1. A process for the recovery of drilling fluid additives from a mixture of materials, wherein the mixture comprises drilling fluids, drilled solids, and one or more drilling fluid additives from a mud system, the process comprising:
separating at least a portion of the drilled solids from the mixture to form a first effluent and a drilled solids fraction;
separating at least a portion of the one or more drilling fluid additives from the first effluent to form a second effluent and one or more recovered additives fractions;
recycling at least a portion of the one or more recovered additives fractions to the mud system;
wherein the one or more drilling fluid additives have a specific gravity of at least 1.4; and
wherein the one or more drilling fluid additives have an average particle size of at least 2 microns.
2. The process of claim 1, wherein the one or more drilling fluid additives are selected from the group consisting of industrial carbon, calcium carbonate, cellulose fibers, natural fibers, minerals, polysaccharides, and combinations thereof.
3. The process of claim 1, comprising diluting the first effluent with an internal olefin, a portion of the second effluent, or combinations thereof.
4. The process of claim 1, comprising recycling at least a portion of the second effluent to the active mud system.
5. The process of claim 1, wherein the separating at least a portion of the drilled solids is performed in an apparatus selected from the group consisting of screen separators, hydrocyclones, desilters, desanders, mud cleaners, mud conditioners, dryers, drying shakers, centrifuges, hydrocyclone shakers, multi-deck shakers, and combinations thereof.
6. The process of claim 1, wherein the separating at least a portion of the one or more drilling fluid additives is performed in an apparatus selected from the group consisting of screen separators, hydrocyclones, desilters, desanders, mud cleaners, mud conditioners, dryers, drying shakers, centrifuges, hydrocyclone shakers, multi-deck shakers, and combinations thereof.
7. The process of claim 1, wherein the one or more recovered additives fractions comprise at least 60 weight percent drilling fluid additives.
8. The process of claim 1, wherein the recovered additives fraction comprises at least 80 weight percent drilling fluid additives.
9. The process of claim 1, wherein the recovered additives fraction comprises at least 90 weight percent drilling fluid additives.
10. The process of claim 1, wherein the drilled solids fraction comprises particles having an average particle size of 1000 microns or greater.
11. The process of claim 1, wherein the one or more drilling fluid additives comprise particles having an average particle size in the range of 5 to 1000 microns.
12. The process of claim 1, wherein 50 weight percent or more of the one or more drilling fluid additives in the mixture are recovered in the one or more recovered additives fractions.
13. The process of claim 1, wherein the one or more recovered additives fraction comprises an industrial carbon fraction comprising at least 50 weight percent industrial carbon.
14. The process of claim 1, wherein the one or more recovered additives fraction comprises a calcium carbonate fraction comprising at least 50 weight percent calcium carbonate.
15. The process of claim 1, wherein the one or more recovered additives fraction comprises a fraction comprising at least 50 weight percent of a mixture of minerals, fibers, and polysaccharides.
16. The process of claim 1, wherein the one or more recovered additives fraction comprises a cellulose fiber fraction comprising at least 50 weight percent cellulose fiber.
17. A system for the recovery of drilling fluid additives from a mixture of materials, wherein the mixture comprises drilling fluids, drilled solids, and one or more drilling fluid additives from a mud system, the system comprising:
means for separating at least a portion of the drilled solids from the mixture to form a first effluent and a drilled solids fraction;
means for separating at least a portion of the one or more drilling fluid additives from the first effluent to form a second effluent and a recovered additives fraction;
means for recycling at least a portion of the recovered additives fraction to the mud system;
wherein the one or more drilling fluid additives have a specific gravity of at least 1.4; and
wherein the one or more drilling fluid additives have an average particle size of at least 2 microns.
18. A system for the recovery of drilling fluid additives from a mixture of materials, wherein the mixture comprises drilling fluids, drilled solids, and one or more drilling fluid additives from a mud system, wherein the one or more drilling fluid additives have a specific gravity of at least 1.4 and an average particle size of at least 2 microns, the system comprising:
a first separator for separating at least a portion of the drilled solids from the mixture to form a first effluent and a drilled solids fraction;
a second separator in fluid connection with the first separator, wherein the second separator separates at least a portion of the one or more drilling fluid additives from the first effluent to form a second effluent and one or more recovered additives fraction; and
a fluid connection from the second separator to the mud system for conveying at least a portion of the recovered additives fraction to the mud system.
