1. A microelectronic package substrate comprising:
a die-side surface adapted to receive a die thereon;
a printed circuit board (PCB)-side surface adapted to be mechanically and electrically bonded to a PCB;
an array of land pads on the PCB-side surface, the land pads defining anchoring recesses therein, wherein the anchoring recesses have sidewalls and a bottom;
an array of electrically conductive pins electrically and mechanically bonded to respective ones of the land pads, the pins having anchoring elements thereon mated with corresponding ones of the anchoring recesses of the land pads, the anchoring elements mating with the sidewalls and the bottom of the anchoring recesses to inhibit a tilting of the pins on the land pads; and
a plurality of pin-attach solder joints mechanically and electrically bonding the pins to corresponding ones of the land pads.
2. The substrate of claim 1, wherein the pins include respective pin stems and respective pin heads attached to corresponding ones of the pin stems, the pin heads being mounted onto a corresponding one of the land pads and including the anchoring elements, the anchoring elements projecting from an underside surface of corresponding ones of the pin heads.
3. The substrate of claim 2, wherein:
each of the land pads defines a single anchoring recess therein; and
each of the pin heads includes a single anchoring element adapted to mate with a corresponding recess of said each of the land pads.
4. The substrate of claim 2, wherein:
each of the land pads defines a plurality of anchoring recesses therein; and
each of the pin heads includes a plurality of anchoring elements adapted to mate with corresponding recesses of said each of the land pads.
5. The substrate of claim 3, wherein the single anchoring element has a longitudinal axis coextensive with a longitudinal axis of the pin stem.
6. The substrate of claim 1, wherein:
each of the anchoring recesses has lateral walls extending parallel to a longitudinal axis of said each of the anchoring recesses; and
each of the anchoring elements has lateral walls extending parallel to a longitudinal axis of said each of the anchoring elements.
7. The substrate of claim 1, wherein the anchoring recesses include through recesses wherein the bottom is provided by the PCB-side surface.
8. An electrically conductive pin comprising:
a pin stem; and
a pin head attached to the pin stem, the pin head being adapted to be mounted by way of pin-attach solder onto a surface of a substrate to support the pin stem, the pin head having an anchoring element projecting from an underside surface thereof, the anchoring element being configured to be mated with sidewalls and bottom of an anchoring recess defined in a land pad of the substrate adapted to receive the pin thereon.
9. The pin of claim 8, wherein the pin head includes a single anchoring element projecting from an underside surface thereof.
10. The pin of claim 8, wherein the pin head includes a plurality of anchoring elements projecting from an underside surface thereof.
11. The pin of claim 8, wherein the single anchoring element has a longitudinal axis coextensive with a longitudinal axis of the pin stem.
12. The pin of claim 8, wherein the anchoring element has lateral walls extending parallel to a longitudinal axis of the anchoring element.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A multi-frequency imaging coil, comprising:
a radio-frequency coil operational at three or more different frequencies; and
a shifting frequency loop structure disposed on a dielectric substrate that separates said shifting frequency loop structure from said radio-frequency coil and configured to provide at least one of said frequencies when said shifting frequency loop structure is electrically coupled to said radio-frequency coil and another of said frequencies when said shifting frequency loop structure is electrically uncoupled from said radio-frequency coil.
2. The imaging coil according to claim 1, wherein said radio-frequency coil is a dual-tuned birdcage coil and wherein one of said frequencies is a proton frequency, one of said frequencies is a sodium frequency, and one of said frequencies is a carbon frequency.
3. The imaging coil according to claim 2, wherein said birdcage coil operates at said proton frequency at 1H approximately 63.87 MHz, said sodium frequency at 23Na approximately 16.89 MHz, and in quadrature at said carbon frequency at 13C approximately 16.06 MHz.
4. The imaging coil according to claim 2, wherein said birdcage coil has eight rungs for an inner coil and two rungs for an outer coil.
5. The imaging coil according to claim 2, wherein said frequency shifting loop structure is designed to resonate at said carbon frequency.
6. The imaging coil according to claim 1, wherein said frequency shifting loop structure is a single loop of conductive metal on said dielectric substrate.
7. The imaging coil according to claim 1, wherein said frequency shifting loop structure is electrically coupled to said radio-frequency coil by a switch.
8. The imaging coil according to claim 7, wherein said switch is at least one of an electrical switch, an electro-mechanical switch, or a mechanical switch.
9. The imaging coil according to claim 7, wherein said switch is a diode or a microelectromechanical switch.
10. A method for acquiring an image with a multiple frequency imaging coil, comprising:
disposing at least one frequency shifting loop on a dielectric substrate to separate said frequency shifting loop from said imaging coil;
electrically coupling said frequency shifting loop to said imaging coil to shift an operating frequency of said imaging coil from a carbon frequency to a sodium frequency;
performing an anatomical imaging of a subject using a proton frequency;
prescanning said subject using said sodium frequency to determine a flip angle calibration for said carbon frequency;
electrically uncoupling said frequency shifting loop from said imaging coil to shift said operating frequency of said imaging coil from said sodium frequency to said carbon frequency; and
performing imaging of said subject at said carbon frequency using said flip angle calibration.
11. The method according to claim 10, further comprising injecting said subject with a hyperpolarized contrast agent prior to performing imaging of said subject at said carbon frequency.
12. The method according to claim 10, wherein said electrically coupling and said electrically uncoupling is performed by a switch.
13. The method according to claim 10, wherein said imaging of said subject at said carbon frequency is performed in quadrature.
14. The method according to claim 10, wherein said prescanning uses at least two frequency shifting loops and wherein said prescanning is performed in quadrature.
15. An imaging system for hyperpolarized compounds, comprising:
an imaging coil operational over at least three frequencies; and
at least one frequency shifting loop structure disposed on a dielectric substrate that separates said frequency shifting loop structure from said imaging coil and switchably coupled by a switch to said imaging coil,
wherein said frequency shifting loop structure shifts one of said frequencies to a frequency for calibration using a naturally occurring compound in a subject when said frequency shifting loop structure is electrically coupled to said imaging coil and performs a hyperpolarized imaging using said hyperpolarized compounds not naturally occurring in said subject when said frequency shifting loop structure is electrically uncoupled from said imaging coil.
16. The system according to claim 15, wherein said frequencies include at least three of a proton frequency, a sodium frequency, a flourine frequency, or a carbon frequency.
17. The system according to claim 16, wherein said imaging system operates linearly at said proton frequency and said sodium frequency, and in quadrature at said carbon frequency.
18. The system according to claim 15, wherein said at least one frequency shifting loop structure comprises two loop structures for a quadrature response for said calibration.
19. The system according to claim 15, wherein said switch is one of an electrical switch, an electro-mechanical switch, a mechanical switch, a diode, or a microelectromechanical switch.