1. A subassembly for use in an electrochemical device comprising:
(a) a first sintered electrode having a first surface and a second surface opposing the first surface,
(b) a first current collector surrounds a perimeter of the first electrode orthogonal to the first sintered electrode’s first surface, where a perimeter area of a portion of the first sintered electrode bonded to the first current collector is less than about 50% of a total area of the first sintered electrode, wherein the current collector is an inactive component, and
(c) a separator, wherein the second surface of the first sintered electrode is adjacent to the separator,
wherein the first sintered electrode is bonded to the separator or the first current collector or both, and
wherein the separator, the first current collector, or both are optionally sintered, and
(d) a second electrode, wherein the first and second electrodes are bonded to opposite surfaces of the separator.
2. The subassembly of claim 1, wherein the first current collector is in the shape of a border or frame.
3. The subassembly of claim 1, wherein the first current collector comprises a metallic current collector.
4. The subassembly of claim 1, wherein the separator comprises an organic compound, an inorganic-organic composite or blend, an inorganic compound, a particulate material, or a sintered particulate ceramic.
5. The subassembly of claim 1, wherein the first electrode comprises a layered oxide, a metal fluoride, or a lithium-transition metal phosphate compound, which optionally includes a dopant metal.
6. The subassembly of claim 1, wherein a portion of the first sintered electrode’s first surface to which the first current collector is confined is less than about 25% of the total area of the first sintered electrode.
7. The subassembly of claim 6, wherein the portion of the first sintered electrode’s first surface to which the first current collector is confined is less than about 15% of the total area of the first sintered electrode.
8. The subassembly of claim 1, wherein the second electrode comprises a sintered electrode.
9. The subassembly of claim 1, further comprising a second electrode and a second current collector, wherein the second electrode and the first electrode have a thermal bond to opposite surfaces of the separator and wherein the second current collector and the separator are bonded to opposite surfaces of the second electrode.
10. The subassembly of claim 1, wherein a thickness of an active layer of the first sintered electrode in the subassembly is at least about 200 \u03bcm.
11. The subassembly of claim 1, wherein a density of the subassembly is at least about 65% of theoretical.
12. The subassembly of claim 1, wherein the first electrode does not comprise a conductive additive.
13. The subassembly of claim 1, wherein a thickness of the first electrode is at least about 600 \u03bcm.
14. A subassembly for use in an electrochemical device comprising
(a) a first sintered electrode having a first surface and a second surface opposing the first surface, and
(b) a first current collector surrounding a perimeter of the first sintered electrode’s first surface, where a perimeter area of a portion of the first sintered electrode bonded to the first current collector is less than about 50% of a total area of the first sintered electrode and wherein the current collector is an inactive component, and
(c) a separator, wherein the second surface of the first sintered electrode is adjacent to the separator,
wherein the subassembly is produced by
(i) combining the first electrode with the first current collector and the separator and
(ii) heating the first electrode, the first current collector, and the separator under conditions effective to form a sintered subassembly,
wherein the separator, the first current collector, or both are optionally sintered.
15. The subassembly of claim 14, wherein the separator comprises a sintered separator.
16. The subassembly of claim 14, wherein the first current collector comprises a metallic current collector.
17. The subassembly of claim 14, wherein a portion of the first sintered electrode’s first surface to which the first current collector is confined is less than about 25% of the total area of the first sintered electrode.
18. The subassembly of claim 17, wherein the portion of the first sintered electrode’s first surface to which the first current collector is confined is less than about 15% of the total area of the first sintered electrode.
19. The subassembly of claim 14, further comprising a second electrode, wherein the first and second electrodes are bonded to opposite surfaces of the separator.
20. The subassembly of claim 19, wherein the second electrode comprises a sintered electrode.
21. The subassembly of claim 19, wherein the second electrode is free of conductive additives.
22. The subassembly of claim 14, further comprising a second electrode and a second current collector, wherein the second electrode and the first electrode are heated with the separator, the first current collector, and the second current collector to form a sintered subassembly.
23. The subassembly of claim 14, wherein the separator comprises an organic compound, an inorganic-organic composite or blend, an inorganic compound, a particulate material, or a sintered particulate ceramic.