19. The system of claim 18, wherein the first separator and the second separator are integrated in a single separation apparatus.
20. The system of claim 19, wherein the single separation apparatus is a multi-deck shaker.
21. The system of claim 18, wherein the first separator is selected from the group consisting of screen separators, hydrocyclones, desilters, desanders, mud cleaners, mud conditioners, dryers, drying shakers, centrifuges, hydrocyclone shakers, multi-deck shakers, and combinations thereof.
22. The system of claim 18 wherein the second separator is selected from the group consisting of screen separators, hydrocyclones, desilters, desanders, mud cleaners, mud conditioners, dryers, drying shakers, centrifuges, hydrocyclone shakers, multi-deck shakers, and combinations thereof.
23. The system of claim 18, further comprising a third separator in fluid connection with the second separator, wherein the third separator separates at least a weighting agent from the second effluent to form a third effluent and a weighting agent fraction.
24. The system of claim 23, further comprising a fluid connection from the third separator to the mud system for conveying at least a portion of the weighting agent fraction to the mud system.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A chip package, comprising:
an electrically conducting chip carrier;
at least one semiconductor chip attached to the electrically conducting chip carrier;
an insulating laminate structure embedding the electrically conducting chip carrier and the at least one semiconductor chip; and
a passive electronic device comprising a first structured electrically conducting layer, wherein the first structured electrically conducting layer extends directly on a surface of the laminate structure.
2. The chip package of claim 1, wherein the first structured electrically conducting layer is electrically coupled to a contact pad of the at least one semiconductor chip.
3. The chip package of claim 1, wherein the first structured electrically conducting layer forms a first coil.
4. The chip package of claim 1, wherein the passive electronic device further comprises a second structured electrically conducting layer.
5. The chip package of claim 4, wherein the first structured electrically conducting layer forms a first coil, the second structured electrically conducting layer forms a second coil, and the second coil is electrically coupled to the first coil.
6. The chip package of claim 3, further comprising:
a magnetic core embedded in the insulating laminate structure.
7. The chip package of claim 6, wherein the magnetic core is attached to the electrically conducting chip carrier.
8. The chip package of claim 6, wherein the magnetic core passes through a plane coplanar with a main surface of the electrically conducting chip carrier.
9. The chip package of claim 6, wherein the magnetic core comprises a ferromagnetic material or a high magnetic permeability material.
10. The chip package of claim 1, wherein the first structured electrically conducting layer forms a first plate of a capacitor.
11. The chip package of claim 10, further comprising a high electric permittivity dielectric material applied to the first plate of the capacitor.
12. The chip package of claim 10, wherein a second plate of the capacitor is formed by the electrically conducting chip carrier.
13. The chip package of claim 10, wherein the electrically conducting chip carrier is formed by a first part of a carrier, a second plate of the capacitor is formed by a second part of the carrier, and the first part of the carrier and the second part of the carrier are separated from each other.
14. The chip package of claim 1, wherein the first structured electrically conducting layer forms a resistor.
15. The chip package of claim 1, wherein the at least one semiconductor chip comprises a logic chip and a power chip.
16. A chip package, comprising:
an electrically conducting chip carrier;
at least one semiconductor chip attached to the electrically conducting chip carrier;
an insulating layer extending over the electrically conducting chip carrier;
a passive electronic device comprising a first structured electrically conducting layer, wherein the first structured electrically conducting layer extends over the insulating layer; and
an insulating laminate structure embedding the electrically conducting chip carrier, the at least one semiconductor chip, and the passive electronic device.
17. The chip package of claim 16, wherein the first structured electrically conducting layer is electrically coupled to a contact pad of the at least one semiconductor chip.
18. The chip package of claim 17, wherein the first structured electrically conducting layer forms a first plate of a capacitor.
19. The chip package of claim 18, wherein a second plate of the capacitor is formed by the electrically conducting chip carrier.
20. The chip package of claim 16, wherein the insulating layer comprises a high electric permittivity dielectric material.
21. The chip package of claim 16, wherein the first structured electrically conducting layer forms a resistor.
22. The chip package of claim 16, wherein the at least one semiconductor chip comprises a logic chip and a power chip.