1. A method for dicing a semiconductor wafer including a top surface and a bottom surface, the bottom surface attached to an underlying layer of material, and the top surface comprising one or more device layers including a pattern of multiple, mutually spaced apart electronic circuit components separated by one or more streets, the method comprising:
applying a coating to the semiconductor wafer to protect the semiconductor wafer from debris generated by a first laser beam;
generating the first laser beam;
providing relative movement of the first laser beam with respect to the top surface of the semiconductor wafer to:
in a first pass of the first laser beam along one or more dicing streets, scribe the one or more device layers; and
in a second pass of the first laser beam along the one or more streets, at least partially dice the semiconductor wafer from the top surface along the one or more dicing streets, the first laser beam forming a kerf defined by sidewalls in the semiconductor wafer;
washing the semiconductor wafer to remove the coating;
etching the sidewalls of the at least partially diced semiconductor wafer to reduce or remove a heat affected zone (HAZ) produced in the sidewalls by the first laser beam; and
cutting through the underlying layer of material along the one or more dicing streets so as to separate a die from the semiconductor wafer having at least a predetermined die break strength and to produce a yield of operational die that equals at least a predetermined minimum yield,
the sidewall etching being performed before the cutting through the underlying layer of material to reduce or prevent debris on the sidewalls from the underlying layer of material during the etching of the sidewalls.
2. The method of claim 1, wherein the underlying layer of material comprises a die attach film (DAF).
3. The method of clam 2, wherein cutting through the underlying layer of material comprises:
generating a second laser beam; and
providing relative movement of the second laser beam with respect to the DAF along the one or more dicing streets.
4. The method of claim 3, wherein the first laser beam comprises a pulsed laser beam having an ultraviolet (UV) wavelength and with temporal pulsewidths selected from the group comprising nanosecond temporal pulsewidths and picosecond temporal pulsewidths.
5. The method of claim 4, wherein the second laser beam comprises a pulsed laser beam having a visible wavelength and with nanosecond temporal pulsewidths.
6. The method of claim 2, wherein etching the sidewalls comprises using a first etchant configured to remove semiconductor material from the semiconductor wafer, and
wherein cutting through the underlying layer of material comprises using a second etchant configured to remove the DAF material.
7. The method of claim 6, wherein the first etchant comprises a spontaneous etchant.
8. The method of claim 7, wherein the spontaneous etchant comprises xenon difluoride (XeF2).
9. The method of claim 6, wherein the second etchant comprises an oxide etchant.
10. The method of claim 1, wherein the underlying layer of material comprises a metal.
11. The method of claim 10, wherein cutting through the underlying layer of material comprises:
generating a second laser beam; and
providing relative movement of the second laser beam with respect to the metal along the one or more dicing streets.
12. The method of claim 10, wherein etching the sidewalls comprises using a first etchant configured to remove semiconductor material from the semiconductor wafer, and
wherein cutting through the underlying layer of material comprises using a second etchant configured to remove the metal.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A composition comprising
One or more corticosteroids;
Two or more penetration enhancers; and
One or more of the group consisting of solvents and emulsifiers, wherein the penetration enhancers are present in a ratio to a total of the penetration enhancers, and solvents and emulsifiers of at least about 0.90.
2. The composition of claim 1 wherein the corticosteroid comprises a fluorinated corticosteroid.
3. The composition of claim 1 wherein the corticosteroid comprises fluocinonide.
4. The composition of claim 1 wherein the corticosteroid comprises fluocinolone acetonide.
5. The composition of claim 1, 2, 3 or 4 wherein the corticosteroid is present at about 0.10%.
6. The composition of claim 1, 2, 3 or 4 wherein the corticosteroid is present at least about 0.50%.
7. The composition of claim 1, 2, 3 or 4 wherein the corticosteroid is present at least about 0.25%.
8. The composition of claim 1, 2, 3 or 4 wherein the penetration enhancers comprise two or more of the group consisting of propylene glycol, diisopropyl adipate, dimethyl isosorbide, 1,2,6 hexanetriol, and benzyl alcohol.
9. The composition of claim 1, 2, 3 or 4 wherein the penetration enhancers comprise two or more of the group consisting of propylene glycol, diisopropyl adipate and dimethyl isosorbide.
