1461126281-0c76b761-0ec8-4254-9320-49e763d3a551

1. A manufacturing method of a semiconductor device in which first and second active regions are divided by an element isolation structure formed in an element isolation region on a semiconductor substrate, and first and second conductivity type elements are formed in said first and second active regions, respectively,
said element isolation region comprising a first element isolation region including regions adjacent to a pair of opposed ends of said second active region, and a second element isolation region other than said first element isolation region,
said method comprising:
forming a first trench in said second element isolation region on said semiconductor substrate, and filling up said first trench with a first insulating material that gives a tensile stress to each of said first and second active regions; and
forming a second trench in said first element isolation region on said semiconductor substrate, and filling up said second trench with a second insulating material that gives a compressive stress to said second active region,
wherein said first insulating material is a different material from said second insulating material,
wherein said second insulating material is provided only in said second trench,
wherein, in said first active region, at least three of four sides are surrounded by said second element isolation region, and
wherein, in said second active region, a pair of opposed sides is surrounded by said first element isolation region and the other pair of opposed sides is surrounded by said second element isolation region.
2. The method according to claim 1, further comprising forming a gate electrode into a pattern on each of said first and second active regions with a gate insulating film being interposed, so that the gate electrode on said second active region extends parallel to said first element isolation region.
3. The method according to claim 1, wherein upper and lower layer portions of said first element isolation region are filled with different insulating materials that give compressive stresses.
4. The method according to claim 1, wherein said insulating material that gives a compressive stress is one selected from a group of highly dense plasma oxide, oxide of amorphous silicon, and oxide of polycrystalline silicon, and said insulating material that gives a tensile stress is silicon oxide deposited at a temperature not more than a glass transition temperature of the silicon oxide.
5. A manufacturing method of a semiconductor device in which first and second active regions are divided by an element isolation structure formed in an element isolation region on a semiconductor substrate, and first and second conductivity type elements are formed in said first and second active regions, respectively,
said element isolation region comprising a first element isolation region including regions adjacent to a pair of opposed ends of said second active region, and a second element isolation region other than said first element isolation region,
said method comprising:
forming a first trench in said second element isolation region on said semiconductor substrate, and filling up said first trench with a first insulating material that gives a tensile stress to each of said first and second active regions; and
forming a second trench in a portion of said insulating material having filled up said first trench to give a tensile stress, corresponding to said first element isolation region, and filling up said second trench with a second insulating material that gives a compressive stress to said second active region,
wherein said first insulating material is a different material from said second insulating material,
wherein said second insulating material is provided only in said second trench,
wherein, in said first active region, at least three of four sides are surrounded by said second element isolation region, and
wherein, in said second active region, a pair of opposed sides is surrounded by said first element isolation region and the other pair of opposed sides is surrounded by said second element isolation region.
6. The method according to claim 5, further comprising forming a gate electrode into a pattern on each of said first and second active regions with a gate insulating film being interposed, so that the gate electrode on said second active region extends parallel to said first element isolation region.
7. The method according to claim 5, wherein said insulating material that gives a compressive stress is one selected from a group of highly dense plasma oxide, oxide of amorphous silicon, and oxide of polycrystalline silicon, and said insulating material that gives a tensile stress is silicon oxide deposited at a temperature not more than its glass transition temperature.

The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.

1. A terminal device comprising:
an input configured to receive pieces of patient information from a user;
a transceiver configured to transmit an inspection request including the pieces of patient information to a plurality of medical devices; and
a controller configured to, in response to the pieces of patient information being registered in one of the plurality of medical devices, control the transceiver to transmit a deletion request of the patient information to remaining devices of the plurality of medical devices.
2. The terminal device of claim 1, further comprising a display configured to display the patient information.
3. The terminal device of claim 1, wherein the controller is configured to delete the pieces of patient information received from the user in response to the pieces of patient information being registered in one of the plurality of medical devices.
4. The terminal device of claim 1, wherein, in response to the transceiver receiving a deletion request, the transceiver transmits the deletion request to the remaining devices of the plurality of medical devices.
5. The terminal device of claim 1, wherein each of the pieces of patient information comprises a user’s ID, a part to be imaged, and a user’s location.
6. A medical device comprising:
a transceiver configured to receive an inspection request including pieces of patient information and a deletion request of the pieces of patient information;
a display configured to display the patient information based on the inspection request; and
a controller configured to delete the pieces of patient information in response to the transceiver receiving the deletion request.
7. The medical device of claim 6, wherein the display is configured to display a worklist in which the pieces of patient information registered in the medical device are listed.
8. The medical device of claim 6, further comprising an input configured to receive a user selection about whether to register the received patient information.
9. The medical device of claim 8, wherein the display is configured to display a worklist in which the pieces of patient information registered in the medical device are listed, and
the controller is configured to add the received pieces of patient information to the worklist in response to the user selecting to register the received patent information by using the input.
10. The medical device of claim 7, wherein, in response to the user selecting not to register the received patient information by using the input, the controller is configured to delete the pieces of patient information based.
11. The medical device of claim 6, further comprising a storage configured to store the registered pieces of patient information.
12. The medical device of claim 6, wherein the transceiver is configured to receive the inspection request and the deletion request from at least one of a mobile terminal device and a server.
13. The medical device of claim 6, wherein each of the pieces of patient information comprises a user’s ID, a part to be imaged, and a user’s location.
14. The medical device of claim 6, wherein the display is further configured to display a pop-up message informing that the inspection request is received.
15. The medical device of claim 14, further comprising an input configured to receive a selection of a pop-up message from a user,
wherein, in response to receiving the selection of the pop-up message from the user, the display is configured to display the patient information based on the inspection request.
16. A medical information system comprising:
a terminal device configured to transmit an inspection request including pieces of patient information to a medical device; and
a plurality of medical devices configured to determine whether to register the pieces of patient information,
wherein, in response to the pieces of patient information being registered in one of the plurality of medical devices, the terminal device transmits a deletion request to request deletion of the patient information to remaining medical devices of the plurality of medical devices.
17. The medical information system of claim 16, wherein, in response to a user selecting to register the pieces of patient information in the one of the plurality of medical devices, the terminal device transmits the deletion request to the other medical devices.
18. The medical information system of claim 16, wherein, in response to the pieces of patient information being registered in the one of the plurality of medical devices, the one of the plurality of medical devices transmits the deletion request to the terminal device.
19. The medical information system of claim 16, wherein the one of the plurality of medical devices displays a worklist in which the registered pieces of patient information are listed.
20. The medical information system of claim 19, wherein, in response to the pieces of patient information being registered in the one of the plurality of medical devices, the one of the plurality of medical devices adds the pieces of patient information to the worklist.
21. A terminal device comprising:
a controller configured to receive patient information;
a transceiver configured to transmit an inspection request including the patient information to a plurality of medical devices,
wherein, in response to the patient information being registered in one of the plurality of medical devices, the controller is configured to delete the received patient information.
22. The terminal device of claim 21, wherein, in response to the patient information being registered in one of the plurality of medical devices, the controller is further configured to control the transceiver to transmit a deletion request of the patient information to remaining devices of the plurality of medical devices.
23. The terminal device of claim 21, wherein, in response to the transceiver receiving a deletion request from one of the plurality of medical devices, the controller is further configured to control the transceiver to transmit the deletion request to remaining devices of the plurality of medical devices.