1. A surgical instrument comprising:
a tubular member having an axis, a first end coupled to a drive housing and a second end coupled to a cutting apparatus including a rotatable and deflectable cutting element, wherein the second end of the tubular member defines a circumferential region;
a drive shaft having a first end coupled to a rotatable drive member in the housing and a second end coupled to the cutting element, wherein the drive shaft translates rotational motion at the drive member to the cutting element to cause rotation of the cutting element;
a thrust member having a first end within the housing and a second end coupled to a resilient member in the cutting apparatus, wherein the resilient member is coupled to the cutting element and bending of the resilient member causes movement of the cutting element away from the axis of the tubular member;
a first fluid flow path extending from within the housing, through a bore defined in the tubular member, and terminating at the cutting apparatus;
wherein the bore of the tubular member includes a second fluid flow path extending between the drive housing and the cutting apparatus and being distinct from the first flow path;
wherein, in an at rest condition of the instrument, the cutting element is disposed within the circumferential region defined by the second end of the tubular member;
wherein the first flow path or the second flow path is for receiving an optical waveguide having a lens tip positionable proximate the cutting apparatus; and
a moveable member coupled to the first end of the thrust member and operable to set the instrument to a deflected condition, wherein when the instrument is in the deflected condition the moveable member applies a force at the first end of the thrust member causing the second end of the thrust member to bend the resilient member, such that the cutting element is moved away from the axis of the tubular member and is disposed at least partially outside the circumferential region defined by the second end of the tubular member, wherein, in the deflected condition of the instrument, an extent the cutting element is disposed outside the circumferential region is in accordance with an extent the thrust member is caused to move toward the cutting element by movement of the moveable member.
2. The surgical instrument of claim 1, wherein the moveable member includes a lever rotatably coupled to the housing, wherein when the lever rotates towards the housing the cutting element moves away from the tubular axis, and wherein when the lever rotates away from the housing the cutting element moves toward the tubular axis.
3. The surgical instrument of claim 2, wherein the resilient member biases the cutting element toward the axis of the tubular member such that the extent that the cutting element is moved away from the tubular axis depends on an amount of force applied to the lever to cause rotation of the lever toward the housing.
4. The surgical instrument of claim 1, wherein the resilient member includes first and second leaf springs coupled to each other and to the cutting element, wherein the second leaf spring is fixed to the tubular member, wherein the first and second leaf springs are flat and parallel when the instrument is in the at rest condition and wherein, when a force is applied to the first end of the thrust member, the first leaf spring moves in relation to the second spring to cause bending of the first and second leaf springs away from the tubular axis such that the cutting element is moved away from the axis of the tubular member.
5. The surgical instrument of claim 4, wherein the first and second leaf springs have a torsional stiffness sufficient to provide for cutting of tissue based on contact between the cutting element and the tissue when the instrument is in the deflected condition and the cutting element is rotating.
6. The surgical instrument of claim 1, wherein the thrust member defines a bore through which the drive shaft extends.
7. The surgical instrument of claim 1, wherein the drive member includes a shaft fitting for transmitting torque applied to the drive member to the first end of the drive shaft.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
What is claimed is:
1. A semiconductor device, in which one or more semiconductor chips each having an externally leading electrode are stacked on a stacking base, comprising
an interposer chip on which one or more connection wirings are formed, wherein:
the externally leading electrode provided on at least one of the semiconductor chips is connected to the connection wiring of the interposer chip by wire bonding, and
the external leading electrode, connected to the connection wiring, which is provided on the semiconductor chip, relays the connection wiring so as to be electrically connected to an electrode of a wiring provided on the stacking base or another of the semiconductor chips (2).
2. The semiconductor device as set forth in claim 1, wherein the interposer chip is formed by using a wafer made of the same material and having the same structure as a wafer used in forming the semiconductor chip.
3. The semiconductor device as set forth in claim 1, wherein the interposer chip is formed by using the same device as a device for forming the semiconductor chip.
