1. An integrated circuit device, comprising:
a first-in first-out (FIFO) memory chip configured to support a pair of hybrid operating modes that enable the FIFO memory chip to be depth-expandable with other FIFO memory chips in a collective standard mode of operation, said pair of hybrid operating modes including a first hybrid mode that supports a write interface configured in standard mode and a read interface configured in first-word fall-through (FWFT) mode and a second hybrid mode that supports a write interface configured in FWFT mode and a read interface configured in standard mode.
2. The device of claim 1, wherein the first hybrid mode supports a write interface having a full flag pin that designates when said FIFO memory chip is full and a read interface having an output ready pin that designates when said FIFO memory chip has at least one entry therein.
3. The device of claim 2, wherein the second hybrid mode supports a write interface having an input ready pin that designates when said FIFO memory chip can accept additional entries and a read interface having an empty flag pin that designates when said FIFO memory chip is empty.
4. The device of claim 3, wherein said FIFO memory chip has a pin that is responsive to a standard depth expansion mode signal.
5. The device of claim 1, wherein said FIFO memory chip comprises a FIFO memory controller chip having cache memory arrays therein and a external memory interface that supports read and write data transfers between the cache memory arrays and a random access memory device.
6. The device of claim 1, wherein said FIFO memory chip comprises:
a first cache memory device having a first page of quad-port memory cells therein that is configured to support writing and reading of FIFO vectors to and from columns in the first page and writing and reading of memory vectors to and from rows in the first page.
7. An integrated circuit system, comprising:
a plurality of first-in first-out (FIFO) memory controller chips that collectively support standard mode operation when cascaded in a depth expansion configuration.
8. The integrated circuit system of claim 7, wherein said plurality of first-in first-out (FIFO) memory controller chips comprise a front-end FIFO memory controller chip disposed in a first hybrid mode that supports a corresponding write interface configured in standard mode and a corresponding read interface configured in first-word fall-through (FWFT) mode, and a back-end FIFO memory controller chip disposed in a second hybrid mode that supports a corresponding write interface configured in FWFT mode and a corresponding read interface configured in standard mode.
9. An integrated circuit device, comprising:
a first-in first-out (FIFO) memory chip having cache and embedded memory elements therein, said FIFO memory chip configured to support a pair of hybrid operating modes that enable said FIFO memory chip to be depth-expandable with other FIFO memory chips in a collective standard mode of operation, said pair of hybrid operating modes including a first hybrid mode that supports a write interface configured in standard mode and a read interface configured in first-word fall-through (FWFT) mode and a second hybrid mode that supports a write interface configured in FWFT mode and a read interface configured in standard mode.
10. The device of claim 9, wherein the first hybrid mode supports a write interface having a full flag pin that designates when said FIFO memory chip is full and a read interface having an output ready pin that designates when said FIFO memory chip has at least one entry therein.
11. The device of claim 10, wherein the second hybrid mode supports a write interface having an input ready pin that designates when said FIFO memory chip can accept additional entries and a read interface having an empty flag pin that designates when said FIFO memory chip is empty.
12. The device of claim 11, wherein said FIFO memory chip has a pin that is responsive to a standard depth expansion mode signal.
13. An integrated circuit device, comprising:
a first-in first-out (FIFO) memory chip configured to support at least one hybrid operating mode that enables said FIFO memory chip to be depth-expandable with another FIFO memory chip in a collective standard mode of operation, said at least one hybrid mode supporting a write interface configured in standard mode and a read interface configured in first-word fall-through (FWFT) mode.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A sealing element for a fitting part, comprising:
a top section, comprising:
a first surface configured to bear against an outer face of an annular groove of the fitting part; and
a second surface intersecting the first surface at a first angle, wherein the second surface is configured to bear against a bottom face of the annular groove of the fitting part;
a bottom section, comprising:
a third surface intersecting the second surface at a second angle, wherein the third surface is configured to bear against the bottom face of the annular groove; and
a fourth surface intersecting the third surface; and
an indentation formed at an intersection between the second surface and the third surface, wherein the indentation provides a transition between a first width of the top section and a second width of the bottom section, wherein the second width is greater than the first width;
wherein the sealing element extends as a continuous structure along a circumferential axis such that a conical plane of the sealing element is oriented at a third angle to a longitudinal axis of the fitting part.
