1. An automated stowage and retrieval system for the selective loading or unloading of a payload comprising:
a plurality of pallet carriers contained in a storage matrix, the matrix having a plurality of storage spaces and being defined by a plurality of horizontal axes, including a plurality of axes extending in a first direction and a plurality of axes extending in a second direction generally perpendicular to the first direction, each of the plurality of pallet carriers being moveable into and out of the plurality of storage spaces within the matrix, each of the pallet carriers being capable of supporting and storing at least one payload and configured to slide bi-directionally along the plurality of horizontal axes in sequentially coordinated movement with stored payloads supported on other of the plurality of pallet carriers whereby stored payloads on the pallet carriers are moved between the plurality of storage spaces to permit movement of a stored payload on another pallet carrier;
a plurality of driving mechanisms associated with the plurality of pallet carriers configured to slide each of the plurality of pallet carriers along the plurality of horizontal axes of the matrix; and
a programmable controller capable of receiving input regarding a desired payload and configured to communicate with the plurality of driving mechanisms to operably coordinate sequential movement of a selected number of the plurality of pallet carriers along the plurality of horizontal axes to move a predetermined pallet carrier having the desired payload to a predetermined position.
2. The system according to claim 1, wherein the matrix is disposed in a storage compartment of a naval vessel.
3. The system according to claim 2, wherein the storage compartment includes holds or magazines.
4. The system according to claim 1, wherein the comprises at least one vacant storage space configured to the size of at least one of the plurality of pallet carriers.
5. The system according to claim 1, wherein the plurality of pallet carriers comprise friction reducing members.
6. The system according to claim 5, wherein the friction reducing members include rollers.
7. The system according to claim 1, wherein the plurality of pallet carriers are dimensioned according to predetermined standards.
8. The system according to claim 7, wherein the predetermined standards include substantially rectangular shapes.
9. An automated stowage and retrieval system for the selective loading or unloading of a payload comprising:
a plurality of pallet carriers contained in a matrix, the matrix being defined by a plurality of horizontal axes, including a plurality of axes extending in a first direction and a plurality of axes extending in a second direction generally perpendicular to the first direction, each of the plurality of pallet carriers being capable of supporting at least one payload and configured to slide bi-directionally along the plurality of horizontal axes in sequentially coordinated movement with other of the plurality of pallet carriers, wherein each of the plurality of pallet carriers can substantially lock with each of the remaining of the plurality of pallet carriers, wherein two or more of the plurality of pallet carriers can support a common payload;
a plurality of driving mechanisms associated with the plurality of pallet carriers configured to slide each of the plurality of pallet carriers alone the plurality of horizontal axes of the matrix; and
a programmable controller capable of receiving input regarding a desired payload and configured to communicate with the plurality of driving mechanisms to operably coordinate sequential movement of a selected number of the plurality of pallet carriers along the plurality of horizontal axes to move a predetermined pallet carrier having the desired payload to a predetermined position.
10. The system according to claim 1, wherein the at least one payload comprises one or more of cargo or weaponry.
11. The system according to claim 1, wherein the plurality of driving mechanisms comprises one or more drive belts, racks and pinions or other actuators.
12. A method of stowing and retrieving a payload comprising:
positioning a first pallet carrier at a predetermined position in a storage matrix to load or unload at least one payload associated with the first pallet carrier, the matrix having a plurality of storage spaces and being defined by a plurality of horizontal axes, including a plurality of axes extending in a first direction and a plurality of axes extending in a second direction generally perpendicular to the first direction, the matrix comprising a plurality of pallet carriers each being moveable into and out of the plurality of storage spaces within the matrix, each of the pallet carriers being capable of supporting and storing at least one payload and configured to slide bi-directionally along the plurality of horizontal axes in sequentially coordinated movement with stored payloads supported on other of the plurality of pallet carriers whereby stored payloads on the pallet carriers are moved between the plurality of stored spaces to permit movement of a stored payload on another pallet carrier; and
sliding a selected number of the plurality of pallet carriers in coordinated sequential movement to move a second pallet carrier to the predetermined position to load or unload at least one payload associated with the second pallet carrier.
13. The method according to claim 12, wherein the matrix comprises at least one vacant storage space configured to the size of at least one of the plurality of pallet carriers.
