1. An encapsulation system (100, 300) for semiconductor packaging comprising:
an encapsulation spacer (102, 302), which is shaped and dimensioned to match a substratecarrier (150);
wherein the encapsulation spacer (102, 302) has one or more apertures (104, 304) such that semiconductor dies (160) on the substratecarrier (150) are disposed inside an associated aperture when the encapsulation spacer (102, 302) is attached to the substratecarrier (150), and a volume defined by each of the one or more apertures (104, 304) and the substratecarrier is operable to be filled with an encapsulant (103).
2. An encapsulation system according to claim 1, wherein the one or more apertures (104, 304) isare configurable in shape and dimensions according to patterns of conductive elements on the substratecarrier.
3. An encapsulation system according to claim 1, further comprising an overflow reservoir disposed alongside an associated aperture, and the overflow reservoir is connected to the associated aperture by an air vent.
4. An encapsulation system according to claim 1, wherein the encapsulation spacer having a plurality of apertures is in the form of a panel.
5. An encapsulation system according to claim 1, wherein the encapsulation spacer having a single aperture is in the form of a ring.
6. An encapsulation system according to claims 1, wherein the encapsulant is dispensed into the one or more apertures to encapsulate the associated semiconductor dies.
7. An encapsulation system according to claim 3, further comprising a vacuum channel disposed alongside an associated overflow reservoir, and the vacuum channel is connected to the associated overflow reservoir by a control gate.
8. An encapsulation system according to claim 7, wherein a vacuum channel further comprises a vacuum port for connection to an external vacuum system.
9. An encapsulation system according to claim 1, wherein the encapsulation spacer is of a unitary layer.
10. An encapsulation system according to claim 9, wherein the encapsulation spacer is formed integral with the substrate.
11. An encapsulation system according to claim 1, wherein the encapsulation spacer comprises two or more layers, and the adjacent layers are joined by means of adhesive.
12. An encapsulation system according to claim 11, wherein the depth of the overflow reservoir, air vent, vacuum channel or control gate is configurable by selecting the thickness of the relevant layer of the encapsulation spacer.
13. An encapsulation system according to claim 1, further comprising an encapsulant delivery layer that is attachable onto the encapsulation spacer.
14. An encapsulation system according to claim 13, wherein the encapsulant delivery layer is made of a. flexible plastic and has a reservoirpot for storing the encapsulant.
15. An encapsulation system according to claim 14, wherein the reservoirpot is collapsible when a force is applied to deliver the encapsulant.
16. An encapsulation system according to claim 14, further comprising a recessed gate on the encapsulation spacer for delivering the encapsulant from the reservoirpot on the encapsulant delivery layer to an associated aperture.
17. An encapsulation system according to claim 13, wherein the encapsulation spacer further comprises a relief along a periphery, said relief allows one to grip on the substratecarrier or encapsulant delivery layer.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method of soldering comprising:
disposing first and second balls of solder adjacent one another on a wire;
disposing flux on the wire between and in contact with both of the first and second balls and so as to substantially fill a space between the first and second balls;
disposing the wire on a substrate so that the first and second balls of solder contact a single conductor on the substrate; and
melting the first and second balls of solder and flux and soldering the wire to the conductor.
2. A method as set forth in claim 1, wherein the melting is achieved using a wave soldering machine.
3. A method of soldering comprising:
preparing a solderable assembly by:
fixing a first solder ball on a wire;
fixing a second solder ball fixed on the wire with such spacing between the first solder ball and the second solder ball that both of the solder balls can contact a single conductive contact; and
fixing flux on the wire and forming a continuous layer substantially filling the space between the first and second solder balls.
4. A method as set forth in claim 3, further comprising:
deploying the solderable assembly so that the first and second solder balls are disposed on the single contact; and
heating the solderable assembly so that the solder balls and flux flow and make a single reliable connection.
5. A method as set forth in claim 4, wherein heating the solderable assembly comprises heating the wire and conducting heat through the wire to the flux and the first and second balls of solder.
6. A method of soldering comprising:
preparing a solderable assembly by:
fixing a first solder ball on a wire;
fixing a second solder ball fixed on the wire with such spacing between the first solder ball and the second solder ball that both of the solder balls can contact a single conductive contact; and
fixing flux on the wire and forming a continuous layer substantially filling the space between the first and second solder balls;
deploying the solderable assembly so that the first and second solder balls are disposed on the single contact;
heating the solderable assembly so that the solder balls and flux flow and make a single reliable connection;
disposing a portion of the wire through an aperture in a substrate heating wire which has passed through the aperture.