1. A method of manufacturing an integrated circuit, comprising:
providing a substrate having trenches with first and second sidewalls facing each other and a conductive line arranged in a bottom region of the trenches, at least the bottom region of the trenches being lined with an insulative material between the conductive line and the substrate,
forming a first sacrificial layer above the conductive line adjacent the first and second sidewalls;
filling the trenches with one or more additional sacrificial layers having a different etch selectivity than the first sacrificial layer; and
removing a portion of the one or more additional sacrificial layers and a portion of the insulative material selectively to the first sacrificial layer so that the substrate is exposed below the first sacrificial layer along the first trench sidewalls and covered by the insulative material along the second trench sidewalls.
2. The method of claim 1, wherein the first sacrificial layer comprises SiN.
3. The method of claim 1, wherein the one or more additional sacrificial layers comprises TiN.
4. The method of claim 1, further comprising:
forming an amorphous silicon layer adjacent the one or more additional sacrificial layers in an upper portion of the trenches;
implanting the amorphous silicon layer in a direction toward the second trench sidewalls; and
removing an un-implanted portion of the amorphous silicon layer along the first trench sidewalls to form a single-sided transfer structure;
5. The method of claim 4, wherein removing a portion of the one or more additional sacrificial layers and a portion of the insulative material selectively to the first sacrificial layer comprises:
removing the one or more additional sacrificial layers along the first sidewalls using the single-sided transfer structure as a mask so that the second sidewalls remain covered by the one or more additional sacrificial layers; and
exposing the substrate below the first sacrificial layer along the first trench sidewalls.
6. The method of claim 1, wherein removing a portion of the one or more additional sacrificial layers and a portion of the insulative material selectively to the first sacrificial layer comprises:
forming an amorphous silicon layer adjacent the first sacrificial layer in an upper portion of the trenches;
implanting the amorphous silicon layer in a direction toward the second trench sidewalls;
removing an un-implanted portion of the amorphous silicon layer along the first trench sidewalls;
removing a first one of the additional sacrificial layers along the first sidewalls so that the first one of the additional sacrificial layers is protected along the second sidewalls by a second one of the additional sacrificial layers and the implanted portion of the amorphous silicon layer; and
exposing the substrate below the first sacrificial layer along the first trench sidewalls so that the insulative material is protected along the second sidewalls by the remaining portion of the first additional sacrificial layer.
7. The method of claim 6, wherein exposing the substrate below the first sacrificial layer along the first trench sidewalls comprises removing the insulative material along the first trench sidewalls between the first sacrificial layer and the conductive line to expose the substrate.
8. The method of claim 1, wherein the one or more additional sacrificial layers comprises a carbon-based material.
9. The method of claim 8, wherein removing a portion of the one or more additional sacrificial layers and a portion of the insulative material selectively to the first sacrificial layer comprises:
forming a liner on the carbon-based material in an upper part of the trenches;
doping the liner in a direction toward the second sidewalls;
removing an un-doped portion of the liner;
etching the carbon-based material in an anisotropic direction into the trenches using the doped portion of the liner as a mask to expose an upper part of the conductive line near the first trench sidewalls;
removing the upper part of the conductive line near the first trench sidewalls so that a portion of the insulative material is exposed; and
removing the exposed portion of the insulative material.
10. The method of claim 9, wherein forming a liner on the carbon-based material in an upper part of the trenches comprises:
recessing the carbon-based material into a depth of the trenches; and
forming a SiN liner on the recessed carbon-based material.
11. The method of claim 9, further comprising removing the remainder of the carbon-based material from the trenches after the upper part of the conductive line is removed.
12. The method of claim 1, further comprising forming an electrical connection between the conductive line and the exposed portion of the substrate.
13. The method of claim 12, wherein forming the electrical connection comprises:
filling a conductive material into the removed portion of the one or more additional layers and the removed portion of the insulative material; and
recessing the conductive material.
