1. A method of coupling light from a connector to a mating optical component, said connector having an end face and defining a cavity at said end face, said connector holding at least one optical component with a light exchanging face, said connector holding a converging lens positioned between said light exchanging face and said end face, said method comprising:
transmitting a light beam through said optical component such that it emanates from said light exchanging face;
imaging said light beam emanating from said light exchanging face to an image point using said converging lens, said point being positioned in said cavity at said end face; and
coupling said light beam from said converging lens to said mating optical component.
2. The method of claim 1, wherein said mating optical component has a light exchanging face that is essentially disposed at said end face.
3. The method of claim 1, wherein said mating optical component has a light exchanging face that is disposed at a distance from said end face and wherein a second converging lens is disposed between said end face and said mating optical component.
4. The method of claim 1, wherein said optical component is a fiber.
5. The method of claim 4, wherein said connector comprises a multi-fiber ferrule.
6. The method of claim 5, wherein said ferrule comprises an MT-type ferrule.
7. The method of claim 5, wherein said ferrule is a lensed ferrule comprising said converging lens.
8. The method of claim 1, wherein said converging lens comprises a discrete lens for each optical component.
9. The method of claim 1, wherein said converging lens comprises a refractive lens.
10. The method of claim 1, wherein said optical component is an optical waveguide.
11. A method of coupling light from a mating optical component to a connector, said connector having an end face and defining a cavity at said end face, said connector holding at least one optical component with a light exchanging face, said connector holding a converging lens positioned between said light exchanging face and said end face, said method comprising:
receiving a light beam from said mating optical component, said light beam presented as an image point in said cavity at said end face; and
converging said light beam to a point on said light exchanging face using said converging lens.
12. The method of claim 11, wherein said mating optical component has a light exchanging face that is essentially disposed at said end face.
13. The method of claim 11, wherein said mating optical component has a light exchanging face that is at a distance from said end face and wherein a second converging lens is disposed between said end face and said mating optical component.
14. The method of claim 11, wherein said optical component is a fiber.
15. The method of claim 14, wherein said connector comprises a multi-fiber ferrule.
16. The method of claim 15, wherein said ferrule comprises an MT-type ferrule.
17. The method of claim 15, wherein said ferrule is a lensed ferrule comprising said converging lens.
18. The method of claim 11, wherein said converging lens comprises a discrete lens for each optical component.
19. The method of claim 11, wherein said converging lens comprises a refractive lens.
20. The method of claim 11, wherein said optical component is an optical waveguide.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. An epoxy resin composition for semiconductor encapsulation, comprising at least one epoxy resin, at least one curing agent, at least one filler, and at least one first curing accelerator, the first curing accelerator including a reaction product of the at least one curing agent with a compound selected from a tetracyanoethylene, a 7,7,8,8-tetracyanoquinodimethane, a compound having the chemical structure of Formula 1, or a mixture thereof,
wherein each of R1 through R7, independently, represents a hydrogen atom or a C1-C12 hydrocarbon group, provided that when R1 through R7 are C1-C12 hydrocarbon groups, R1 and R2, R2 and R3, R3 and R4, R4 and R5, R5 and R6, and R6 and R7 can be joined to each other to form a cyclic structure.
2. The epoxy resin composition as claimed in claim 1, wherein the first curing accelerator includes a reaction product of the at least one curing agent with a mixture of at least two compounds having the chemical structure of Formula 1.
3. The epoxy resin composition as claimed in claim 1, wherein the first curing accelerator includes a reaction product of the at least one curing agent with a mixture of tetracyanoethylene and 7,7,8,8-tetracyanoquinodimethane.
4. The epoxy resin composition as claimed in claim 1, wherein the first curing accelerator is present in the epoxy resin composition in an amount of about 0.1% to about 10% by weight of the epoxy resin composition.
5. The epoxy resin composition as claimed in claim 1, wherein the reaction product of the at least one curing agent with the compound selected from a tetracyanoethylene, a 7,7,8,8-tetracyanoquinodimethane, a compound having the chemical structure of Formula 1, or a mixture thereof, is present in the first curing accelerator in an amount of about 5% to about 95% by weight of the total curing accelerator.
