What is claimed is:
1. An isolated nucleic acid molecule comprising a polynucleotide having a nucleotide sequence at least 95% identical to a sequence selected from the group consisting of:
(a) a polynucleotide fragment of SEQ ID NO:X or a polynucleotide fragment of the cDNA sequence included in ATCC Deposit No:Z, which is hybridizable to SEQ ID NO:X;
(b) a polynucleotide encoding a polypeptide fragment of SEQ ID NO:Y or a polypeptide fragment encoded by the cDNA sequence included in ATCC Deposit No:Z, which is hybridizable to SEQ ID NO:X;
(c) a polynucleotide encoding a polypeptide domain of SEQ ID NO:Y or a polypeptide domain encoded by the cDNA sequence included in ATCC Deposit No:Z, which is hybridizable to SEQ ID NO:X;
(d) a polynucleotide encoding a polypeptide epitope of SEQ ID NO:Y or a polypeptide epitope encoded by the cDNA sequence included in ATCC Deposit No:Z, which is hybridizable to SEQ ID NO:X;
(e) a polynucleotide encoding a polypeptide of SEQ ID NO:Y or the cDNA sequence included in ATCC Deposit No:Z, which is hybridizable to SEQ ID NO:X, having biological activity;
(f) a polynucleotide which is a variant of SEQ ID NO:X;
(g) a polynucleotide which is an allelic variant of SEQ ID NO:X;
(h) a polynucleotide which encodes a species homologue of the SEQ ID NO:Y;
(i) a polynucleotide capable of hybridizing under stringent conditions to any one of the polynucleotides specified in (a)-(h), wherein said polynucleotide does not hybridize under stringent conditions to a nucleic acid molecule having a nucleotide sequence of only A residues or of only T residues.
2. The isolated nucleic acid molecule of claim 1, wherein the polynucleotide fragment comprises a nucleotide sequence encoding a secreted protein.
3. The isolated nucleic acid molecule of claim 1, wherein the polynucleotide fragment comprises a nucleotide sequence encoding the sequence identified as SEQ ID NO:Y or the polypeptide encoded by the cDNA sequence included in ATCC Deposit No:Z, which is hybridizable to SEQ ID NO:X.
4. The isolated nucleic acid molecule of claim 1, wherein the polynucleotide fragment comprises the entire nucleotide sequence of SEQ ID NO:X or the cDNA sequence included in ATCC Deposit No:Z, which is hybridizable to SEQ ID NO:X.
5. The isolated nucleic acid molecule of claim 2, wherein the nucleotide sequence comprises sequential nucleotide deletions from either the C-terminus or the N-terminus.
6. The isolated nucleic acid molecule of claim 3, wherein the nucleotide sequence comprises sequential nucleotide deletions from either the C-terminus or the N-terminus.
7. A recombinant vector comprising the isolated nucleic acid molecule of claim 1.
8. A method of making a recombinant host cell comprising the isolated nucleic acid molecule of claim 1.
9. A recombinant host cell produced by the method of claim 8.
10. The recombinant host cell of claim 9 comprising vector sequences.
11. An isolated polypeptide comprising an amino acid sequence at least 95% identical to a sequence selected from the group consisting of:
(a) a polypeptide fragment of SEQ ID NO:Y or the encoded sequence included in ATCC Deposit No:Z;
(b) a polypeptide fragment of SEQ ID NO:Y or the encoded sequence included in ATCC Deposit No:Z, having biological activity;
(c) a polypeptide domain of SEQ ID NO:Y or the encoded sequence included in ATCC Deposit No:Z;
(d) a polypeptide epitope of SEQ ID NO:Y or the encoded sequence included in ATCC Deposit No:Z;
(e) a secreted form of SEQ ID NO:Y or the encoded sequence included in ATCC Deposit No:Z;
(f) a full length protein of SEQ ID NO:Y or the encoded sequence included in ATCC Deposit No:Z;
(g) a variant of SEQ ID NO:Y;
(h) an allelic variant of SEQ ID NO:Y; or
(i) a species homologue of the SEQ ID NO:Y.
12. The isolated polypeptide of claim 11, wherein the secreted form or the full length protein comprises sequential amino acid deletions from either the C-terminus or the N-terminus.
13. An isolated antibody that binds specifically to the isolated polypeptide of claim 11.
14. A recombinant host cell that expresses the isolated polypeptide of claim 11.
15. A method of making an isolated polypeptide comprising:
(a) culturing the recombinant host cell of claim 14 under conditions such that said polypeptide is expressed; and
(b) recovering said polypeptide.
16. The polypeptide produced by claim 15.
17. A method for preventing, treating, or ameliorating a medical condition, comprising administering to a mammalian subject a therapeutically effective amount of the polypeptide of claim 11.
18. A method for preventing, treating, or ameliorating a medical condition, comprising administering to a mammalian subject a therapeutically effective amount of the polynucleotide of claim 1.