14. A method of manufacturing a memory array comprising an array of transistors with an upper sourcedrain region, a lower sourcedrain region and a channel region disposed between the upper and lower sourcedrain regions, the transistors separated from each other by trenches, the method comprising:
forming a bit line in a bottom region of at least one of the trenches arranged in a substrate, the at least one trench having an encapsulation layer disposed between the bit line and the substrate;
forming a protection liner above the bit line on sidewalls of the at least one trench;
filling the at least one trench with a sacrificial material;
recessing the sacrificial material into the at least one trench;
depositing a silicon-based layer in the recess;
single-sided structuring the silicon-based layer;
etching the sacrificial material using the structured silicon-based layer as a mask to expose the protection liner along one of the sidewalls and an upper portion of the bit line;
removing a portion of the encapsulation layer below the exposed protection liner to expose the lower sourcedrain region of at least one of the transistors; and
forming an electrical connection between the bit line and the lower sourcedrain region of at least one of the transistors.
15. The method of claim 14, wherein single-sided structuring the silicon-based layer comprises implanting the silicon-based layer in a direction toward one of the sidewalls of the at least one trench.
16. The method of claim 14, wherein etching the sacrificial material using the structured silicon-based layer as a mask comprises etching the sacrificial material in an anisotropic direction into the at least one trench using the structured silicon-based layer as a mask.
17. A method of manufacturing an integrated circuit, comprising:
providing a substrate with a trench filled to a recess depth, the filled trench comprising an encapsulation layer disposed between a conductive line arranged in a bottom region of the trench and sidewalls of the trench, a protection liner arranged adjacent to the encapsulation layer above the conductive line, and a fill material arranged adjacent to the protection liner above the conductive line;
forming a single-sided structure from a silicon-based layer deposited on the substrate;
forming a single-sided recess in the trench using the single-sided structure as a mask, the single-sided recess extending vertically into the trench to the conductive line;
removing a portion of the encapsulation layer through the single-sided recess to expose a portion of the substrate below the protection liner; and
forming a connection element in the single-sided recess, the connection element electrically connecting the conductive line and the substrate.
18. The method of claim 17, wherein forming the single-sided structure comprises:
implanting ions at an oblique angle into the silicon-based layer to form implanted and un-implanted regions of the silicon-based layer at the bottom of the recess; and
removing the un-implanted region of the silicon-based layer.
19. The method of claim 17, wherein forming the single-sided structure comprises:
forming a transfer spacer on sidewalls of the protection liner; and
filling the trench with the fill material.
20. A precursor structure, comprising:
a trench formed in the substrate, the trench having sidewalls and a bottom region;
an encapsulation layer arranged along the sidewalls;
a conductive line arranged in the bottom region of the trench adjacent to the encapsulation layer;
a protection liner arranged adjacent to the encapsulation layer above the conductive line;
an opening in the encapsulation layer arranged along one of the trench sidewalls below the protection liner; and
an electrical connection formed between the substrate and the conductive line through the opening in the encapsulation layer.
21. The semiconductor substrate of claim 20, wherein the semiconductor substrate further comprises a single-sided structure arranged adjacent a recess formed in the trench, the recess vertically extending along one of the trench sidewalls to the conductive line, the single-sided structure covering the encapsulation layer arranged adjacent the opposing trench sidewall.
22. The semiconductor substrate of claim 20, wherein the single-sided structure comprises a carbon-based material.
23. The semiconductor substrate of claim 20, wherein the trench has an aspect ratio greater than or equal to approximately 6.0.
The claims below are in addition to those above.
All refrences to claim(s) which appear below refer to the numbering after this setence.
1. A method for generating a message that is intended to be sent to a destination, comprising:
sending an address parameter, that corresponds to the destination, to a printer unit;
printing on a sheet of paper, using the printer unit, a position-coding pattern and said address parameter;
generating an information sequence by writing on the sheet of paper with a drawing device, the drawing device being capable of detecting positions on the sheet of paper by reading the position-coding pattern;
recording the address parameter from the printed sheet using the drawing device; and
generating the message based on the recorded address parameter and the information sequence.
2. A method according to claim 1, wherein the address parameter includes at least information corresponding to an address in an e-mail system.
