1. A method, comprising:
providing an accommodating intraocular lens system having first and second viewing elements that are interconnected by biasing elements;
translationally displacing the interconnected viewing elements relative to each other in a direction other than toward each other; and
implanting the intraocular lens with the viewing elements so displaced.
2. The method of claim 1, wherein said viewing elements comprise optics.
3. The method of claim 1, wherein said displacing comprises placing said viewing elements in a side-by-side relationship.
4. The method of claim 1, wherein said displacing comprises changing said viewing elements from a first configuration in which respective optical axes of said viewing elements are coincident, to a second configuration in which said optical axes of said viewing elements are not coincident.
5. The method of claim 1, wherein said displacing comprises changing said viewing elements from a first configuration in which a first optical surface of said first viewing element faces a second optical surface of said second viewing element, to a second configuration in which said optical surfaces do not face each other.
6. The method of claim 1, further comprising folding or rolling said lens system after said displacing.
7. The method of claim 1, further comprising placing said lens system in an insertion tool.
8. A method for use with an accommodating intraocular lens having first and second viewing elements that are interconnected by biasing elements, said method comprising:
non-rotationally displacing the interconnected viewing elements relative to each other in a direction other than toward each other; and
implanting the intraocular lens with the viewing elements so displaced.
9. The method of claim 8, wherein said displacing, comprises placing said viewing elements in a side-by-side relationship.
10. The method of claim 8, wherein said displacing comprises changing said viewing elements from a first configuration in which respective optical axes of said viewing elements are coincident, to a second configuration in which said optical axes of said viewing elements are not coincident.
11. The method of claim 8, wherein said displacing comprises changing said viewing elements from a first configuration in which a first optical surface of said first viewing element faces a second optical surface of said second viewing element, to a second configuration in which said optical surfaces do not face each other.
12. The method of claim 8, further comprising folding or rolling said lens after said displacing.
13. The method of claim 8, further comprising placing said lens in an insertion tool.
14. The method of claim 8, wherein said viewing elements comprise optics.
15. A method for use with an accommodating intraocular lens having first and second viewing elements that are interconnected by biasing elements, said method comprising:
non-rotationally displacing the interconnected viewing elements relative to each other in a direction other than toward each other; and
rolling or folding the intraocular lens with the viewing elements so displaced.
16. The method of claim 15, wherein said displacing comprises placing said viewing elements in a side-by-side relationship.
17. The method of claim 15, wherein said displacing comprises changing said viewing elements from a first configuration in which respective optical axes of said viewing elements are coincident, to a second configuration in which said optical axes of said viewing elements are not coincident.
18. The method of claim 15, wherein said displacing comprises changing said viewing elements from a first configuration in which a first optical surface of said first viewing element faces a second optical surface of said second viewing element, to a second configuration in which said optical surfaces do not face each other.
19. The method of claim 15, further comprising placing said lens in an insertion tool.
20. The method of claim 15, wherein said viewing elements comprise optics.
21. A method for use with an accommodating intraocular lens having first and second viewing elements that are interconnected by biasing elements and situated substantially on a common optical axis, said method comprising:
displacing the interconnected viewing elements relative to each other in a direction other than along or about said optical axis; and
rolling or folding the intraocular lens with the viewing elements so displaced.
22. The method of claim 21, wherein said displacing comprises placing said viewing elements in a side-by-side relationship.
23. The method of claim 21, wherein said displacing comprises changing said viewing elements from a first configuration in which respective optical axes of said viewing elements are coincident, to a second configuration in which said optical axes of said viewing elements are not coincident.
24. The method of claim 21, wherein said displacing comprises changing said viewing elements from a first configuration in which a first optical surface of said first viewing element faces a second optical surface of said second viewing element, to a second configuration in which said optical surfaces do not face each other.
25. The method of claim 21, further comprising placing said lens in an insertion tool.
26. The method of claim 21, wherein said viewing elements comprise optics.
27. The method of claim 21, further comprising implanting said intraocular lens in an eye.
28. The method of claim 27, further comprising positioning said intraocular lens in a capsular bag of said eye such that said viewing elements move relative to each other in response to action of a ciliary muscle of said eye.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
We claim:
1. A method of forming a buried interconnecting wire, comprising:
a first step of forming a first recessed portion in an insulating film deposited on a semiconductor substrate;
a second step of depositing a high-melting-point conductive material on said insulating film to form a first conductive film composed of said high-melting-point conductive material and having a second recessed portion in a position corresponding to the first recessed portion of said insulating film;
a third step of nitriding a surface of said first conductive film by using a plasma with said semiconductor substrate being held in a vacuum chamber maintained at a pressure of 10 Pa or higher to form a second conductive film composed of a nitride of said high-melting-point conductive material and having a third recessed portion in a position corresponding to the second recessed portion of said first conductive film;
a fourth step of depositing a metal for interconnections on said second conductive film such that said metal for interconnections is filled in the third recessed portion of said second conductive film to form a metal film composed of said metal for interconnections; and
a fifth step of removing the portions of said first conductive film, said second conductive film, and said metal film located outside the first recessed portion of said insulating film to form a buried interconnecting wire made of said metal for interconnections in the third recessed portion of said second conductive film.
2. A method of forming a buried interconnecting wire according to claim 1, wherein
said third step includes the step of nitriding the surface of said first conductive film by using a plasma with said semiconductor substrate being held in a vacuum chamber maintained at a pressure of 50 Pa or higher.
3. A method of forming a buried interconnecting wire according to claim 1, wherein
the metal for interconnections in said fourth step is copper or a copper alloy.
4. A method of forming a buried interconnecting wire according to claim 1, wherein
the high-melting-point conductive material in said second step is titanium, tantalum, or tungsten.
5. A method of forming a buried interconnecting wire according to claim 1, wherein
said third step includes the step of nitriding the surface of said first conductive film by using a plasma with said semiconductor substrate being held at the ground potential or at a positive potential.
6. A method of forming a buried interconnecting wire according to claim 1, wherein
said second step includes the step of depositing said high-melting-point conductive material by CVD.
7. A method of forming a buried interconnecting wire according to claim 6, wherein
said second step includes the step of depositing said high-melting-point conductive material at a temperature within such a range as to suppress crystallization of said high-melting-point conductive material to form said first conductive film with at least a part thereof being amorphous.