1. A method for packaging a semiconductor chip, comprising:
fabricating a semiconductor chip having an active surface and a non-active surface;
applying an adhesive material in direct contact with the non-active surface of the chip;
applying an adhesive tape over the adhesive material adjacent the non-active surface of the semiconductor chip so that the adhesive material is provided between the non-active surface and the adhesive tape; and
positioning the semiconductor chip onto a plurality of contacts, each of the contacts having a first end of varying lengths relative to one another, such that the adhesive tape adjacent the non-active surface of the semiconductor chip is in contact with the plurality of contacts, the varying lengths of the plurality of contacts providing support surfaces for the semiconductor chip, whereby the plurality of contacts entirely support the semiconductor chip without the use of a die attach pad.
2. The method of claim 1, wherein applying the adhesive material further comprises applying a non-conductive epoxy.
3. The method of claim 1, wherein applying the adhesive material further comprises applying a conductive epoxy.
4. The method of claim 1, wherein applying the adhesive material further comprises applying a silver resin.
5. The method of claim 1, wherein applying the adhesive material further comprises applying a double-stick die adhesive film to the non-active surface of the semiconductor device.
6. The method of claim 1, wherein the contacts are leads.
7. The method of claim 1, further comprising etching a first surface of the leads.
8. The method of claim 7, further comprising a second surface of the leads.
9. The method of claim 1, further comprising forming electrical contacts between the plurality of contacts and the active surface of the semiconductor chip and encapsulating the semiconductor chip in an encapsulating material.
10. A method comprising:
providing one or more leads, the one or more leads each having a first end of varying lengths with respect to one another;
providing a semiconductor chip having an active surface and a non-active surface, the non-active surface of the semiconductor chip being supported by the varying lengths of the first ends of the one or more leads respectively;
applying an adhesive material onto and in direct contact with the non-active surface of the semiconductor chip; and
attaching an adhesive tape to the adhesive material, the adhesive tape acting to adhere the semiconductor chip onto the one or more leads, whereby the semiconductor chip is entirely supported on the one or more leads without a die attach pad.
11. The method of claim 10, wherein applying the adhesive material further comprises applying a non-conductive epoxy.
12. The method of claim 10, wherein applying the adhesive material further comprises applying a conductive epoxy.
13. The method of claim 10, wherein applying the adhesive material further comprises applying a silver resin.
14. The method of claim 10, wherein applying the adhesive material further comprises applying a double-stick die attach film.
15. The method of claim 10, further comprising etching a first surface of the leads.
16. The method of claim 15, further comprising etching a second surface of the leads.
17. The method of claim 10, further comprising forming electrical connections between the leads and contacts on the active surface of the semiconductor chip.
18. The method of claim 10, further comprising encapsulating the semiconductor chip and a portion of the leads so that the non-encapsulated portion of the leads are exposed.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method of impregnation treatment for foods comprising an impregnation step to impregnate foods with a liquid component or a gas component by contacting the foods with the liquid component or the gas component after a vacuum treatment or in a vacuum state andor cooling the foods in contact with the liquid component.
2. The method of impregnation treatment for foods as claimed in claim 1, wherein the impregnation step is a step in which the foods are vacuum treated, contacted with the liquid component in a maintained vacuum state and subjected to pressurization.
3. The method of impregnation treatment for foods as claimed in claim 1, wherein the impregnation step is a step in which the foods are contacted with the liquid component, vacuum treated and subjected to pressurization.
4. The method of impregnation treatment for foods as claimed in claim 1, wherein the impregnation step is a step in which the foods are vacuum treated and subjected to pressurization with the impregnating gas component.
5. The method of impregnation treatment for foods as claimed in any one of claims 1 to 4, wherein the liquid component or the gas component contains a food additive component.
6. The method of impregnation treatment for foods as claimed in any one of claims 1 to 5, wherein the pressure in the vacuum treatment or in the vacuum state ranges from 10 to 50,000 Pa.
7. The method of impregnation treatment for foods as claimed in any one of claims 1 to 6, wherein the impregnation step is conducted under a temperature condition of 20 to 180 C.
8. The method of impregnation treatment for foods as claimed in any one of claims 1 to 7, wherein the impregnation step is conducted with the use of a vacuum impregnating apparatus or a vacuum-pressure impregnating apparatus.
9. The method of impregnation treatment for foods as claimed in any one of claims 1 to 8, wherein an ultrasonic treatment is performed during the impregnation treatment.
10. The method of impregnation treatment for foods as claimed in any one of claims 1 to 9, wherein a microwave irradiation treatment is performed during the impregnation treatment.
11. The method of impregnation treatment for foods as claimed in any one of claims 1 to 10, wherein the foods are selected from among cereals, meats, fishes, eggs, vegetables, fruits and processed foods.
12. The method of impregnation treatment for foods as claimed in claim 11, wherein the foods are eggs.
13. The method of impregnation treatment for foods as claimed in claim 12, wherein the eggs are unshelled eggs.
14. The method of impregnation treatment for foods as claimed in claim 12 or 13, wherein the impregnation step is a step in which the eggs are contacted with a liquid component containing vitamin C or a derivative thereof to be impregnated with the vitamin C or the derivative thereof in an amount of 1 to 3,000 mg per 100 g of edible egg portions.
15. The method of impregnation treatment for foods as claimed in claim 14, wherein the contact of the eggs with the liquid component containing vitamin C or a derivative thereof is conducted at 5 to 130 C.
16. The method of impregnation treatment for foods as claimed in claim 14, wherein the contact of the eggs with the liquid component containing vitamin C or a derivative thereof is conducted at 0 to 55 C.
17. The method of impregnation treatment for foods as claimed in claim 14, wherein the liquid component contains vitamin C or a derivative thereof, and other food additive component.
18. A vitamin C-containing egg obtained by the method of impregnation treatment for foods as claimed in any one of claims 14 to 17.
19. The method of impregnation treatment for foods as claimed in claim 13, wherein the impregnation step is a step in which the eggs are contacted with a liquid component containing an alkali component to be impregnated in edible portions thereof with the liquid component.
20. The method of impregnation treatment for foods as claimed in claim 19, wherein the liquid component has pH of 12 to 15.
21. The method of impregnation treatment for foods as claimed in claim 19 or 20, wherein the liquid component contains an alkali component and a food additive component other than the alkali component.
22. The method of impregnation treatment for foods as claimed in any one of claims 19 to 21, wherein the impregnation step is a step in which the eggs are impregnated with the liquid component in an amount of 1 to 3,000 mg per 100 g of edible egg portions.
23. The method of impregnation treatment for foods as claimed in any one of claims 19 to 22, further comprising a heating step to heat the eggs after the impregnation step.
24. A pidan-like egg that has a transparent or translucent, gelled albumen, said pidan-like egg obtained by the method of impregnation treatment for foods as claimed in any one of claims 19 to 23.