3. A method according to claim 1, wherein the address parameter includes at least a reference identity, that identifies an address in a server unit.
4. A method according to any one of the preceding claims, wherein the message is a reply to an incoming message and wherein the address parameter corresponds to the address of at least the sender of the incoming message.
5. A method according to claim 4, further comprising:
printing the contents of the incoming message on the sheet of paper in addition to the position-coding pattern and the address parameter.
6. A method according to claim 5, further comprising:
recording the positional relationship on the sheet of paper between the contents of the incoming message and the information sequence; and
wherein the contents of in the incoming message are included in the generated message with said positional relationship retained.
7. A method according to claim 1, in which the message is intended to be sent to a user-defined subset of a group of recipients and in which the identities of this group of recipients are printed out on the sheet of paper.
8. A method according to claim 1, further comprising:
combining, in the drawing device, the recorded address parameter and the information sequence; and
wherein the message is generated based on the combined information.
9. A method according to claim 8, further comprising:
generating and storing the message in the drawing device; and
subsequently sending the message when the drawing device makes contact with a network.
10. A method according to claim 1, further comprising:
transmitting the recorded address parameter and the information sequence from the drawing device to a server unit; and
wherein the message is generated in the server unit.
11. A computer readable medium encoded with computer executable instructions for generating a message that is intended to be sent to a destination, the instructions causing a computer system to execute the steps of:
sending an address parameter, that corresponds to the destination, to a printer unit to be printed along with a position-coding pattern on a sheet of paper;
receiving an information sequence generated by writing on the sheet of paper with a drawing device, the drawing device being capable of detecting positions on the sheet of paper by reading the position-coding pattern;
receiving the address parameter from the drawing device after having been read from the printed sheet of paper; and
generating the message based on the read address parameter and the information sequence.
12. A computer readable medium having encoded with computer executable instructions for generating a message, which is a reply to an incoming message and which is intended to be sent to a destination, the instructions causing a computer system to execute the steps of:
sending an address parameter, that corresponds to an address of a sender of the incoming message, and the contents of the incoming message to a printer unit to be printed along with a position-coding pattern on a sheet of paper;
receiving an information sequence generated by writing on the sheet of paper with a drawing device, the drawing device being capable of detecting positions on the sheet of paper by reading the position-coding pattern;
receiving the address parameter from the drawing device after being read by the drawing device from the printed sheet of paper and
generating the message based on the read address parameter and the information sequence.
13. A method for generating a message, which is a reply to an incoming message and which is intended to be sent to a destination, comprising:
sending an address parameter, that corresponds to an address of a sender of the incoming message, to a printer unit;
printing, using the printer unit, a position-coding pattern, the contents of the incoming message, and said address parameter on a sheet of paper;
generating an information sequence by writing on the sheet of paper with a drawing device, the drawing device being capable of detecting positions on the sheet of paper by reading the position-coding pattern;
recording the address parameter printed on the sheet of paper using the drawing device; and
generating the message based on the recorded address parameter and the information sequence.
14. Method according to claim 13, wherein printing the position-coding pattern, the contents of the incoming message, and the address parameter comprises:
printing a message box containing the contents of the incoming message, and a reply box on the sheet of paper; and
wherein the information sequence is at least partly generated by the user writing within the reply box with the drawing device.
15. Method according to claim 14, wherein the message box and the reply box are visually separated.
16. Method according to claim 13, further comprising:
recording the positional relationship on the sheet of paper between the contents of the incoming message and the information sequence; and
wherein the generated message includes the contents of the incoming message with said positional relationship retained.
17. Method according to any of claims 13\u201316, wherein the address parameter further corresponds to other recipients of the incoming message; and
wherein the printed sheet includes the other recipients of the incoming message.