4. The semiconductor device as set forth in claim 1, wherein the semiconductor chip is covered by a surface protection film so that the externally leading electrode is uncovered.
5. The semiconductor device as set forth in claim 1, wherein at least one of the semiconductor chips is stacked at a position upper than the interposer chip in a stacking direction.
6. The semiconductor device as set forth in claim 5, wherein
said one or more connection wirings provided on the interposer chip include:
one or more first bonding pads electrically connected to external electrodes, provided at a position lower than the interposer chip in the stacking direction, by wire bonding; and
one or more second bonding pads electrically connected to electrodes, provided at a position upper than the interposer chip in the stacking direction, by wire bonding.
7. The semiconductor device as set forth in claim 1, wherein the interposer chip and the semiconductor chip are stacked on the stacking base or another of the semiconductor chips (2) so as to be disposed side by side.
8. The semiconductor device as set forth in claim 7, wherein
said one or more connection wirings provided on the interposer chip include:
one or more first bonding pads electrically connected to external electrodes, provided at a position lower than the interposer chip in the stacking direction, by wire bonding; and
one or more second bonding pads electrically connected to electrodes, provided at a position upper than the interposer chip in the stacking direction, by wire bonding.
9. The semiconductor device as set forth in claim 6, wherein:
the number of the connection wirings provided on the interposer chip is plural, and
the connection wirings are disposed so as not to cross each other.
10. The semiconductor device as set forth in claim 8, wherein:
the number of the connection wirings provided on the interposer chip is plural, and
the connection wirings are disposed so as not to cross each other.
11. The semiconductor device as set forth in claim 9, wherein an order in which the first bonding pads are disposed is different from an order in which the second bonding pads connected to the first bonding pads by the connection wirings.
12. The semiconductor device as set forth in claim 10, wherein an order in which the first bonding pads are disposed is different from an order in which the second bonding pads connected to the first bonding pads by the connection wirings.
13. The semiconductor device as set forth in claim 6, wherein the number of the connection wirings provided on the interposer chip is plural, and the connection wirings are disposed in a roundabout manner.
14. The semiconductor device as set forth in claim 8, wherein the number of the connection wirings provided on the interposer chip is plural, and the connection wirings are disposed in a roundabout manner.
15. The semiconductor device as set forth in claim 6, wherein:
one or more additional bonding pads are provided on the connection wiring of the interposer chip so as to be positioned between the first bonding pad and the second bonding pad, and
two arbitrary bonding pads out of the first bonding pad, the second bonding pad, and the additional bonding pad are connected to external electrodes by wire bonding.
16. The semiconductor device as set forth in claim 8, wherein:
one or more additional bonding pads are provided on the connection wiring of the interposer chip so as to be positioned between the first bonding pad and the second bonding pad, and
two arbitrary bonding pads out of the first bonding pad, the second bonding pad, and the additional bonding pad are connected to external electrodes by wire bonding.
17. The semiconductor device as set forth in claim 15, wherein:
the number of the connection wirings provided on the interposer chip is plural, and
the connection wirings are disposed so as not to cross each other.
18. The semiconductor device as set forth in claim 16, wherein:
the number of the connection wirings provided on the interposer chip is plural, and
the connection wirings are disposed so as not to cross each other.
19. The semiconductor device as set forth in claim 17, wherein at least two orders out of (i) an order in which the first bonding pads are disposed, (ii) an order in which the second bonding pads connected to the first bonding pads by the connection wirings are disposed, and (iii) an order in which the additional bonding pads connected to the second bonding pads by the connection wirings are disposed, are different from each other.
20. The semiconductor device as set forth in claim 18, wherein at least two orders out of (i) an order in which the first bonding pads are disposed, (ii) an order in which the second bonding pads connected to the first bonding pads by the connection wirings are disposed, and (iii) an order in which the additional bonding pads connected to the second bonding pads by the connection wirings are disposed, are different from each other.