1. A composite filter cartridge comprising:
a concave housing defining an interior space having a longitudinal axis, said housing having a closed first end and at least one engagement feature adjacent an open second end;
filter media supported within said interior space and surrounding said longitudinal axis between first and second axial ends;
a first end cap secured to said first axial end of said filter media and having an outside surface complementary to said at least one engagement feature, said first end cap spanning said open second end and defining a fluid inlet and a fluid outlet;
a retainer configured to surround said concave housing and including an interior surface complementary to said outside surface of said upper end cap and said at least one engagement feature,
wherein said retainer and first end cap are both engaged with said at least one engagement feature and secured to each other, thereby securing said housing to said upper end cap.
2. The composite filter cartridge of claim 1, wherein said housing is cylindrical, said at least one engagement feature takes the form of a continuous or discontinuous lip at said housing second end, an interface between said upper end cap outside surface and said retainer is rotationally symmetrical and said upper end cap and retainer are joined by spin bonding.
3. The composite filter cartridge of claim 1, wherein said upper end cap and retainer are joined by solvent welding or adhesive bonding.
4. The composite filter cartridge of claim 1, wherein said retainer forms a shoulder facing said housing second end.
5. The composite filter cartridge of claim 1, wherein said retainer defines attachment structures for engagement with complementary structures on a filter head to retain the cartridge to the head.
6. The composite filter cartridge of claim 1, wherein said upper end cap outside surface having first and second diameters defining a first shoulder, said retainer has second and third diameters defining a second shoulder and said at least one engagement feature is trapped between said first and second shoulders when said retainer is joined to said upper end cap.
7. The composite filter cartridge of claim 1, wherein said housing is metal and said upper end cap and retainer are plastic.
8. A method of manufacturing a composite filter cartridge:
providing a concave housing defining an interior space, having an open end and an engagement feature adjacent said open end said housing surrounding a longitudinal axis;
providing filter media surrounding said longitudinal axis and extending between first and second axial ends;
securing an upper end cap to said filter media first end, said upper end cap configured to span said open end and defining a fluid inlet communicating with a region of said interior space outside said filter media and a fluid outlet communicating with a region of said interior space surrounded by said filter media, said upper end cap having a peripheral surface complementary to said engagement feature;
securing a lower end cap to said filter media second end, said lower end cap spanning and closing said filter media second end;
inserting said filter media, upper end cap and lower end cap into said housing interior space with said end cap peripheral surface abutting said engagement feature;
providing a retainer configured to surround said housing and including an inside surface complementary to said upper end cap peripheral surface and said engagement feature;
joining said upper end cap and retainer to secure said upper end cap to said housing with said engagement feature trapped between said upper end cap outside surface and said retainer inside surface, said fluid inlet communicating with a region of said interior space outside said filter media and said fluid outlet communicating with a region of said interior space surrounded by said filter media so that fluid entering said interior space must flow through said filter media to leave said filter cartridge.
9. The method of claim 8, wherein said step of providing said housing comprises providing a metal housing and said step of providing said upper end cap and said retainer comprises providing plastic upper end cap and plastic retainer.
10. The method of claim 9, wherein said step of joining said upper end cap and retainer comprises joining said upper end cap and retainer by spin bonding, solvent welding or adhesive bonding.
11. The method of claim 8, wherein said housing is cylindrical, said upper end cap outside surface and said retainer inside surface are rotationally symmetrical.
12. The method of claim 11, wherein said step of joining comprises spin bonding said upper end cap and said retainer.
13. The method of claim 8, wherein said step of providing said retainer comprises providing a retainer having an outside surface including attachment structures for securing said composite filter cartridge to a filter head.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A light emitting device comprising:
an LED chip and a mounting substrate,
said LED chip comprising an n-type nitride semiconductor layer, a nitride light emission layer, a p-type nitride semiconductor layer, an anode electrode, and a cathode electrode,
said n-type nitride semiconductor layer having a first surface,
said nitride light emission layer being disposed on said first surface of said n-type nitride semiconductor layer,
said p-type nitride semiconductor layer being disposed on said nitride light emission layer,
said anode electrode being opposite of said nitride light emission layer from said p-type nitride semiconductor layer and covering said p-type nitride semiconductor layer,
said cathode electrode being disposed on said first surface of said n-type nitride semiconductor layer,
said mounting substrate being configured to mount said LED chip,
said mounting substrate having a first patterned conductor which is coupled to said cathode electrode through a cathode bump and a second patterned conductor which is electrically and physically connected to anode bumps, said anode bumps being electrically and physically connected to said anode electrode,
said LED chip comprising dielectric layers which have an arrangement which resembles an island and a light reflective conductive film covering said dielectric layers,
said dielectric layers having a refractive index which is smaller than a refractive index of said p-type nitride semiconductor layer,
said dielectric layers being located between said p-type nitride semiconductor layer and said anode electrode,
said p-type nitride semiconductor layer having first regions which are overlapped with said anode bumps in a planer view, respectively,
said dielectric layers being not overlapped with said first regions,
said light reflective conductive film being located between said anode electrode and said dielectric layers, and
said anode electrode does not penetrate said light reflective conductive film.
