1. A system, comprising:
a router coupled to a shared network;
a remote device in communication with the router; and
a virtual device relay in communication with the router and the shared network.
2. The system of claim 1, further comprising a server, in which the server hosts, in a virtualized environment, the router and the virtual device relay.
3. The system of claim 1, further comprising an appliance in communication with the virtual device relay.
4. The system of claim 3, further comprising a broker coupled with the remote device, in which the broker authenticates the remote device for communicating with the virtual device relay through the router.
5. The system of claim 4, in which the virtual device relay is a member of a first community-of-interest and the appliance is a member of the first community-of-interest.
6. The system of claim 5, further comprising a second virtual device relay, in which the second virtual device relay is a member of a second community-of-interest.
7. The system of claim 1, in which the virtual device relay is configured to receive data from the remote device and transmit the data to the shared network.
8. An apparatus, comprising
a server configured to execute virtualized appliances, in which the virtualized appliances comprise:
a virtual device relay; and
a router in communication with the virtual device relay.
9. The apparatus of claim 8, in which the router is configured to relay data received from a remote device to the virtual device relay.
10. The apparatus of claim 9, in which the router is configured to relay data to the virtual device relay over a clear-text network.
11. The apparatus of claim 9, in which the server is configured to execute the virtual device relay in a first Linux host.
12. The apparatus of claim 11, in which the server is further configured to execute a service in a second Linux host, in which the virtual device relay relays data received from the remote device to the service, in which the service is a web site.
13. The apparatus of claim 12, in which the virtual device relay relays data to the service over a shared network.
14. The apparatus of claim 13, in which the first Linux host and the second Linux host are members of a common community-of-interest.
15. The apparatus of claim 11, in which the server is further configured to execute a second virtual device relay in a second Linux host.
16. A method, comprising:
receiving an incoming connection from a remote device;
starting a virtual machine host on a shared network, the virtual machine host executing a virtual device relay;
receiving data from the remote device; and
relaying the data from the virtual device relay to a device on the shared network.
17. The method of claim 16, in which the step of receiving the incoming connection comprises receiving authorization information.
18. The method of claim 17, further comprising assigning a community-of-interest to the virtual device relay based, in part, on the authorization information.
19. The method of claim 18, in which the step of relaying the data to the device comprises relaying the data to a virtual host, in which the virtual host hosts a web site.
20. The method of claim 16, in which the step of receiving the incoming connection comprises receiving the incoming connection through a router.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method for grinding a wafer to form a concave on a rear surface thereof, the wafer having on its front surface a device region defining a plurality of devices therein and an outer excess region surrounding the device region, by employing a grinding apparatus including a chuck table for holding the wafer rotatably and a grinder having a rotatable grindstone, the method comprising the steps of:
disposing an unevenness absorbing pad between the chuck table and the device region of the wafer for absorbing unevenness of the device region, and
causing the wafer held by the chuck table to be rotated and ground, while having the grindstone kept in contact with the rear surface of the wafer at center of rotation of the wafer, and out of contact with a portion of its rear surface opposite from the outer excess region, thereby forming a concavity in the portion of the rear surface of the wafer opposite from the device region, and forming an annular reinforcing portion including the outer excess region around the concavity.
2. A method according to claim 1, wherein the unevenness absorbing pad has a porous resin sheet.
3. A method according to claim 2, wherein the porous resin sheet is of polyethylene.
4. A method according to claim 2, wherein the unevenness-absorbing pad further includes a non-porous sheet laminated on the porous resin sheet.
5. A method according to claim 1, wherein the unevenness absorbing pad has an adhesive layer formed on one surface thereof for bonding it to the wafer.
6. A method according to claim 5, wherein the adhesive layer is formed only in the portion of the unevenness absorbing pad corresponding to the outer excess region of the wafer.
7. A method according to claim 1, wherein the unevenness-absorbing pad rests on the chuck table and the wafer rests on the unevenness-absorbing pad.
8. An unevenness-absorbing pad comprising a porous resin sheet having an adhesive layer formed on one surface thereof for bonding it to a wafer.
9. An unevenness-absorbing pad according to claim 8, it further including a non-porous sheet laminated on the porous resin sheet.
10. An unevenness absorbing pad according to claim 8, wherein the adhesive layer is formed only in a portion of the pad corresponding to an outer excess region of the wafer.
11. An unevenness-absorbing pad according to claim 8, wherein the porous resin sheet is of polyethylene.
12. A method according to claim 2, wherein the unevenness-absorbing pad rests on the chuck table and the wafer rests on the unevenness-absorbing pad.
13. A method according to claim 3, wherein the unevenness-absorbing pad rests on the chuck table and the wafer rests on the unevenness-absorbing pad.
14. An unevenness absorbing pad according to claim 9, wherein the adhesive layer is formed only in a portion of the pad corresponding to an outer excess region of the wafer.