1. A method and system of wire bonding a semiconductor die to a lead, comprising the steps of:
attaching a first end of a first bonding wire to a semiconductor die with a ball bond;
attaching a second end of the first bonding wire to an interposer pad with a stitch bond;
attaching a first end of a second bonding wire, to the interposer pad with a ball bond; and
attaching the second end of the second bonding wire to the lead with a stitch bond.
2. The method and system of wire bonding a semiconductor die to a lead as recited in claim 1, wherein the first bonding wire and second bonding wire are made-of a gold-based material.
3. The method and system of wire bonding a semiconductor die to a lead as recited in claim 1, wherein the interposer pad has x-y dimensions of between approximately 58 micrometers to 88 micrometers along an x-axis and 88 micrometers along a y-axis.
4. The method and system of wire bonding a semiconductor die to a lead as recited in claim 1, for use in ball bond grid array packages.
5. A semiconductor device comprising:
a semiconductor die disposed on a substrate;
a plurality of interposer pads on said substrate;
a plurality of leads on the substrate;
a plurality of bonding wires attached to the semiconductor die with ball bonds and to the leads with stitch bonds, said wires attached to said interposer pads.
6. The semiconductor device as recited in claim 5, wherein the plurality of bonding wires are comprised of gold-based material.
7. The semiconductor device as recited in claim 5, wherein each of said bonding wires comprises a bonding wire between the semiconductor die and each interposer pad attached to a bonding pad on the semiconductor die with a ball bond and to said interposer pad with a stitch bond and a bonding wire between the interposer pad and the lead attached to the interposer pad with a ball bond and to each lead with a stitch bond.
8. The semiconductor device as recited in claim 5, wherein the interposer pads are dimensioned from 58 micrometers to 88 micrometers along an x-axis and from 88 to 125 micrometers along a y-axis.
9. The semiconductor device as recited in claim 5, wherein the semiconductor package comprises a ball grid array.
10. The semiconductor device as recited in claim 5 wherein an interposer pad electrically floats on the substrate.
11. A method of fabricating a semiconductor device, comprising:
attaching a semiconductor die to a substrate having a plurality of leads and a plurality of interposer pads arranged around said die;
coupling the die to the plurality of interposer pads with a first plurality of bonding wires ball bonded to said die and stitch bonded tosaid interposer pads; and
coupling the plurality of interposer pads to the plurality of leads with a second plurality of bonding wires ball bonded to said interposer pads and stitch bonded to said leads.
12. The method of fabricating a semiconductor device as recited in claim 11, wherein the plurality of interposer pads electrically float on the semiconductor package.
13. The method of fabricating a semiconductor device as recited in claim 11, wherein the plurality of interposer pads electrically float on the semiconductor package.
14. The method of fabricating a semiconductor device as recited in claim 11, wherein the placement of the interposer pads are operable to reduce wire sweep.
15. The method of fabricating a semiconductor device as recited in claim 11, wherein the semiconductor package comprises a ball grid array.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An electronic apparatus comprising a first connector configured to be electrically connected to a battery, the first connector comprising:
signal terminals separated from each other by a first distance;
a positive terminal separated from the signal terminals by a second distance greater than the first distance;
an insulative positioning pin between the signal terminals and the positive terminal, the positioning pin protruding farther from a housing than does the positive terminal; and
a negative terminal separated from the signal terminals by a third distance greater than the first distance, the signal terminals between the positioning pin and the negative terminal.
2. The electronic apparatus of claim 1, wherein the negative terminal protrudes farther from the housing than does the positive terminal.
3. The electronic apparatus of claim 1, wherein the negative terminal is shorter than the positioning pin.
4. The electronic apparatus of claim 1, wherein the positive terminal and the negative terminal are each thicker than one of the signal terminals.
5. The electronic apparatus of claim 1, wherein the housing comprises a flat portion and a recess portion, the recess portion in the flat portion at a position deviating from the positive terminal.
6. The electronic apparatus of claim 1, wherein the first connector comprises an attaching portion and a boss, the attaching portion in an end portion of the battery connector, the positive terminal between the attaching portion and the boss.
7. The electronic apparatus of claim 1, further comprising:
a second connector configured to engage with the first connector,
wherein the second connector comprises a first recess configured to receive the positioning pin, a second recess configured to receive one of the signal terminals, a third recess configured to receive the positive terminal, the first recess between the second recess and the third recess, and a fourth recess portion configured to receive the negative terminal.
8. The electronic apparatus of claim 7, wherein the second connector comprises a first wall between the first recess and the second recess, and a second wall thicker than the first wall between the first recess and the third recess.
9. The electronic apparatus of claim 7, further comprising:
a first casing configured to engage with the battery;
a first circuit board in the first casing, the first circuit board electrically connected to one of the first connector and the second connector; and
a second circuit board in the battery, the second circuit board electrically connected to the other of the first connector and the second connector.
10. The electronic apparatus of claim 9, wherein the battery comprises a second casing, engaging portions, and holders, the second casing comprising the second circuit board, the engaging portions in end portions of the second connector, the holders configured to support the engaging portions.
11. The electronic apparatus of claim 9, wherein the first connector and the second connector are configured to be connected to each other in a direction crossing a thickness direction of the first casing.
12. The electronic apparatus of claim 1, further comprising a display.
13. An electronic apparatus comprising a connector configured to be electrically connected to a battery, the connector comprising:
signal terminals separated from each other by a first distance;
a positive terminal separated from the signal terminals by a second distance greater than the first distance;
an insulative positioning pin between the signal terminals and the positive terminal; and
a negative terminal separated from the signal terminals by a third distance greater than the first distance, the signal terminals between the positioning pin and the negative terminal.