10. The composition of claim 1, 2, 3 or 4 wherein one penetration enhancer comprises propylene glycol.
11. (canceled)
12. (canceled)
13. The composition of claim 1 wherein the ratio is at least about 0.95.
14. The composition of claim 1 wherein the solvents and emulsifiers comprise one or more of the group consisting of dehydrated alcohol, alcohol (95% vv)USP, 3-Cyclohexene-1-Methanol, 4-Dimethyl-a-(4-Methyl-3-Pentenyl)-, Steareth-2, Steareth-21, citric acid, CPE-215, diisopropanolamine (1:9), DIPAPG (1:9), ethoxydiglycol, Potassium hydroxide (10%), PEG-40 Stearate, PEG-7000, Polysorbate 60, potassium hydroxide (1%), propylene carbonate USP, propylethylene glycol 4, oleyl alcohol, sodium lauryl sulfate, sorbitan monostearate, sorbitan stearate, and 1,2,3-Propanetriyl Ester.
15. The composition of claim 1 further comprising one or more non-solventemulsifier ingredients.
16. The composition of claim 15 wherein the non-solventemulsifier ingredients comprise one or more of the group consisting of Glyceryl Stearate (and) PEG-100 Stearate, carbopol 980, cyclomethicone NF, glyceryl monostearate, hydroxyethyl cellulose, hydroxypropyl cellulose, isopropyl myristate, methyl paraben NF, mineral oil, oleic acid NF, PEG-100 Stearate, petrolatum, propyl paraben NF, purified water, stearyl alcohol, white petrolatum, and white wax.
17. The composition of claim 1 wherein the solvents and emulsifiers are present at about 4-5%.
18. The composition of claim 15 wherein the non-solventemulsifier ingredients are present at about 11% to about 53%.
19. The composition of claim 15 wherein the non-solventemulsifier ingredients are present at about 11% to about 27%.
20.-60. (canceled)
61. A composition comprising
one or more corticosteroids;
two or more penetration enhancers;
one or more solventsemulsifiers; and
one or more non-solventemulsifier ingredients, wherein the one or more non-solventemulsifier ingredients include purified water, and wherein the non-solventemulsifier ingredients are different than the one or more solventsemulsifiers, and
wherein the penetration enhancers are present in a ratio to a total of the penetration enhancers, and solventsemulsifiers of at least about 0.90.
62. The composition of claim 61 wherein the corticosteroid comprises a fluorinated corticosteroid.
63. The composition of claim 61 wherein the corticosteroid comprises fluocinonide.
64. The composition of claim 61 wherein the corticosteroid comprises fluocinolone acetonide.
65. The composition of claim 61, 62, 63 or 64 wherein the corticosteroid is present at about 0.10%.
66. The composition of claim 61, 62, 63 or 64 wherein the corticosteroid is present at least about 0.50%.
67. The composition of claim 61, 62, 63 or 64 wherein the corticosteroid is present at least about 0.25%.
68. The composition of claim 61, 62, 63 or 64 wherein the penetration enhancers comprise two or more of the group consisting of propylene glycol, diisopropyl adipate, dimethyl isosorbide, 1,2,6 hexanetriol, and benzyl alcohol.
69. The composition of claim 61, 62, 63 or 64 wherein the penetration enhancers comprise two or more of the group consisting of propylene glycol, diisopropyl adipate and dimethyl isosorbide.
70. The composition of claim 61, 62, 63 or 64 wherein one penetration enhancer comprises propylene glycol.
71. The composition of claim 61 wherein the ratio is at least about 0.95.
72. The composition of claim 61 wherein the solvents and emulsifiers comprise one or more of the group consisting of dehydrated alcohol, alcohol (95% vv)USP, 3-Cyclohexene-1-Methanol, 4-Dimethyl-a-(4-Methyl-3-Pentenyl)-, Steareth-2, Steareth-21, citric acid, CPE-215, diisopropanolamine (1:9), DIPAPG (1:9), ethoxydiglycol, Potassium hydroxide (10%), PEG-40 Stearate, PEG-7000, Polysorbate 60, potassium hydroxide (1%), propylene carbonate USP, propylethylene glycol 4, oleyl alcohol, sodium lauryl sulfate, sorbitan monostearate, sorbitan stearate, and 1,2,3-Propanetriyl Ester.
73. The composition of claim 61 wherein the non-solventemulsifier ingredients comprise one or more of the group consisting of Glyceryl Stearate (and) PEG-100 Stearate, carbopol 980, cyclomethicone NF, glyceryl monostearate, hydroxyethyl cellulose, hydroxypropyl cellulose, isopropyl myristate, methyl paraben NF, mineral oil, oleic acid NF, PEG-100 Stearate, petrolatum, propyl paraben NF, purified water, stearyl alcohol, white petrolatum, and white wax.
74. The composition of claim 61 wherein the solvents and emulsifiers are present at about 4-5%.
75. The composition of claim 61 wherein the non-solventemulsifier ingredients are present at about 1% to about 53%.
76. The composition of claim 61 wherein the non-solventemulsifier ingredients are present at about 1% to about 27%.