1. A method comprising:
providing a cooling apparatus comprising a door assembly sized to couple to an electronics rack and be disposed at one of an air inlet side or an air outlet side of the electronics rack, wherein air moves through the electronics rack from the air inlet side to the air outlet side thereof, the door assembly facilitating cooling of one or more electronic components of the electronics rack, and wherein the door assembly comprises:
an airflow opening facilitating ingress or egress of airflow through the electronics rack with the door assembly mounted thereto;
an air-to-coolant heat exchanger disposed so that airflow through the airflow opening passes across the air-to-coolant heat exchanger, the air-to-coolant heat exchanger to extract heat from the airflow passing thereacross; and
a vapor condenser, the vapor condenser being part of the door assembly, and facilitating condensing of dielectric fluid vapor egressing from at least one immersion-cooled electronic component section of the electronics rack with the door assembly mounted to the electronics rack and the vapor condenser connected in fluid communication with the immersion-cooled electronic component section of the electronics rack.
2. The method of claim 1, wherein the door assembly further comprises at least one facility coolant inlet coupled to receive facility coolant, wherein the facility coolant received via the at least one facility coolant inlet cools the air-to-coolant heat exchanger, and cools the vapor condenser.
3. The method of claim 1, wherein the door assembly further comprises a facility coolant inlet coupled to receive facility coolant, the facility coolant cooling the air-to-coolant heat exchanger, and cooling the vapor condenser, and wherein the cooling apparatus further comprises a diverter valve associated with the facility coolant inlet for selectively directing received facility coolant to at least one of the air-to-coolant heat exchanger or the vapor condenser.
4. The method of claim 2, wherein the air-to-coolant heat exchanger further comprises a first plurality of facility coolant-carrying tubes, and a first plurality of thermally conductive fins coupled to the first plurality of facility coolant-carrying tubes, and wherein the vapor condenser comprises a second plurality of facility coolant-carrying tubes and a second plurality of thermally conductive fins coupled to the second plurality of facility coolant-carrying tubes.
5. The method of claim 1, wherein the vapor condenser is disposed within a vapor-condensing chamber of the door assembly, and wherein the vapor-condensing chamber further comprises a reservoir, the reservoir receiving dielectric fluid condensate dripping from the vapor condenser.
6. The method of claim 5, further comprising:
a dielectric fluid supply manifold in fluid communication with at least one dielectric fluid inlet of the at least one immersion-cooled electronic component section of the electronics rack; and
at least one pump coupled in fluid communication with the reservoir for pumping, under pressure, dielectric fluid liquid from the reservoir to the dielectric fluid supply manifold, for supplying dielectric fluid liquid to the at least one immersion-cooled electronic component section of the electronics rack.
7. The method of claim 6, further comprising providing at least one coolant-conditioning unit associated with the electronics rack, the at least one coolant-conditioning unit comprising at least one liquid-to-liquid heat exchanger, the at least one liquid-to-liquid heat exchanger facilitating transfer of heat from dielectric fluid liquid, pumped by the at least one pump from the reservoir to the dielectric fluid supply manifold, to facility coolant within a facility coolant path passing, in part, through the at least one coolant-conditioning unit.
8. The method of claim 7, wherein the facility coolant, after passing through the at least one liquid-to-liquid heat exchanger, passes through at least one facility coolant inlet of the door assembly to facilitate extracting heat from the airflow passing across the air-to-coolant heat exchanger and facilitate condensing of the dielectric fluid vapor at the vapor condenser.
9. The method of claim 1, wherein the vapor condenser further comprises at least one dielectric fluid vapor-carrying tube with a plurality of openings therein which facilitate escape of dielectric fluid vapor from the at least one dielectric fluid vapor-carrying tube, wherein the at least one dielectric fluid vapor-carrying tube facilitates distribution of the dielectric fluid vapor across the vapor condenser.
10. The method of claim 1, wherein the electronics rack comprises at least one air-cooled electronic component section and the at least one immersion-cooled electronic component section, the at least one immersion-cooled electronic component section comprising at least one immersion-cooled electronics enclosure, and with the door assembly mounted to the electronics rack, the airflow opening of the door assembly is disposed, at least in part, to facilitate airflow across the at least one air-cooled electronic component section of the electronics rack.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A network link diagnostic method, comprising:
transmitting, from a first physical layer device to a second physical layer device, first link diagnostic capability information, said first link diagnostic capability information enabling a determination of the link diagnostic capabilities of said first physical layer device;
receiving, by said first physical layer device from said second physical layer device, second link diagnostic capability information, said second link diagnostic capability information enabling a determination of the link diagnostic capabilities of said second physical layer device;
comparing, by said first physical layer device, said first link diagnostic capability information to said second link diagnostic capability information;
if said comparison indicates that said second physical layer device has more advanced link diagnostic capabilities than said first physical layer device, then accepting link information generated based on the link diagnostic capabilities of said second physical layer device in a link analysis process conducted by said first physical layer device; and
if said comparison indicates that said first physical layer device has more advanced link diagnostic capabilities than said second physical layer device, then accepting link information generated based on the link diagnostic capabilities of said first physical layer device in said link analysis process conducted by said first physical layer device.
2. The method of claim 1, wherein said transmitting comprises transmitting an autonegotiation next page message.
3. The method of claim 1, wherein said transmitting comprises transmitting type-length-value packets.
4. The method of claim 1, wherein said transmitting comprises transmitting using physical layer signaling.
5. The method of claim 1, wherein said link information is a link length.
6. The method of claim 1, wherein said link information is a network cable type.
7. The method of claim 1, wherein said link information is a cable power loss budget.
8. A network link diagnostic method, comprising:
transmitting, from a first physical layer device to a second physical layer device, first link diagnostic capability information, said first link diagnostic capability information enabling a determination of the link diagnostic capabilities of said first physical layer device;
receiving, by said first physical layer device from said second physical layer device, second link diagnostic capability information, said second link diagnostic capability information enabling a determination of the link diagnostic capabilities of said second physical layer device; and
designating based on a comparison of said first link diagnostic capability information to said second link diagnostic capability information one of said first physical layer device and said second physical layer device as a source of link diagnostic information for one or more link related parameters used by both said first physical layer device and said second physical layer device.
9. The method of claim 8, wherein said transmitting comprises transmitting an autonegotiation next page message.
10. The method of claim 8, wherein said transmitting comprises transmitting type-length-value packets.
11. The method of claim 8, wherein said transmitting comprises transmitting using physical layer signaling.
12. The method of claim 8, wherein said link related information is a link length.
13. The method of claim 8, wherein said link related information is a network cable type.
14. The method of claim 8, wherein said link related information is a cable power loss budget.
15. A network link diagnostic method, comprising:
receiving, by a first physical layer device from a second physical layer device over a network link, link diagnostic capability information, said link diagnostic capability information enabling a determination of the link diagnostic capabilities of said second physical layer device;
receiving link related information from said second physical layer device that is based at least in part on link diagnostics performed by said second physical layer device; and
modifying a parameter of operation of said first physical layer device based on said received link related information.
16. The method of claim 15, wherein said receiving link diagnostic capability information comprises receiving an autonegotiation next page message.
17. The method of claim 15, wherein said receiving link diagnostic capability information comprises receiving type-length-value packets.
18. The method of claim 15, wherein said receiving link diagnostic capability information comprises receiving using physical layer signaling.
19. The method of claim 15, wherein said link related information is a link length.
20. The method of claim 15, wherein said link related information is a network cable type.
21. The method of claim 15, wherein said link related information is a cable power loss budget.