14. The method according to claim 12, wherein the plurality of pallet carriers comprise friction reducing members.
15. The method according to claim 14, wherein the friction reducing members include rollers.
16. The method according to claim 12, wherein the plurality of pallet carriers are dimensioned according to predetermined standards.
17. The method according to claim 16, wherein the predetermined standards include substantially rectangular shapes.
18. The method according to claim 12, wherein the sliding of the plurality of pallet carriers is provided by a plurality of driving mechanisms associated with the plurality of pallet carriers configured to slide each of the plurality of pallet carriers along the plurality of horizontal axes of the matrix.
19. The method according to claim 12, wherein the plurality of driving mechanisms comprises one or more drive belts, racks and pinions or other actuators.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
What is claimed is:
1. A mounting structure for a semiconductor device, comprising:
a substrate which has a first surface and a plurality of pads on said first surface;
a semiconductor device which has first and second main surfaces and a plurality of terminals on said second main surface at locations corresponding to said pads;
a plurality of connecting members which connect said pads to said terminals, respectively; and
a member which has at least one surface which is coupled with said first main surface, wherein the thermal expansion coefficient of said member is equal to, or substantially equal to, that of said substrate.
2. The mounting structure for a semiconductor device as claimed in claim 1, wherein said member comprises a metal plate.
3. The mounting structure for a semiconductor device as claimed in claim 1, wherein said member comprises an organic substrate.
4. The mounting structure for a semiconductor device as claimed in claim 1, wherein said substrate is a printed wiring substrate and said member is made of copper or brass.
5. The mounting structure for a semiconductor device as claimed in claim 1, wherein said substrate is a ceramic substrate and said member is made of aluminum nitride, alumina ceramic or tungsten.
6. The mounting structure for a semiconductor device as claimed in claim 1, wherein said member is strong enough to cause said semiconductor device to expand according to the thermal expansion of said member.
7. The mounting structure for a semiconductor device as claimed in claim 1, wherein said member and said semiconductor device are coupled with each other with a bonding strength sufficient to cause said semiconductor device to expand and contract according to the thermal expansion of said member.
8. The mounting structure for a semiconductor device as claimed in claim 1, further comprising an adhesive layer which is provided between said semiconductor device and said member and which makes said semiconductor device adhere to said member.
9. The mounting structure for a semiconductor device as claimed in claim 1, wherein said member is a heat sink.
10. The mounting structure for a semiconductor device as claimed in claim 1, wherein said member is a cap which encapsulates said semiconductor device together with said substrate.
11. A mounting structure for a semiconductor device, comprising:
a substrate which has a first surface and a plurality of pads on said first surface;
a semiconductor device which has first and second main surfaces and a plurality of terminals on said second main surface at locations corresponding to said pads;
a plurality of connecting members which connect said pads with said terminals, respectively;
a plate which is coupled to said first main surface and has a thermal expansion coefficient equal to, or substantially equal to, that of said substrate; and
a cooling member which is thermally coupled to said plate.
12. The mounting structure for a semiconductor device as claimed in claim 11, further comprising an attaching member on said plate for thermally attaching said cooling member to said member.
13. The mounting structure for a semiconductor device as claimed in claim 12, wherein said attaching member comprises a screw hole bored in said plate and a screw inserted in said screw hole.
14. The mounting structure for a semiconductor device as claimed in claim 12, wherein said attaching member comprises a stud.
15. A method for mounting a member and a semiconductor device on a substrate, wherein said member has at least one surface and has a thermal expansion coefficient which is equal to, or substantially equal to, that of said substrate, comprising:
coupling a surface of said member with the upper surface of said semiconductor device;
positioning said semiconductor device so that terminals on a lower surface of said semiconductor device face pads on an upper surface of said substrate through connecting members, respectively; and
heating said semiconductor device, said member, and said substrate to melt said connecting members, and thereafter, returning them back to an ordinary temperature.
16. The method of mounting a semiconductor device as claimed in claim 13,
wherein said member is coupled with said semiconductor device by an adhesive during said coupling step.
17. The method of mounting a semiconductor device as claimed in claim 13, further comprising:
mounting a cooling member on said member.