1. A method comprising:
adding addresses of target servers to a queue in response to prepare messages from the target servers;
selecting one of the addresses in response to an incoming call request from a client; and
sending the incoming call request to one of the target servers associated with the one of the addresses.
2. The method of claim 1, further comprising:
preparing a network interface for the incoming call request in response to the prepare messages.
3. The method of claim 1, further comprising:
removing all of the addresses associated with the one of the target servers from the queue in response to a close request from the one of the target servers.
4. The method of claim 1, wherein the queue comprises a FIFO queue.
5. An apparatus comprising:
means for adding addresses of target servers to a queue in response to prepare messages from the target servers;
means for preparing a network interface for an incoming call request in response to the prepare messages; and
means for selecting one of the addresses in response to the incoming call request from a client.
6. The apparatus of claim 5, further comprising:
means for sending the incoming call request to one of the target servers associated with the one of the addresses.
7. The apparatus of claim 6, further comprising:
means for removing all of the addresses associated with the one of the target servers from the queue in response to a close request from the one of the target servers.
8. The apparatus of claim 5, wherein the queue comprises a round-robin queue.
9. A signal-bearing medium encoded with instructions, wherein the instructions when executed comprise:
adding addresses of target servers to a queue in response to prepare messages from the target servers;
preparing a network interface for an incoming call request in response to the prepare messages;
selecting one of the addresses in response to the incoming call request from a client; and
sending the incoming call request to one of the target servers associated with the one of the addresses.
10. The signal-bearing medium of claim 9, further comprising:
removing all of the addresses associated with the one of the target servers from the queue in response to a close request from the one of the target servers.
11. The signal-bearing medium of claim 9, wherein the queue comprises a round-robin queue.
12. The signal-bearing medium of claim 9, wherein the queue comprises a FIFO queue.
13. A computer system comprising:
a processor; and
memory encoded with instructions, wherein the instructions when executed on the processor comprise:
adding addresses of target servers to a queue in response to prepare messages from the target servers,
preparing a network interface for an incoming call request in response to the prepare messages,
selecting one of the addresses in response to the incoming call request from a client, and
sending the incoming call request to one of the target servers associated with the one of the addresses, wherein the incoming call request creates a tunnel from the client to the one of the target servers and the client communicates across the tunnel to the one of the target servers.
14. The computer system of claim 13, wherein the instructions further comprise:
removing all of the addresses associated with the one of the target servers from the queue in response to a close request from the one of the target servers.
15. The computer system of claim 13, wherein the queue comprises a round-robin queue.
16. The computer system of claim 13, wherein the queue comprises a FIFO queue.
17. A method for configuring a computer, comprising:
configuring the computer to add addresses of target servers to a queue in response to prepare messages from the target servers;
configuring the computer to select one of the addresses in response to an incoming call request from a client; and
configuring the computer to send the incoming call request to one of the target servers associated with the one of the addresses.
18. The method of claim 17, further comprising:
configuring the computer to prepare a network interface for the incoming call request in response to the prepare messages.
19. The method of claim 17, further comprising:
configuring the computer to remove all of the addresses associated with the one of the target servers from the queue in response to a close request from the one of the target servers.
20. The method of claim 17, wherein the queue comprises a FIFO queue.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method of adhesion of conductive materials comprising the step (1) of forming an adhesive surface having an adhesive resin layer on a conductive material by an electrodeposition step with an adhesive composition and the step (2) of joining an adherend surface of an adhesion target to the adhesive surface having the adhesive resin layer obtained in the step (1),
wherein the adhesive composition comprises a hydratable functional group- and unsaturated bond-containing cationic resin composition.
2. The method of adhesion of conductive materials according to claim 1,
wherein the adhesive composition is substantially incapable of generating any volatile matter in the step of heating for curing.
3. The method of adhesion of conductive materials according to claim 1,
wherein the cationic resin composition is one allowing the formation, in the adhesive resin layer, of such chemical species activated by the electrode reaction caused by voltage application in the electrodeposition step as can promote the progress of the curing reaction.
4. The method of adhesion of conductive materials according to claim 1,
wherein the hydratable functional group is a sulfonium group.
5. The method of adhesion of conductive materials according to claim 1,
wherein the unsaturated bond is at least partly a propargyl carbon-carbon triple bond.
6. The method of adhesion of conductive materials according to claim 1,
wherein the cationic resin composition has a sulfonium group content of 5 to 400 millimoles, a propargyl group content of 10 to 495 millimoles, and a total content of sulfonium and propargyl groups of not more than 500 millimoles, per 100 g of the solid matter in the cationic resin composition.
7. The method of adhesion of conductive materials according to claim 1,
wherein the cationic resin composition has a sulfonium group content of 5 to 250 millimoles, a propargyl group content of 20 to 395 millimoles, and a total content of sulfonium and propargyl groups of not more than 400 millimoles, per 100 g of the solid matter in the cationic resin composition.
8. The method of adhesion of conductive materials according to claim 1,
wherein the cationic resin composition has an epoxy resin as a skeleton.
9. The method of adhesion of conductive materials according to claim 8,
wherein the epoxy resin is a novolak cresol epoxy resin or novolak phenol epoxy resin and has a number average molecular weight of 700 to 5,000.
10. The method of adhesion of conductive materials according to claim 1,
which comprises a drying step between the step (1) and step (2).
11. The method of adhesion of conductive materials according to claim 1,
wherein the step (2) comprises a step of adhesion with heating and a step of curing by heating.
12. The method of adhesion of conductive materials according to claim 1,
wherein the adherend surface is an adhesive surface having an adhesive resin layer.
13. The method of adhesion of conductive materials according to claim 1,
wherein the adhesion target is a conductive material and the adherend surface is an adhesive surface having an adhesive resin layer formed by an electrodepositon step of a conductive material with an adhesive composition.
14. The method of adhesion of conductive materials according to claim 1,
wherein the conductive material is made of copper, aluminum, iron or an alloy mainly composed of these.
15. A laminate as obtained by the method of adhesion of conductive materials according to claim 1.
16. An adhesive composition capable of forming an adhesive resin layer by an electrodepostion step,
wherein the adhesive composition comprises a hydratable functional group- and unsaturated bond-containing cationic resin composition.
17. The method of adhesion of conductive materials according to claim 2,
wherein the cationic resin composition is one allowing the formation, in the adhesive resin layer, of such chemical species activated by the electrode reaction caused by voltage application in the electrodeposition step as can promote the progress of the curing reaction.
18. The method of adhesion of conductive materials according to claim 2,
wherein the hydratable functional group is a sulfonium group.
19. The method of adhesion of conductive materials according to claim 3,
wherein the hydratable functional group is a sulfonium group.
20. The method of adhesion of conductive materials according to claim 2,
wherein the unsaturated bond is at least partly a propargyl carbon-carbon triple bond.