6. The epoxy resin composition as claimed in claim 1, wherein the epoxy resin includes a biphenyl type epoxy resin having a chemical structure represented by Formula 4, wherein n is in a range of 0 to 7;
7. The epoxy resin composition as claimed in claim 6, wherein the biphenyl type epoxy resin is present in the epoxy resin composition in an amount of at least about 40% by weight of the total epoxy resin.
8. The epoxy resin composition as claimed in claim 6, wherein the biphenyl type epoxy resin is present in the epoxy resin composition in an amount of at least about 70% by weight of the total epoxy resin.
9. The epoxy resin composition as claimed in claim 1, wherein the filler includes silica in an amount of about 40% by weight of the total filler.
10. The epoxy resin composition as claimed in claim 9, wherein the silica includes about 50% to about 99% by weight of spherical fused silica having an average particle diameter of about 5 \u03bcm to about 30 \u03bcm, and about 1% to about 50% by weight of spherical fused silica having an average particle diameter of about 1 \u03bcm or less.
11. The epoxy resin composition as claimed in claim 1, wherein the filler is present in the epoxy resin composition in an amount of about 70% to about 95% by weight of the epoxy resin composition.
12. A semiconductor device encapsulated with the epoxy resin composition as claimed in claim 1.
13. An epoxy resin composition for semiconductor encapsulation, comprising at least one epoxy resin, at least one curing agent, at least one filler, and at least one first curing accelerator, the first curing accelerator including a reaction product of a second curing accelerator with a tetracyanoethylene, a 7,7,8,8-tetracyanoquinodimethane, a compound having the chemical structure of Formula 1, or a mixture thereof,
wherein each of R1 through R7, independently, represents a hydrogen atom or a C1-C12 hydrocarbon group, provided that when R1 through R7 are C1-C12 hydrocarbon groups, R1 and R2, R2 and R3, R3 and R4, R4 and R5, R5 and R6, and R6 and R7 can be joined to each other to form a cyclic structure.
14. The epoxy resin composition as claimed in claim 13, wherein the second curing accelerator is a triphenylphosphine or a triphenylphosphine derivative.
15. The epoxy resin composition as claimed in claim 14, wherein the triphenylphosphine derivative is triphenylphosphine oxide, butyltriphenylphosphonium bromide, triphenylphosphine triphenylborane, or a mixture thereof.
16. The epoxy resin composition as claimed in claim 13, wherein the reaction product included in the first curing accelerator is a reaction product of the second curing accelerator with at least one curing agent and with the compound selected from a tetracyanoethylene, a 7,7,8,8-tetracyanoquinodimethane, a compound having the chemical structure of Formula 1, or a mixture thereof.
17. An epoxy resin composition for semiconductor encapsulation, comprising at least one epoxy resin, at least one curing agent, at least one filler, and at least one first curing accelerator, the first curing accelerator including a tetracyanoethylene, a 7,7,8,8-tetracyanoquinodimethane, a compound having the chemical structure of Formula 1, or a mixture thereof,
wherein each of R1 through R7, independently, represents a hydrogen atom or a C1-C12 hydrocarbon group, provided that when R1 through R7 are C1-C12 hydrocarbon groups, R1 and R2, R2 and R3, R3 and R4, R4 and R5, R5 and R6, and R6 and R7 can be joined to each other to form a cyclic structure, and
wherein the curing agent includes a phenolaralkyl type phenolic resin having a chemical structure represented by Formula 6, wherein n is in a range of 1 to 7,
18. The epoxy resin composition as claimed in claim 17, wherein the phenolaralkyl type phenolic resin is present in the epoxy resin composition in an amount of about 20% by weight of the total curing agent.
19. The epoxy resin composition as claimed in claim 17, wherein the phenolaralkyl type phenolic resin is present in the epoxy resin composition in an amount of about 30% of the total curing agent.