1. A solid-state imaging apparatus comprising:
an insulating structural body formed with a through opening;
a wiring part formed on a surface of the structural body;
a solid-state imaging element connected to the wiring part and attached to the structural body so as to close the through opening;
a translucent member opposed to the solid-state imaging element so as to close the through opening and attached to the structural body through an adhesive inside an adhesion region; and
a solder resist film covering at least a part of the surface of the structural body;
wherein the adhesion region includes a region in which the solder resist film is selectively removed and the removed region is filled with the adhesive.
2. The solid-state imaging apparatus as claimed in claim 1, wherein the adhesion region is surrounded by the solder resist film.
3. The solid-state imaging apparatus as claimed in claim 1, wherein the adhesion region constructs a communication region.
4. The solid-state imaging apparatus as claimed in claim 1, wherein a film thickness of the adhesive is constructed so as to be thicker than that of the solder resist film, and a region sandwiched in a region in which the solder resist film is removed constructs an air escape part.
5. The solid-state imaging apparatus as claimed in claim 4, wherein a dust trap pocket is provided inside the air escape part.
6. The solid-state imaging apparatus as claimed in claim 5, wherein a meander-shaped pattern is formed in a region in which the solder resist film is removed, constructing a dust trap pocket in the air escape part.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A thermoplastic bonded substrate comprising:
a linerboard substrate;
a plastic based material extruded to a first side of said linerboard substrate; and
a thermoplastic material layer coated on a second side of said linerboard substrate, said thermoplastic layer configured to provide adhesive properties when exposed to infrared radiation, said thermoplastic material layer comprising a mineral additive in an amount sufficient to absorb heat upon activation of said adhesive properties.
2. The substrate in accordance with claim 1 wherein said thermoplastic material layer further comprises said mineral additive in an amount low enough to prevent rapid heating of said thermoplastic layer.
3. The substrate in accordance with claim 2, wherein said mineral additive is selected from the group consisting of calcium carbonate, talc, fumed silica, mica, clay and Diatomaceous Earth (DE).
4. The substrate in accordance with claim 2 wherein said substrate, when exposed to said infrared radiation, comprises a temperature gradient there-through such that said temperature gradient decreases from said thermoplastic material layer to said linerboard.
5. The substrate in accordance with claim 1 wherein said thermoplastic material is selected from the group consisting of LDPE, HDPE, LLDPE, metallocene polyethylene, EVA, EMA, EEA, EAA, EnBA and polypropylene.
6. The substrate in accordance with claim 1 wherein said thermoplastic material is selected from the group consisting of thermoplastic urethanes, extrudable polyester and extrudable nylon.
7. The substrate in accordance with claim 1, wherein said thermoplastic material is a black low density polyethylene.
8. The substrate in accordance with claim 1 wherein said plastic based material is polypropylene.
9. The substrate in accordance with claim 1, wherein said plastic based material acts as a moisture barrier to prevent the escape of moisture from said substrate.
10. A method of laminating a substrate comprising:
coating a linerboard with a thermoplastic resin, said resin having a mineral additive to act as a heat sink when exposed to infrared radiation;
extruding a plastic based material to said linerboard; and
exposing said thermoplastic resin to infrared radiation sufficient to activate adhesive properties of said resin.
11. The method in accordance with claim 10. wherein said mineral additive is selected from the group consisting of calcium carbonate, talc, fumed silica, mica, clay and Diatomaceous Earth (DE).
12. The method in accordance with claim 10 wherein said thermoplastic resin is selected from the group consisting of LDPE, HDPE, LLDPE, metallocene polyethylene, EVA, EMA, EEA, EAA, EnBA and polypropylene.
13. The method in accordance with claim 10 wherein said thermoplastic resin is selected from the group consisting of thermoplastic urethanes, extrudable polyester and extrudable nylon.
14. The method in accordance with claim 10 further comprising the step of heating said thermoplastic resin to 110\xb0 C.-120\xb0 C.
15. The method in accordance with claim 14 further comprising the step of adhering said substrate to a polystyrene foam material.