24. The subassembly of claim 14, wherein the first electrode comprises a layered oxide, a metal fluoride, or a lithium-transition metal phosphate compound, which optionally includes a dopant metal.
25. The subassembly of claim 14, wherein a thickness of the subassembly is at least about 200 \u03bcm.
26. The subassembly of claim 14, wherein a density of the subassembly is at least about 65% of theoretical.
27. The subassembly of claim 14, wherein the first electrode does not comprise a conductive additive.
28. The subassembly of claim 14, wherein a thickness of the first electrode is at least about 600 \u03bcm.
29. An electrochemical device comprising:
(a) a positive electrode in electronic contact with a positive electrode current collector, the positive current collector in electrical connection with an external circuit;
(b) a negative electrode in electronic contact with a negative electrode current collector, the negative current collector in electrical connection with an external circuit;
(c) a separator positioned between the positive electrode and the negative electrode; and
(d) an electrolyte in ionic contact with the positive and negative electrodes;
wherein the positive electrode or the negative electrode and the separator comprise a sintered subassembly,
wherein at least one of the positive and negative electrodes is a sintered electrode having a first surface and a second surface opposing the first surface and the sintered electrode’s corresponding current collector surrounds a perimeter of the sintered electrode and is less than about 50% of a total area of the sintered electrode, and wherein the current collector is an inactive component.
30. The electrochemical device of claim 29, wherein a mass fraction of inactive materials in the device is less than about 50%.
31. The electrochemical device of claim 29, wherein a specific energy of the device is greater than about 300 Whkg at a power density of greater than about 600 Wkg.
32. The electrochemical device of claim 29, wherein the positive electrode does not comprise a conductive additive.
33. The electrochemical device of claim 29, wherein a thickness of the positive electrode is at least about 600 \u03bcm.
34. A process for preparing a subassembly for use in an electrochemical device according to claim 1 comprising:
(a) combining a first electrode with a separator; and
(b) heating the first electrode and the separator under conditions effective to form a sintered subassembly; and
(c) before or after the heating step, positioning a first current collector around the perimeter of the first electrode,
wherein the process produces a bond between at least the first electrode and the separator.
35. The process of claim 34 wherein the first current collector is bonded to the first electrode.
36. The process of claim 35, wherein bonding comprises forming a metal-metal bond between the first current collector and a metal film deposited at the first electrode perimeter, or thermal bonding or a forming a bond with a conductive adhesive.
37. The process of claim 34, wherein the first current collector comprises a metallic current collector.
38. The process of claim 34, wherein the heating step comprises heating the first electrode, the separator and the first current collector to form a sintered subassembly.
39. The process of claim 34, wherein a second electrode is combined with the first electrode and the separator, wherein the process produces a bond between first and second electrodes and opposite surfaces of the separator.
40. The process of claim 39, wherein the second electrode comprises a sintered electrode.
41. The process of claim 38, wherein the combining step further comprises combining a second electrode and a second current collector with the first electrode, the first current collector and the separator, and wherein the heating step comprises heating the second electrode and the first electrode with the separator, the first current collector, and the second current collector to form a sintered subassembly.
42. The process of claim 34, wherein the sintered separator comprises an organic compound, an inorganic-organic composite or blend, an inorganic compound, a particulate material, or a sintered particulate ceramic.
43. The process of claim 34, wherein the first sintered electrode comprises a layered oxide, a metal fluoride, or a lithium-transition metal phosphate compound, which optionally includes a dopant metal.
44. The process of claim 34, wherein the first electrode does not comprise a conductive additive.
45. The process of claim 34, wherein the thickness of the first electrode is at least about 600 \u03bcm.
46. A bipolar cell, comprising a plurality of stacked electrochemical cells, wherein the electrochemical cells are joined in series and wherein each of said stacked electrochemical cells comprises:
(a) a positive electrode in electronic contact with a positive electrode current collector, the positive current collector in electrical connection with an external circuit;
(b) a negative electrode in electronic contact with a negative electrode current collector, the negative current collector in electrical connection with an external circuit;
(c) a separator positioned between the positive electrode and the negative electrode; and
(d) an electrolyte in ionic contact with the positive and negative electrodes;
wherein the positive electrode and the negative electrode of each stack comprise a sintered electrode,
wherein at least one of the positive and negative electrodes is a sintered electrode having a first surface and a second surface opposing the first surface and the sintered electrode’s corresponding current collector surrounds a perimeter of the sintered electrode and is less than about 50% of a total area of the sintered electrode.