2. The light emitting device as set forth in claim 1, wherein
said LED chip further comprises a transparent conductive film,
said transparent conductive film being disposed between the said p-type nitride semiconductor layer and said anode electrode,
said transparent conductive film having a refractive index which is lower than the refractive index of said p-type nitride semiconductor layer,
said light reflective conductive film being disposed between said transparent conductive film and said anode electrode,
said dielectric layers being partially formed on said transparent conductive film,
said dielectric layers having the arrangement which resembles the island, and
said dielectric layers being formed between said transparent conductive film and said light reflective conductive film.
3. The light emitting device as set forth in claim 1, wherein
each of said first regions is a plane which is perpendicular to a thickness direction of said p-type nitride semiconductor layer,
said plane having a circular shape,
said first regions being overlapped with said anode bumps, respectively, in the thickness direction of said p-type nitride semiconductor layer.
4. The light emitting device as set forth in claim 2, wherein
each of said first regions is a plane which is perpendicular to a thickness direction of said p-type nitride semiconductor layer,
said plane having a circular shape,
said first regions being overlapped with said anode bumps, respectively, in the thickness direction of said p-type nitride semiconductor layer.
5. The light emitting device as set forth in claim 1, wherein each of said dielectric layers has a two-layer structure.
6. The light emitting device as set forth in claim 1, wherein each of said dielectric layers includes a silicon oxide layer and a zirconium oxide layer.
7. The light emitting device as set forth in claim 1, wherein each of said first regions is surrounded by said dielectric layers.
8. The light emitting device as set forth in claim 1, wherein said dielectric layers are arranged to be spaced from an adjacent dielectric layer by the same distance.
9. The light emitting device as set forth in claim 7, wherein said dielectric layers are arranged to be spaced from an adjacent dielectric layer by the same distance.
10. A light emitting device comprising:
an LED chip and a mounting substrate,
said LED chip comprising an n-type nitride semiconductor layer, a nitride light emission layer, a p-type nitride semiconductor layer, an anode electrode, and a cathode electrode,
said n-type nitride semiconductor layer having a first surface,
said nitride light emission layer being disposed on said first surface of said n-type nitride semiconductor layer,
said p-type nitride semiconductor layer being disposed on said nitride light emission layer,
said anode electrode being opposite of said nitride light emission layer from said p-type nitride semiconductor layer and covering said p-type nitride semiconductor layer,
said cathode electrode being disposed on said first surface of said n-type nitride semiconductor layer,
said mounting substrate being configured to mount said LED chip,
said mounting substrate having a first patterned conductor which is coupled to said cathode electrode through a cathode bump and a second patterned conductor which is electrically and physically connected to anode bumps, said anode bumps being electrically and physically connected to said anode electrode,
said LED chip comprising a dielectric layer having openings and a light reflective conductive film covering said dielectric layer,
said dielectric layer having a refractive index which is smaller than a refractive index of said p-type nitride semiconductor layer,
said dielectric layer being located between said p-type nitride semiconductor layer and said anode electrode,
in a planer view, said anode bumps overlapping with said openings, respectively, and not overlapping with said dielectric layer,
said anode electrode not directly contacting said p-type nitride semiconductor layer,
said light reflective conductive film being located between said dielectric layer and said anode electrode, and
said anode electrode does not penetrate said light reflective conductive film.
11. The light emitting device as set forth in claim 10, wherein each of said dielectric layers has a two-layer structure.
12. The light emitting device as set forth in claim 10, wherein each of said dielectric layers includes a silicon oxide layer and a zirconium oxide layer.