19. A method of diagnosing a pathological condition or a susceptibility to a pathological condition in a subject comprising:
(a) determining the presence or absence of a mutation in the polynucleotide of claim 1; and
(b) diagnosing a pathological condition or a susceptibility to a pathological condition based on the presence or absence of said mutation.
20. A method of diagnosing a pathological condition or a susceptibility to a pathological condition in a subject comprising:
(a) determining the presence or amount of expression of the polypeptide of claim 11 in a biological sample; and
(b) diagnosing a pathological condition or a susceptibility to a pathological condition based on the presence or amount of expression of the polypeptide.
21. A method for identifying a binding partner to the polypeptide of claim 11 comprising:
(a) contacting the polypeptide of claim 11 with a binding partner; and
(b) determining whether the binding partner effects an activity of the polypeptide.
22. The gene corresponding to the cDNA sequence of SEQ ID NO:X.
23. A method of identifying an activity in a biological assay, wherein the method comprises:
(a) expressing SEQ ID NO:X in a cell;
(b) isolating the supernatant;
(c) detecting an activity in a biological assay; and
(d) identifying the protein in the supernatant having the activity.
24. The product produced by the method of claim 20.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An apparatus comprising:
a base configured to receive signals;
a first die including conductive paths at least partly through the first die;
a second die arranged in a stack with the first die and the base; and
a structure located in the stack and outside at least one of the first die and the second die and configured to transfer at least one subset of the signals between the base and at least one of the first die and the second die.
2. The apparatus of claim 1, wherein the first die is located between the base and the second die, the structure including a first structure portion and a second structure portion, the first structure portion being located at a first side of the first die and between the base and the second die, the second structure portion being located at a second side of the first die and between the base and the second die.
3. The apparatus of claim 1, wherein the structure includes an interposer located between the first die and the second die, the interposer including conductive paths coupled to the first die and the second die.
4. The apparatus of claim 1, wherein the structure includes a portion having conductive paths coupled to the second die, and the first die and the second being located between the base and the portion.
5. The apparatus of claim 1, wherein the base includes a substrate having an organic material and conductive paths through the organic material.
6. The apparatus of claim 1, wherein the base includes circuit components to perform signal filtering.
7. An apparatus comprising:
a base configured to receive signals; and
a first device including first conductive paths at least partly through the first device;
a second device; and
an interposer arranged in a stack with the base, the first device, and the second device, the interposer being located between the first and second devices and configured to transfer at least one subset of the signals to one of the first and second devices, the interposer including a first surface, a second surface opposite from the first surface, first conductive contacts located at the first surface and coupled to the first device, second conductive contacts located at the second surface and coupled to the second device, and second conductive paths coupling the first conductive contacts to the second conductive contacts.
8. The apparatus of claim 6 further comprising a first structure portion and a second structure portion, the first structure portion being located at a first side of the first device and including conductive paths coupled to the base and the interposer, the second structure portion being located at a second side of the first device and including conductive paths coupled to the base and the interposer.
9. The apparatus of claim 8, wherein the first device includes a first stack of dice and a second stack of dice arranged side by side with each other.
10. The apparatus of claim 9 further comprising a third structure portion located between the first stack of dice and the second stack of dice, the third structure portion including conductive paths coupled to the base and the interposer.
11. The apparatus of claim 8, wherein at least one of the first, second, and third structure portions is incorporate to a die of at least one of the first and second stack of dice.
12. The apparatus of claim 7, wherein the interposer includes a length measured between edges of the interposer, the length of the interposer is greater than a length of the first device.
13. The apparatus of claim 7, wherein the interposer includes a via extending from the first surface to the second surface, at least a portion of one of the second conductive paths passing through the via.
14. The apparatus of claim 7, wherein the interposer includes multiple layers, each of the multiple layers including at least one conductive potions coupled to at least one of second conductive paths to transfer a different subset of the signals.
15. The apparatus of claim 7, wherein the interposer includes a first conductive portion coupled to a first selected conductive path of the second conductive paths to transfer a first power signal having a positive value, and a second conductive potion coupled to a second selected conductive path of the second conductive paths to transfer a second power signal having a ground potential, at least one of the first and second conductive portions extending in a dimension perpendicular to the first and second selected conductive paths.
16. The apparatus of claim 15, wherein the first selected conductive path go through a via that only extends partly through the interposer.
17. The apparatus of claim 16, wherein the second selected conductive path go through an additional via that only extends partly through the interposer.
18. The apparatus of claim 17, wherein the first device include a conductive segment coupled to a selected conductive path of the first conductive paths to transfer a data signal, the conductive segment extending in a dimension perpendicular to the selected conductive path.
