1. A method for accurately depositing a metered volume of solder material of a given melting point on a delineated area of an electronic component part, said method comprising the steps of:
providing a fixture having a top surface shaped and dimensioned for intimate contact with said area, and a melting temperature substantially higher than said melting point;
carving into said top surface a closed-ended cavity shaped to be congruent with said area, wherein said cavity has a series of spaced-apart bottom separators;
pouring into said cavity said solder material,
wherein said solder material is a plurality of substantially uniformly dimensioned flowable particles, and
wherein a single particle is intimately nested in and spaced apart by each separator;
positioning said part against said top surface and said particles in contact with said area; and
exposing said fixture and part to a temperature at least equal to said melting point;
wherein said particles melt and join together to cover and adhere to said area.
2. The method of claim 1 which further comprises securing said part upon said fixture with a cover.
3. The method of claim 1, wherein said fixture is made of a material comprising high density graphite.
4. The method of claim 1, wherein said solder material comprises a metal alloy selected from the group consisting of gold alloys, tin alloys, lead alloys, copper alloys, and silver alloys.
5. The method of claim 1, wherein said solder material comprises a metal alloy selected from the group consisting of AuSn, AuGe, AuSi, AuAgCu, AgCu, and PbSnAg.
6. The method of claim 1, wherein said delineated area comprises an electronic package lead frame.
7. The method of claim 1, wherein said delineated area comprises a marginal, peripheral area of a microelectronic package lid.
8. The method of claim 1, wherein said cavity is segmented into a plurality of ditches.
9. The method of claim 8, wherein two of said plurality of ditches are differently dimensioned.
10. The method of claim 1, wherein said particles are laid in a single row into said cavity.
11. The method of claim 1, which further comprises vibrating said fixture to avoid clumping of said particles.
12. The method of claim 1, wherein said particles are laid in a plurality of rows into said cavity.
13. The method of claim 1, wherein said particles are symmetrical, and have calculated dimensions.
14. The method of claim 1, wherein said particles are spherical, and have a calculated diameter and radius.
15. The method of claim 14, wherein said cavity has a constant depth greater than said diameter.
16. The method of claim 14, wherein said cavity has a constant depth lesser than said diameter.
17. The method of claim 14, wherein said cavity has an arcuate bottom.
18. The method of claim 1, which further comprises sweeping away an excess number of said particles.
19. The method of claim 1, wherein said step of positioning comprises inverting said fixture and part.
20. The method of claim 1, which further comprises pressing said part against said fixture.
21. The method of claim 1, wherein said separators are regularly spaced-apart at a calculated interval.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An oil filter for lubricated systems comprising a housing, a filter for removing particulate matter from the oil passing through the filter and lubricant additives for slow release into the oil, wherein the lubricant additives are in the form of a lubricant additive gel and wherein the lubricant additive gel is formed by the gellation of at least two lubricant additives comprising detergents, dispersants, acids, bases, overbased detergents and combinations thereof.
2. An oil filter of claim 1, wherein the lubricant additive gel is formed from a detergent and a dispersant and has a tan delta value of \u22661.
3. The oil filter of claim 1, wherein the detergent is an overbased detergent having a TBN of at least 300 and further wherein the dispersant is a polyisobutenyl succinimide having at least one of the following properties:
(a) the N:CO ratio of the polyisobutenyl succinimide is 0.6 to 1.6,
(b) the maleic anhydride conversion level of the polyisobutenyl succinimide is at least about 1.3,
(c) the Mn of the polyisobutenyl segment of the polyisobutenyl succinimide is at least about 1200, and
(d) the polyisobutenyl succinimide is made by Cl2-assisted succination.