18. An electronic mail client for installation on a device for communicating with a mail server located in any domain on the Internet, said device being connected to the Internet, a printer unit, and an electronic display, said electronic mail client causing a computer system to execute the steps of:
displaying on the electronic display, upon receipt of an incoming electronic mail message from the mail server, an incoming electronic mail message;
displaying on the electronic display an option for generating, based on the incoming electronic mail message, an electronic reply message including handwritten information; and
sending, upon detection of selection of said option, an address parameter corresponding to an Internet mail address of the sender of the incoming electronic mail message to a printer unit to be printed, along with a position-coding pattern, on a sheet of paper; and
generating the electronic reply message based on information obtained from the printed sheet using a drawing device, the drawing device being capable of detecting positions on the printed sheet by reading the position-coding pattern.
19. The electronic mail client according to claim 18, wherein generating the electronic reply message comprises:
receiving an information sequence generated by writing on the printed sheet with the drawing device;
receiving the address parameter from the drawing device after being read from the printed sheet; and
wherein the generated electronic reply message is based on the information sequence and the read address parameter, upon receipt thereof from the drawing device, to form said electronic reply message including handwritten information.
20. The electronic mail client according to claim 19, further comprising:
sending the contents of the incoming electronic mail message to the printer unit to be printed along with the address parameter and the position-coding pattern on the sheet of paper.
21. The electronic mail client according to claim 20, further comprising:
storing the contents of the incoming electronic mail message in a memory associated with said device;
retrieving the contents of the incoming electronic mail message from the memory, upon receipt of the information sequence and the read address parameter from the drawing device; and
wherein the generated electronic reply message includes the contents of the incoming electronic mail message.
22. The electronic mail client according to claim 21, further comprising:
associating the position-coding pattern with said contents of the incoming electronic mail message to control the printer unit to print said contents in a given positional relationship to said position-coding pattern; and
wherein said positional relationship is retained in the generated electronic reply message.
23. The electronic mail client according to claim 18, further comprising:
extracting the address parameter from the incoming electronic mail message as received from the mail server.
24. The electronic mail client according to claim 23, wherein generating the electronic reply message comprises:
receiving, from the drawing device, an information sequence generated by writing on the printed sheet with the drawing device;
receiving the address parameter from the drawing device after being read from the printed sheet;
sending the information sequence and the read address parameter, upon receipt thereof to the mail server; and
wherein the electronic reply message is generated in the mail server.
25. The electronic mail client according to claim 24, further comprising:
sending the contents of the incoming electronic mail message to the printer unit to be printed along with the address parameter and the position-coding pattern on the sheet of paper.
26. The electronic mail client according to claim 25, further comprising:
associating said position-coding pattern with said contents of the incoming electronic mail message to control the printer unit to print said contents in a given positional relationship to said position-coding pattern, so that said information sequence is generated with said given positional relationship to said contents; and
sending the information sequence to the mail server with said positional relationship retained.
27. The electronic mail client according to any one of claims 19\u201326, wherein the address parameter is a reference identity of the position-coding pattern to be printed on said the sheet of paper.
28. The electronic mail client according to claim 27, wherein the reference identity corresponds to a range of positions coded by the position-coding pattern to be printed on the sheet of paper.
29. The electronic mail client according to any one of claims 19\u201326, wherein the address parameter is a reference identity that identifies said Internet mail address in the device or in the mail server.
30. The electronic mail client according to claim 18, further comprising:
transmitting the contents of the incoming electronic mail message to the drawing device.
31. The electronic mail client according to claim 30, wherein transmitting the contents of the incoming electronic mail message includes sending said contents to the printer unit to be printed along with the address parameter and position-coding pattern on the sheet of paper in a format that the drawing device is capable of reading.
32. The electronic mail client according to claim 18, wherein the address parameter includes said Internet mail address.
33. The electronic mail client according to claim 32, wherein the printer unit is controlled to print said Internet mail address in alpha-numeric format on the sheet of paper.
34. The electronic mail client according to claim 32, wherein the printer unit is controlled to print said Internet mail address on said sheet of paper in a coded format that the drawing device is capable of reading.
35. The electronic mail client according to claim 18, wherein generating the electronic reply message comprises:
generating an information sequence by writing on the printed sheet with the drawing device;
reading the address parameter from the printed sheet with the drawing device;
converting the information sequence and the read address parameter into the electronic reply message; and
sending the electronic reply message to the mail server for delivering to the destination.