1. A method for providing remote wireless command and control to an electronic device comprising:
providing a receiver integrated circuit;
configuring receiver integrated circuit to a housing, the housing in the shape of an existing battery type;
replacing an existing battery of the electronic device with the housing configured with the receiver integrated circuit, the existing battery the same as the existing battery type; and
providing a remote control device in electronic communication with the receiver integrated circuit, the remote control device together with the receiver integrated circuit providing wireless command and control to the electronic device.
2. The method for providing remote wireless command and control to an electronic device of claim 1 further wherein the receiver integrated circuit further comprises programmable electronics.
3. The method for providing remote wireless command and control to an electronic device of claim 1, the remote control device comprising a first remote control button and a second remote control button, wherein the first remote control button serves to activate or deactivate the electronic device, and wherein the second remote control button selects a electronic device mode, wherein the electronic device mode is changed by momentarily clicking the second remote control button, and wherein an additional electronic device feature is adjusted by pressing and holding the second remote control button.
4. The method for providing remote wireless command and control to an electronic device of claim 1 wherein the existing electronic device is a night vision scope.
5. The method for providing remote wireless command and control to an electronic device of claim 1, wherein the existing battery type is a AA-battery.
6. A method for providing remote wireless command and control to an electronic device comprising:
providing a receiver integrated circuit;
configuring the receiver integrated circuit to a housing, the housing in the shape of an existing electronic device end cap;
replacing an existing end cap of the electronic device with the housing configured with the receiver integrated circuit, the existing end cap the same as the existing end cap type; and
providing a remote control device in electronic communication with the receiver integrated circuit, the remote control device together with the receiver integrated circuit providing wireless command and control to the electronic device.
7. The method for providing remote wireless command and control to an electronic device of claim 6 further wherein the receiver integrated circuit further comprises programmable electronics.
8. The method for providing remote wireless command and control to an electronic device of claim 6, the remote control device comprising a first remote control button and a second remote control button, wherein the first remote control button serves to activate or deactivate the electronic device, and wherein the second remote control button selects a electronic device mode, wherein the electronic device mode is changed by momentarily clicking the second remote control button, and wherein an additional electronic device feature is adjusted by pressing and holding the second remote control button.
9. The method for providing remote wireless command and control to an electronic device of claim 6, wherein the existing electronic device is a tactical flashlight.
10. A system for providing remote control capability to an existing electronic device comprising:
a remote control module, the remote control module comprising:
a housing, the housing in the shape of an existing battery type; and
a receiver integrated circuit, the receiver integrated circuit providing wireless command and control to the electronic device; and
a remote control device for sending control signals to the remote control module.
11. The system for providing remote control capability to an existing electronic device of claim 10, the remote control device comprising;
a first remote control button; and
a second remote control button, wherein the first remote control button serves to activate or deactivate the electronic device, and wherein the second remote control button selects a electronic device mode, wherein the electronic device mode is changed by momentarily clicking the second remote control button, and wherein an additional electronic device feature is adjusted by pressing and holding the second remote control button.
12. The system for providing remote control capability to an existing electronic device of claim 10, the remote control device further comprising shrink wrap plastic forming an outer protective layer thereof.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A packaged electronic chip, comprising:
a MEMS device having a conductive cap, a MEMS semiconductor substrate, and an output pad outputting an alternating current signal when the MEMS device is actuated;
an integrated circuit having an input pad for receiving the alternating current signal;
a wire bond coupling between the integrated circuit and the MEMS device;
a mechanism including a conductive plate electrically coupled to the conductive cap of the MEMS device and a conductive paddle electrically coupled to the MEMS device that shields the input pad, the output pad andor the wire bond creating a local voltage reference between the conductive plate and the conductive paddle through the MEMS semiconductor substrate and the conductive cap of the MEMS device, the local voltage reference fluctuating with electro-magnetic interference; and
molding material covering at least a portion of the integrated circuit, the wire bond, and the MEMS device.
2. A packaged electronic chip according to claim 1 wherein the conductive
plate and the conductive paddle act as a faraday cage reducing electro-magnetic interference from reaching the input pad, the wirebond, andor the output pad.
3. A packaged electronic chip according to claim 1 wherein the MEMS device and the integrated circuit are stacked within the molding material.
4. A packaged electronic chip according to claim 1 wherein the MEMS device and the integrated circuit are arranged side-by-side.
5. A packaged electronic chip according to claim 1 wherein the conductive plate is encapsulated in the molding material.
6. A packaged electronic chip according to claim 1 wherein the packaged electronic chip is packaged in a lead frame package.
7. A system comprising:
a printed circuit board having a plurality of predefined inputoutput nodes including at least one grounding node; and
a leadframe packaged chip including a leadframe having one or more inputoutput pads and a ground pad; the leadframe packaged chip including:
a MEMS device including a MEMS semiconductor substrate and a conductive cap;
an integrated circuit having a semiconductor substrate;
a wire bond electrically coupling a signal path between the integrated circuit and the MEMS device;
an electrically conductive plate that resides above the wire bond, wherein the conductive plate forms a low impedance path through the conductive cap of the MEMS device and the semiconductor substrate of the MEMS device, the semiconductor substrate of the integrated circuit and to the ground pad and wherein the ground pad is configured to be mounted to the grounding node of the printed circuit board and the inputoutput pads are positioned to be mounted with the predefined inputoutput nodes of the printed circuit board.
8. A system according to claim 7 wherein the ground pad is a conductive paddle.
9. A system according to claim 8 wherein the conductive plate and the conductive paddle act as a faraday cage reducing electro-magnetic interference from reaching the input pad, the wirebond, andor the output pad.
10. The system according to claim 8 wherein the conductive plate forms at least a portion of a top surface of the leadframe packaged chip and wherein a bottom surface includes the conductive paddle.
11. A system according to claim 7 wherein the MEMS device and the integrated circuit are stacked.
12. A system according to claim 7 wherein the leadframe packaged chip includes a molding material.
13. A system according to claim 12 wherein the molding material is an electrical insulator.
14. A system according to claim 12 wherein the conductive plate is encapsulated in the molding material.
15. The system according to claim 12 wherein the conductive plate resides on top of the molding material.
16. The system according to claim 12 wherein the conductive plate is at least partially exposed through the molding material.
17. A system according to claim 7 wherein the MEMS device and the integrated circuit are arranged side-by-side.