1. A display apparatus comprising:
a display device having a planar display screen; and
a support stand to support the display device, the support stand including:
a base portion configured to rest on a surface; and
at least one post that projects from said base portion, said at least one post having at least two mounting arrangements, each mounting arrangement being configured to allow said display device to be mounted thereto in a fixed position, wherein:
the mounting arrangements are configured such that an angle between normal to the display screen and normal to the surface is different when the display device is mounted to the respective mounting arrangements; and
the mounting arrangements are provided at different orientations around each said post.
2. A display apparatus according to claim 1,
wherein each said post is attachable to the base portion at different orientations relative to the base portion.
3. A display apparatus according to claim 2,
wherein at each orientation at which each said post is attachable to the base portion, each said post has a corresponding mounting arrangement to mount the display device such that the display screen always faces in a same predetermined direction relative to the base portion.
4. A display apparatus according to claim 3,
wherein the base portion extends further in the same predetermined direction than in an opposite direction to the same predetermined direction.
5. A display apparatus according to claim 1, wherein:
the base portion comprises at least one hole, a number of holes in the base portion being equal to a number of posts projecting therefrom; and
each said post is configured to be attachable to the base portion at more than one orientation relative to the base portion by insertion through one of said holes at more than one orientation.
6. A display apparatus according to claim 5, wherein:
each said post has a portion that is configured to cooperate with its corresponding hole when the post is inserted into the hole; and
a shape of each said hole corresponds to a shape of the portion of its corresponding post that is configured to cooperate with it.
7. A display apparatus according to claim 5,
wherein each said post and corresponding hole have a fixing that allows each said post to be fixed into position in the corresponding hole at each orientation.
8. A display apparatus according to claim 1, wherein:
the base portion comprises at least one post platform, a number of post platforms on the base portion being equal to a number of posts projecting therefrom; and
each said post is configured to be attachable to the base portion at more than one orientation relative to the base portion by attachment to one of said post platforms at more than one orientation.
9. A display apparatus according to claim 1, wherein:
each mounting arrangement includes a flat surface, the respective flat surfaces of said at least two mounting arrangements on each said post being tilted at different angles relative to the surface on which the base portion is configured to rest; and
the display device includes at least one flat surface, each of which is arranged to abut a corresponding flat surface of a mounting arrangement of a corresponding post.
10. A display apparatus according to claim 9,
wherein each mounting arrangement includes a holding mechanism to hold corresponding flat surfaces of the display device and the mounting arrangement together.
11. A display apparatus according to claim 1,
wherein each said post includes two mounting arrangements.
12. A display device according to claim 11,
wherein the mounting arrangements on each said post are on opposite sides of each said post.
13. A display device according to claim 11,
wherein each said post has at least one hole formed therethrough, each said hole having openings on opposing sides of its respective post, the openings forming part of the mounting arrangements.
14. A display device according to claim 12,
wherein each said post has at least one hole formed therethrough, each said hole having openings on opposing sides of its respective post, the openings forming part of the mounting arrangements.
15. A display device according to claim 1, configured such that the display device is removably mounted to the mounting arrangements.
16. A support stand to support a display device having a planar display screen, the support stand comprising:
a base portion configured to rest on a surface; and
at least one post that projects from said base portion, said at least one post having at least two mounting arrangements, each mounting arrangement being configured to allow said display device to be mounted thereto in a fixed position, wherein:
the mounting arrangements are configured such that an angle between normal to the display screen and normal to the surface is different when the display device is mounted to the respective mounting arrangements; and
the mounting arrangements are provided at different orientations around each said post.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method of fabricating a wafer level integration module according to a construction whereby semiconductor functional device fabrication is carried out only after interconnect structures are processed on a bare wafer, the fabrication and processing including forming the interconnect structures in a first side of the wafer; depositing a first insulation layer on the first side of the wafer; depositing a first conductive layer on the insulation layer, the first conductive layer filling the interconnect structures so as to contact the first insulation layer on the walls of the interconnect structures, the first conductive layer in the interconnect structures forming interconnection contacts on the first side of the wafer and interconnection vias in the wafer; exposing the first conductive layer including the interconnection contacts on the first side of the wafer; fabricating a semiconductor functional device on the first side of the wafer, the semiconductor functional device interconnected with the interconnection contacts during the fabricating the semiconductor functional device; exposing from the second side of the wafer, portions of the first conductive layer associated with the interconnection vias, the method comprising:
selectively removing a portion of the first conductive layer to form interconnection via redistribution connection structures; and
filling the interconnection via redistribution connection structure with a low resistivity material to form low resistivity redistribution interconnect with the semiconductor functional device through the first conductive layer.
2. The method of claim 1 wherein:
the selectively removing the portion of the first conductive layer includes removing the first conductive layer up to the interconnection contacts such that the forming the interconnection via redistribution connection structures includes forming interconnection via voids; and
the filling the interconnection via voids with a low resistivity material to form low resistivity interconnects with the semiconductor functional device.
3. The method of claim 1 or 2 wherein the conductive layer is a high temperature conductive film.
4. The method of any one of the preceding claims wherein the exposing the first conductive layer, including the high temperature conductive film includes exposing by chemical mechanical polishing.
5. The method of any one of the preceding claims wherein the exposing the first conductive layer, including the high temperature conductive film includes exposing by back grinding.
6. The method of any one of the preceding claims further comprising covering the first side of the wafer with a protection substrate so as to protect the semiconductor functional device.
7. The method of any one of the preceding claims further comprising depositing a second insulation layer on the second side of the wafer; patterning the second insulation layer and exposing the low resistivity redistribution interconnect; depositing a second conductive layer on the patterned second insulation layer for providing contact between the low resistivity redistribution interconnects and an external device.
8. The method of any one of the preceding claims wherein the fabricating the semiconductor functional devices comprises depositing additional layers for forming a new functional device.
9. The method of claim 8 wherein the additional layers form a plurality of the new functional devices.
10. The method of claim 8 or 9 wherein the additional layers are formed in a stack formation.
11. The method of any one of the preceding claims wherein the interconnect via structures, the semiconductor functional device, the first conductive layer filling the interconnect structures, interconnection contacts and interconnection vias are formed as one of a plurality of dies formed on the wafer.
12. The method of claim 11 further comprising separating the plurality of dies along separation zones.
13. The method of claims 8 to 11 wherein the functional device includes a transistor.
14. The method of claims 9 to 12 wherein the plurality of semiconductor functional devices include transistors.
15. The method of any one of the preceding claims further comprising testing the semiconductor functional device after fabrication.
16. The method of claim 15 wherein testing the semiconductor functional device comprises forming test pads on the first side of the wafer.
17. The method of claims 15 and 16 further comprising removing the test pads after testing and before fabrication of a subsequent semiconductor functional device.
18. The method of any one of the preceding claims further comprising depositing a third insulation layer to the first conductive layer when the first conductive layer is applied to the interconnect structures in a manner so as to partially fill the interconnect structures to control a resistance of the resulting interconnection vias to planarize and protect the first conductive layer on the first side of the wafer.