1-35. (canceled)
36. A coated article comprising:
a glass substrate;
an anti-etch layer comprising zirconium oxycarbide andor tin oxycarbide supported by the glass substrate, wherein the anti-etch layer is resistant to at least some fluoride-based glass etchants; and
a layer comprising diamond-like carbon (DLC) provided on the glass substrate over at least the anti-etch layer.
37. The coated article of claim 36, wherein an interlayer comprising silicon oxide andor silicon nitride is provided between the anti-etch layer and the glass substrate.
38. The coated article of claim 37, wherein the interlayer comprising silicon oxide andor silicon nitride is from about 100 to 400 \u212b thick.
39. The coated article of claim 36, wherein the anti-etch layer is located directly on and contacting the glass substrate.
40. The coated article of claim 36, wherein the coated article has a visible transmission of from about 10 to 90%.
41. The coated article of claim 36, wherein the anti-etch layer is at least about 2,500 \u212b thick.
42. A coated article comprising:
a substrate; and
an anti-etch layer comprising zirconium oxycarbide andor tin oxycarbide supported by the substrate, wherein the anti-etch layer is resistant to at least some fluoride-based glass etchants.
43-45. (canceled)
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
What is claimed is:
1. A method for producing a thin-film structure comprising the steps of:
forming on a substrate a thin film made of an amorphous matieral having an supercooled liquid phase region,
heating the thin film to a temperature within the supercooled liquid phase region and thereby deforming the thin film in a given shape, and
cooling the thin film to room temperature from the temperature within the supercooled liquid phase region to stop deforming the thin film and thereby forming the thin film-structure, wherein the thin film is deformed by its weight to from the thin film-structure.
2. A method for producing a thin film-structure as defined in claim 1, wherein the thin film is deformed by mechanical external force to form the thin film-structure.
3. A method for producing a thin film-structure as defined in claim 1, wherein the thin film is deformed by electrostatic external force to form the thin film-structure.
4. A method for producing a thin film-structure as defined in claim 1, wherein the thin film is deformed by a magnetic external force to form the thin film-structure.
5. A method for producing a thin film-structure as defined in claim 4, wherein a magnetic layer made of a magnetic material is formed nearby the thin film, an opposite magnetic being formed opposing to the magnetic layer, and the thin film is deformed by the magnetic external force generated between the magnetic layer and the opposite electrode.