2. The sealing element of claim 1, wherein the third angle is substantially 90 degrees and the conical plane is substantially flat.
3. The sealing element of claim 1, wherein the sealing element is substantially symmetrical about the conical plane.
4. The sealing element of claim 1, wherein the second angle is between 90 degrees and 270 degrees.
5. The sealing element of claim 1, wherein the fourth surface is curved and has a generally convex shape relative to the first surface.
6. The sealing element of claim 1, wherein the sealing element is configured to substantially fill the groove while the sealing element is compressed into the groove by a mating part.
7. The sealing element of claim 6, wherein the third surface of the sealing element contacts the mating part while the mating part compresses the sealing element into the groove.
8. The sealing element of claim 1, wherein the fourth surface comprises a fifth surface intersecting the third surface at a fourth angle, and a sixth surface intersecting the third surface at a fifth angle.
9. The sealing element of claim 1, wherein a top height of the top section is greater than a bottom height of the bottom section.
10. The sealing element of claim 1, wherein the third angle is between 90 and 180 degrees.
11. A sealing system, comprising:
a fitting part, comprising:
an outer face at an outer radius;
an inner face at an inner radius, wherein the inner radius is smaller than the outer radius;
a bottom face extending between the outer face to the inner face; and
a lip disposed proximate to the outer face and extending over the bottom face;
wherein the outer face, the inner face, the bottom face, and the lip form a groove; and
a sealing element configured to be disposed within the groove and arranged at an installation angle relative to the bottom face, wherein the sealing element comprises:
at least two surfaces coupled together via at least one indentation;
a top section having a first width and comprising at least one of the at least two surfaces; and
a bottom section having a second width and comprising at least one of the at least two surfaces, wherein the second width is greater than the first width;
wherein the sealing element extends as a continuous structure along a circumferential axis such that a conical plane of the sealing element is oriented at an angle relative to a longitudinal axis of the fitting part, and the sealing element is substantially symmetrical about the conical plane; and
wherein the at least one surface of the top section is configured to engage the lip and the at least one indentation is configured to facilitate deformation of the sealing element upon compression.
12. The sealing system of claim 11, comprising a mating part configured to couple to the fitting part and to compress the sealing element within the groove.
13. The sealing system of claim 11, wherein the sealing element is formed from nitrile, a polymer, a metal, or a combination thereof.
14. The sealing system of claim 11, wherein the angle is substantially 90 degrees and the conical plane is substantially flat.
15. The sealing system of claim 11, wherein at least one of the at least two surfaces is curved.
16. A method of installing a sealing element into a fitting part, comprising:
placing the sealing element above a groove in the fitting part, wherein the groove is formed by an outer face, an inner face, a bottom face extending between the outer face and the inner face, and a lip extending from the outer face over the bottom face;
positioning the sealing element at an installation angle within the groove, such that a first surface of the sealing element is arranged proximate to the outer face to establish a space between the first surface and the outer face, a second surface of the sealing element engages the lip, and an indentation formed by a third surface of the sealing element intersecting the second surface is positioned proximate to the bottom face of the groove; and
compressing the sealing element into the groove with a mating part, such that a depth of the indentation is decreased via deformation, and the second surface and the third surface bear against the bottom face.
17. The method of claim 16, comprising positioning the third surface of the sealing element proximate to the bottom face.
18. The method of claim 16, wherein positioning the sealing element at an installation angle comprises positioning a conical plane of the sealing element at an angle relative to the bottom face, wherein the conical plane is oriented at an angle relative to a longitudinal axis of the fitting part.
19. The method of claim 16, wherein placing the first surface of the sealing element proximate to the outer face comprises disposing the first surface between the lip and the bottom face.
20. The method of claim 16, wherein positioning the sealing element at the installation angle within the groove comprises deforming the sealing element via a compressive force applied to a top section of the sealing element.