, the underlayer is formed by a dry method.
3. The thin film forming method according to claim 1, wherein the underlayer is a layer comprising a metal oxide or a metal composite oxide.
4. The thin film forming method according to claim 3, wherein the metal oxide or the metal composite oxide is any of vanadium oxide, molybdenum oxide, ruthenium oxide, aluminum oxide, nickel oxide, barium titanate, and strontium titanate.
5. The thin film forming method according to claim 1, wherein the underlayer is a layer comprising an organic material insoluble in the liquid material.
6. The thin film forming method according to claim 1, wherein in the step of patterning the underlayer, an edge of the underlayer is formed into a forward tapered shape.
7. The thin film forming method according to claim 1, wherein in the step of patterning the underlayer, a pattern of the underlayer is formed in the same region of the thin film as the prescribed region.
8. The thin film forming method according to claim 1, wherein in the step of patterning the underlayer, a pattern of the underlayer is formed on a conductive material partitioned with an insulating material.
9. The thin film forming method according to claim 1, wherein the lyophobization is a vacuum plasma treatment including a fluorine-containing gas, an atmospheric pressure plasma treatment including a fluorine-containing gas, or a treatment comprising applying a lyophobic material to the substrate.
10. The thin film forming method according to claim 1, wherein the step of applying the liquid material and drying it is repeated multiple times using the same liquid material.
11. The thin film forming method according to claim 1, wherein the step of applying the liquid material and drying it is repeated multiple times using different liquid materials.
12. A method for producing an organic electroluminescent device using the thin film forming method according to claim 1.
13. A method for producing a semiconductor device using the thin film forming method according to claim 1.
14. A method for producing an optical device using the thin film forming method according to claim 1.