47. The bipolar cell of claim 46, wherein the separator comprises a sintered separator.
48. The bipolar cell of claim 46, wherein (a) the separator and (b) the positive electrode or the negative electrode or both are bonded.
49. The bipolar cell of claim 46, wherein (a) the positive electrode and (b) the separator or the positive current collector or both are bonded.
50. The bipolar cell of claim 46, wherein (a) the negative electrode and (b) the separator or the negative current collector or both are bonded.
51. The bipolar cell of claim 46, wherein the positive current collector, the positive electrode, the separator, the negative electrode and the negative current collector are bonded.
52. The bipolar cell of claim 46, wherein (a) the positive electrode and (b) the separator or the positive current collector or both comprise a sintered subassembly.
53. The bipolar cell of claim 46, wherein (a) the negative electrode and (b) the separator or the negative current collector or both comprise a sintered subassembly.
54. The bipolar cell of claim 46, wherein the positive current collector, the positive electrode, the separator, the negative electrode, and the negative current collector comprise a sintered subassembly.
55. The bipolar cell of claim 46, wherein the positive electrode or the negative electrode formed from a sintered ceramic is at least about 200 \u03bcm in thickness.
56. The bipolar cell of claim 46, wherein a sintered subassembly is at least about 200 \u03bcm in thickness.
57. The bipolar cell of claim 46, wherein the cell further comprises a redox shuttle.
58. The bipolar cell of claim 46, wherein the electrolyte comprises an electroactive additive.
59. The bipolar cell of claim 46, wherein the separator comprises an electroactive polymer, wherein the electroactive polymer forms a percolating pathway through the separator.
60. The bipolar cell of claim 46, wherein a thickness of the positive electrode or the negative electrode formed from a sintered ceramic varies by less than 25% from a mean thickness.
61. The bipolar cell of claim 46, wherein the positive electrode does not comprise a conductive additive.
62. The bipolar cell of claim 46, wherein a thickness of the positive electrode is at least about 600 \u03bcm.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method for selectively controlling the flow of data through a network device having a plurality of ports, with each port of said plurality of ports having a plurality of priority queues, comprising:
detecting congestion at at least one priority queue of said plurality of priority queues;
sending a virtual channel message to other network devices connected to said network device causing data destined for said one priority queue to be halted;
waiting for the congestion at the at least one priority queue to abate; and
sending a virtual channel resume message to the other network devices.
2. The method according to claim 1, wherein said step of detecting congestion at at least one priority queue comprises determining that said congestion is occurring when a number of packets received at the at least one priority queue exceeds a predetermined value.
3. The method according to claim 2, wherein said predetermined value is a backpressure limit threshold for said one priority queue.
4. The method according to claim 1, further comprising negotiating a virtual channel between said network devices and the other network devices prior to the step of detecting congestion at at least one priority queue.
5. The method according to claim 1, wherein said step of sending a virtual channel message to other network devices comprises sending a bitmap showing congestion states of the priority queues.
6. The method according to claim 5, wherein said congestion states bitmap is a combination of a port bitmap and a priority bitmap.
7. The method according to claim 1, wherein said plurality of priority queues correspond to a plurality of flow identification queues of data.
8. The method according to claim 7, wherein the flow identification queues are implemented as a link list with the network device and each one of said other network devices.
9. The method according to claim 1, wherein said step of detecting congestion at at least one priority queue comprises detecting congestion at the at least one priority queue of an ingress port of said plurality of ports.
10. The method according to claim 9, wherein a priority queue memory for each of said plurality of priority queues is set by a backpressure limit threshold.
11. The method according to claim 1, wherein said step of detecting congestion at at least one priority queue comprises detecting congestion at at least one priority queue of an egress port of said plurality of ports.
12. The method according to claim 11, wherein said plurality of priority queues correspond to a plurality of flow identification queues of data.
13. The method according to claim 12, wherein a flow identification corresponding to one of said flow identification queues is calculated once congestion is detected on the egress port.
14. The method according to claim 11, further comprising sending internal messages to all of said plurality of ports indicating congestion at said at least one priority queue after the step of detecting congestion at at least one priority queue.