19. An apparatus comprising:
a base configured to receive signals; and
a first device including first conductive paths at least partly through the first device;
a second device arranged in a stack with the base and the first device, the first device being located between the base and the second device, the first device having a length less than a length of the second device; and
a structure configured to transfer at least one subset of the signals to the second device, the structure including a first structure portion located at a first side of the first device and a second structure portion located at a second side of the first device, each of the first and second structure portions including a first surface, a second surface opposite from the first surface, first conductive contacts located at the first surface and coupled to the base, second conductive contacts located at the second surface and coupled to the second device, and second conductive paths coupling the first conductive contacts to the second conductive contact.
20. The apparatus of claim 19, wherein the first structure portion includes a first via extending from the first surface to the second surface of first structure portion, at least a portion of one of the second conductive paths passing through the first via, and the second structure portion includes a second via extending from the first surface to the second surface of the second structure portion, at least a portion of one of the second conductive paths passing through the second via.
21. The apparatus of claim 19, wherein a height of the structure is equal to a height of the first device.
22. The apparatus of claim 19, wherein the first device includes a first stack of dice and a second stack of dice arranged side by side with each other.
23. The apparatus of claim 22, wherein the structure further includes a third structure portion located between the first stack of dice and the second stack of dice, third structure portion including conductive paths coupled to the base and the second device.
24. An apparatus comprising:
a base configured to receive signals; and
a first device including conductive paths at least partly through the first device;
a second device including a first surface, a second surface opposite from the first surface, first conductive contacts located at the first surface and coupled to the first device, and second conductive contacts located at the second surface; and
a structure including conductive paths configured to transfer at least one subset of the signals to the second device, the structure including a first structure portion arranged in a stack with the base, the first device, and the second device, the first and second devices being between the base and the first structure portion.
25. The apparatus of claim 24, wherein the structure further comprising a second structure portion and a third structure portion, the second structure portion being located at a first side of the first device and including conductive paths coupled to the base and the first structure portion, third structure portion being located at a second side of the first device and including conductive paths coupled to the base and the first structure portion.
26. The apparatus of claim 25, wherein each of the second and third structure portions includes a first surface, a second surface opposite from the first surface, third conductive contacts located at the first surface and coupled to the base, fourth conductive contacts located at the second surface and coupled to the first structure portion, and second conductive paths coupling the first conductive contacts to the second conductive contact.
27. The apparatus of claim 25, wherein the first device includes a first stack of dice and a second stack of dice arranged side by side with each other.
28. The apparatus of claim 27 further comprising a fourth structure portion located between the first stack of dice and the second stack of dice, fourth structure portion including conductive paths coupled to the base and the second device.
29. The apparatus of claim 24, wherein the first structure portion has a length greater than a length of the second device.
30. A system comprising:
a processor;
a memory device enclosed in an integrated circuit package with the processor and including a die with conductive paths at least partly through the die;
a base arranged in a stack with the memory device and the processor and configured to receive signals; and
a structure located in the stack and outside at least one of the processor and the memory device and configured to transfer at least one subset of the signals between the base and at least one of the processor and the memory device.
31. The system of claim 30, wherein the memory device includes a stack of dice.
32. The system of claim 30, wherein the integrated circuit package is coupled to an antenna.
33. A method comprising:
receiving signals at a base of an integrated circuit package, the integrated circuit package including a first device and a second device, the second device arranged in a stack with the first device and the base, the first device including at least one conductive path at least partly through the first device; and
transferring at least one subset of the signals from the base to the second device using conductive paths of a structure inside the stack and outside at least one of the first device and the second device, at least a portion of the conductive paths of the structure going through vias of the structure.
34. The method of claim 33, wherein transferring at least one subset of the signals includes transferring at least one data signal of the signals from the base to the second device and transferring at least one power signal of the signals from the base to the second device.
35. The method of claim 33, wherein transferring at least one subset of the signals includes transferring only power signals from the base to the second device.
36. The method of claim 33 further comprising:
transferring an additional subset of the signals from the base to the first device; and
transferring the additional subset of the signals from the first device to the second device.
37. The method of claim 36, wherein the additional subset of the signals excludes power signals.
38. The method of claim 36, wherein transferring the additional subset of the signals from the first device to the second device includes transferring the additional subset of the signals from the first device to a portion of the structure, and transferring the additional subset of the signals from the portion of the structure to the second device.
39. The method of claim 36, wherein transferring the additional subset of the signals from the first device to the second device includes transferring the additional subset of the signals through at least one vias of at least one stack of dice of the first device.
40. A method comprising:
arranging a first device in a stack with a second device, the first device including at least one conductive path at least partly through the first device; and
arranging a structure in the stack to transfer at least one subset of signals between a base and at least one of the first and second devices, the structure including conductive paths to transfer the signals, at least a portion of the conductive paths going through vias of the structure.
41. The method of claim 40, wherein arranging the structure includes placing a portion of the structure between the first and second devices.
42. The method of claim 40, wherein arranging the structure includes placing a first portion of the structure at a first side of the first device and placing a second portion of the structure at a second side of the first device.
43. The method of claim 40, wherein arranging the structure includes placing the first and second devices between a portion of the structure and the base.