15. The method according to claim 14, further comprising sending out virtual channel messages indicating congestion by said all of said plurality of ports.
16. A method for selectively controlling the flow of data in a network device comprising:
receiving a virtual channel message indicating congestion at at least one priority queue of a port of a remote network device;
halting the transfer of data destined for said one priority queue from said network device;
waiting for the congestion at the at least one priority queue to abate; and
sending data destined for said at least one priority queue to said network device.
17. The method according to claim 16, wherein said step of waiting for the congestion at the at least one priority queue to abate comprises awaiting a resume virtual channel message from said remote network device.
18. The method according to claim 16, wherein said step of waiting for the congestion at the at least one priority queue to abate comprises monitoring a pause timer, which is started upon receipt of said virtual channel message and carrying out said step of sending data destined for said at least one priority queue once said pause timer reaches a certain value.
19. The method according to claim 16, wherein said step of receiving a virtual channel message from the remote network device comprises receiving a bitmap showing congestion states of all priority queues of the remote network device.
20. The method according to claim 19, wherein said congestion states bitmap is a combination of a port bitmap and a priority bitmap.
21. The method according to claim 16, wherein said at least one priority queue corresponds to at least one flow identification queue.
22. The method according to claim 21, wherein a flow identification of said at least one flow identification queue is determined through negotiations between said network device and the remote network device.
23. The method according to claim 21, wherein the at least one flow identification queue is implemented as a link list with the network device and the remote network devices.
24. The method according to claim 16, further comprising sending internal messages to all ports of said network device indicating congestion at said at least one priority queue after the step of receiving a virtual channel message.
25. The method according to claim 24, further comprising sending out virtual channel messages indicating congestion by said all ports of said network device.
26. A network device for selectively controlling the flow of data through the network device comprising:
a plurality of ports, with each port of said plurality of ports having a plurality of priority queues
means for detecting congestion at at least one priority queue of said plurality of priority queues;
means for sending and receiving a virtual channel message indicating congestion at said at least one priority queue or other priority queue of other network devices connected to said network device;
means for selectively sending data destined for said at least one priority queue or other priority queue based on said virtual channel message; and
means for sending and receiving a virtual channel resume message.
27. The network device according to claim 26, wherein said means for detecting congestion at at least one priority queue comprises means for determining that said congestion is occurring when a number of packets received at the at least one priority queue exceeds a predetermined value.
28. The network device according to claim 27, wherein said predetermined value is a backpressure limit threshold for said one priority queue.
29. The network device according to claim 26, wherein said means for sending and receiving a virtual channel message comprises means for sending and receiving a bitmap showing congestion states of the priority queues.
30. The network device according to claim 29, wherein said congestion states bitmap is a combination of a port bitmap and a priority bitmap.
31. The network device according to claim 26, wherein said plurality of priority queues correspond to a plurality of flow identification queues of data.
32. The network device according to claim 31, wherein flow identifications of said flow identification queues are determined by negotiation means exchanging data between said network device and the other network devices.
33. The network device according to claim 31, wherein the flow identification queues are implemented as a link list with the network device and each one of said other network devices.
34. The network device according to claim 26, wherein said means for detecting congestion at at least one priority queue comprises means for detecting congestion at the at least one priority queue of an ingress port of said plurality of ports.
35. The network device according to claim 34, wherein a priority queue memory for each of said plurality of priority queues is set by a backpressure limit threshold.
36. The network device according to claim 26, wherein said means for detecting congestion at one priority queue comprises means for detecting congestion at the at least one priority queue of an egress port of said plurality of ports.
37. The network device according to claim 36, wherein said plurality of priority queues correspond to a plurality of flow identification queues of data.
38. The network device according to claim 37, further comprising calculation means for calculating a flow identification corresponding to one of said flow identification queues once congestion is detected on the egress port.
39. The network device according to claim 36, further comprising means for sending internal messages to all of said plurality of ports indicating congestion at said at least one priority queue when said means for detecting congestion at at least one priority queue detects congestion.
40. The network device according to claim 39, wherein said means for sending and receiving the virtual channel message is configured to send the virtual channel message to other network devices based on internal messages sent by said means for sending internal messages.